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公开(公告)号：US20120057428A1
公开(公告)日：2012-03-08
申请号：US13279110
申请日：2011-10-21
申请人： Donald F. Specht , Kenneth D. Brewer , David M. Smith , Sharon L. Adam , John P. Lunsford , David J. Specht
发明人： Donald F. Specht , Kenneth D. Brewer , David M. Smith , Sharon L. Adam , John P. Lunsford , David J. Specht
IPC分类号： G01N29/30
CPC分类号： A61B8/587 , A61B8/00 , A61B8/4218 , A61B8/4254 , A61B8/4444 , A61B8/4477 , A61B8/4483 , G01S7/5205 , G01S15/8913 , G01S15/8915
摘要： A method of calibrating an ultrasound probe includes mounting an ultrasound probe onto a calibration system, transmitting an ultrasound test signal from an element of the probe through a test medium of the calibration system, and receiving the test signal on a matrix of hydrophones such that an element's position relative to other elements and other arrays within the same probe can be computed. Further, the system described herein is configured to detect the acoustic performance of elements of a probe and report the results to an end user or service provider.
摘要翻译： 一种校准超声波探头的方法包括将超声波探针安装到校准系统上，从探测元件通过校准系统的测试介质传输超声测试信号，并将测试信号接收在水听器的矩阵上，使得 可以计算相对于其他元件和相同探针中的其他阵列的元素的位置。 此外，本文描述的系统被配置为检测探针的元件的声学性能并将结果报告给最终用户或服务提供商。
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公开(公告)号：US09282945B2
公开(公告)日：2016-03-15
申请号：US13279110
申请日：2011-10-21
申请人： David M. Smith , Sharon L. Adam , Donald F. Specht , Kenneth D. Brewer , John P. Lunsford , David J. Specht
发明人： David M. Smith , Sharon L. Adam , Donald F. Specht , Kenneth D. Brewer , John P. Lunsford , David J. Specht
CPC分类号： A61B8/587 , A61B8/00 , A61B8/4218 , A61B8/4254 , A61B8/4444 , A61B8/4477 , A61B8/4483 , G01S7/5205 , G01S15/8913 , G01S15/8915
摘要： A method of calibrating an ultrasound probe includes mounting an ultrasound probe onto a calibration system, transmitting an ultrasound test signal from an element of the probe through a test medium of the calibration system, and receiving the test signal on a matrix of hydrophones such that an element's position relative to other elements and other arrays within the same probe can be computed. Further, the system described herein is configured to detect the acoustic performance of elements of a probe and report the results to an end user or service provider.
摘要翻译： 一种校准超声波探头的方法包括将超声波探针安装到校准系统上，从探测元件通过校准系统的测试介质传输超声测试信号，并将测试信号接收在水听器的矩阵上，使得 可以计算相对于其他元件和相同探针中的其他阵列的元素的位置。 此外，本文描述的系统被配置为检测探针的元件的声学性能并将结果报告给最终用户或服务提供商。
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公开(公告)号：US20120095343A1
公开(公告)日：2012-04-19
申请号：US13272105
申请日：2011-10-12
IPC分类号： A61B8/14
CPC分类号： A61B8/4494 , A61B8/14 , A61B8/145 , A61B8/4444 , A61B8/4483 , A61B8/461 , A61B8/467 , A61B8/5207 , A61B8/523 , A61B8/58 , B06B1/0622 , G01S7/5205 , G01S7/52084 , G01S15/8913 , G01S15/892 , G01S15/8927 , G01S15/8929 , G01S15/8934
摘要： A Multiple Aperture Ultrasound Imaging (MAUI) probe or transducer is uniquely capable of simultaneous imaging of a region of interest from separate apertures of ultrasound arrays. Some embodiments provide systems and methods for designing, building and using ultrasound probes having continuous arrays of ultrasound transducers which may have a substantially continuous concave curved shape in two or three dimensions (i.e. concave relative to an object to be imaged). Other embodiments herein provide systems and methods for designing, building and using ultrasound imaging probes having other unique configurations, such as adjustable probes and probes with variable configurations.
