摘要:
A cross-flow heat exchanger, method of making a cross-flow heat exchanger, and a dehumidifier are provided. The cross-flow heat exchanger has an axial flow path extending through the heat exchanger from an inlet to an outlet and a transverse flow path oriented transversely to the axial flow path and extending through the heat exchanger from an inlet to an outlet. The transverse flow path is adjacent to and separate from the axial flow path. The surface area of the inlet of the axial flow path is less than the surface area of the outlet of the axial flow path. In a preferred embodiment, the heat exchanger has an exterior shape that is trapezoidal.
摘要:
A cross-flow heat exchanger, method of making a cross-flow heat exchanger, and a dehumidifier are provided. The cross-flow heat exchanger has an axial flow path extending through the heat exchanger from an inlet to an outlet and a transverse flow path oriented transversely to the axial flow path and extending through the heat exchanger from an inlet to an outlet. The transverse flow path is adjacent to and separate from the axial flow path. The surface area of the inlet of the axial flow path is less than the surface area of the outlet of the axial flow path. In a preferred embodiment, the heat exchanger has an exterior shape that is trapezoidal.
摘要:
A dehumidification apparatus comprises an air inlet configured to receive an inlet airflow that is separated into a process airflow and a bypass airflow. An evaporator unit is operable to cool the process airflow by facilitating heat transfer from the process airflow to a flow of refrigerant as the process airflow passes through the evaporator unit. A condenser unit operable to (1) reheat the process airflow by facilitating heat transfer from the flow of refrigerant to the process airflow as the process airflow passes through a first portion of the condenser unit, and (2) heat the bypass airflow by facilitating heat transfer from the flow of refrigerant to the bypass airflow as the bypass airflow passes through a second portion of the condenser unit. The process airflow is discharged into the structure via a process airflow outlet and the bypass airflow is discharged into the structure via a bypass airflow outlet.
摘要:
A dehumidification apparatus comprises an air inlet configured to receive an inlet airflow that is separated into a process airflow and a bypass airflow. An evaporator unit is operable to cool the process airflow by facilitating heat transfer from the process airflow to a flow of refrigerant as the process airflow passes through the evaporator unit. A condenser unit operable to (1) reheat the process airflow by facilitating heat transfer from the flow of refrigerant to the process airflow as the process airflow passes through a first portion of the condenser unit, and (2) heat the bypass airflow by facilitating heat transfer from the flow of refrigerant to the bypass airflow as the bypass airflow passes through a second portion of the condenser unit. The process airflow is discharged into the structure via a process airflow outlet and the bypass airflow is discharged into the structure via a bypass airflow outlet.
摘要:
A method of performing immersion lithography on a semiconductor substrate includes providing a layer of resist onto a surface of the semiconductor substrate and exposing the resist layer using an immersion lithography exposure system. The immersion lithography exposure system utilizes a fluid during exposure and may be capable of removing some, but not all, of the fluid after exposure. After exposure, a treatment process is used to neutralize the effect of undesired elements that diffused into the resist layer during the immersion exposure. After treatment, a post-exposure bake and a development step are used.
摘要:
A method of performing immersion lithography on a semiconductor wafer is provided. The method includes providing a layer of resist onto a surface of the semiconductor wafer. Next, an edge-bead removal process spins the wafer at a speed greater than 1000 revolutions per minute and dispenses solvent through a nozzle while the wafer is spinning. Then, the resist layer is exposed using an immersion lithography exposure system.
摘要:
Provided is an exposure apparatus including a variable focusing device. The variable focusing device may include a transparent membrane that may be deformed in the presence of an electric field. The deformation of the transparent membrane may allow the focus length of a radiation beam to be modified. In an embodiment, the variable focusing device may be modulated such that a radiation beam having a first focus length is provided for a first position on an exposure target and a radiation beam having a second focus length is provided for a second position on the exposure target. A method and computer-readable medium are also provided.