摘要翻译： 多孔超声成像（MAUI）探针或换能器独特地能够从超声阵列的单独孔径同时成像感兴趣的区域。 一些实施例提供了用于设计，构建和使用具有连续的超声换能器阵列的超声波探头的系统和方法，所述超声波探头可具有两维或三维的基本上连续的凹形弯曲形状（即，相对于要成像的物体是凹的）。 本文的其它实施例提供了用于设计，构建和使用具有其他独特配置的超声成像探针的系统和方法，例如具有可变构型的可调探针和探针。
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公开(公告)号：US09247926B2
公开(公告)日：2016-02-02
申请号：US13272105
申请日：2011-10-12
CPC分类号： A61B8/4494 , A61B8/14 , A61B8/145 , A61B8/4444 , A61B8/4483 , A61B8/461 , A61B8/467 , A61B8/5207 , A61B8/523 , A61B8/58 , B06B1/0622 , G01S7/5205 , G01S7/52084 , G01S15/8913 , G01S15/892 , G01S15/8927 , G01S15/8929 , G01S15/8934
摘要： A Multiple Aperture Ultrasound Imaging (MAUI) probe or transducer is uniquely capable of simultaneous imaging of a region of interest from separate apertures of ultrasound arrays. Some embodiments provide systems and methods for designing, building and using ultrasound probes having continuous arrays of ultrasound transducers which may have a substantially continuous concave curved shape in two or three dimensions (i.e. concave relative to an object to be imaged). Other embodiments herein provide systems and methods for designing, building and using ultrasound imaging probes having other unique configurations, such as adjustable probes and probes with variable configurations.
摘要翻译： 多孔超声成像（MAUI）探针或换能器独特地能够从超声阵列的单独孔径同时成像感兴趣的区域。 一些实施例提供了用于设计，构建和使用具有连续的超声换能器阵列的超声波探头的系统和方法，所述超声波探头可具有两维或三维的基本上连续的凹形弯曲形状（即，相对于要成像的物体是凹的）。 本文的其它实施例提供了用于设计，构建和使用具有其他独特配置的超声成像探针的系统和方法，例如具有可变构型的可调探针和探针。
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公开(公告)号：US06706621B2
公开(公告)日：2004-03-16
申请号：US10302412
申请日：2002-11-22
申请人： Harry D. Cox , David P. Daniel , Leonard J. Gardecki , Albert J. Gregoritsch, III , Ruth A. Machell Julianelle , Charles H. Keeler , Doris P. Pulaski , Mary A. Schaffer , David L. Smith , David J. Specht , Adolf E. Wirsing
发明人： Harry D. Cox , David P. Daniel , Leonard J. Gardecki , Albert J. Gregoritsch, III , Ruth A. Machell Julianelle , Charles H. Keeler , Doris P. Pulaski , Mary A. Schaffer , David L. Smith , David J. Specht , Adolf E. Wirsing
IPC分类号： H01L2144
CPC分类号： H01L23/528 , H01L23/544 , H01L24/10 , H01L24/11 , H01L24/13 , H01L2223/54406 , H01L2223/54493 , H01L2224/05001 , H01L2224/05022 , H01L2224/05111 , H01L2224/05124 , H01L2224/05147 , H01L2224/05171 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13611 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
摘要： A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform plasma etching of contacts of the wafer, improve etching of contacts of perimeter chips, and lower contact resistance of contacts of perimeter chips. The extra holes also provide solder bumps outside the perimeter chips that can be used to support a second shadow mask for deposition of an additional material, such as tin, on the reflowed solder bumps for mounting the chips on a plastic substrate at low temperature. An improved mask to wafer alignment aid is formed from standard solder bumps. The improved alignment aid avoids damage to test probes and provides improved course alignment.
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公开(公告)号：US07138326B2
公开(公告)日：2006-11-21
申请号：US10625635
申请日：2003-07-23
申请人： Harry D. Cox , David P. Daniel , Leonard J. Gardecki , Albert J. Gregoritsch, III , Ruth A. Machell Julianelle , Charles H. Keeler , Doris P. Pulaski , Mary A. Schaffer , David L. Smith , David J. Specht , Adolf E. Wirsing
发明人： Harry D. Cox , David P. Daniel , Leonard J. Gardecki , Albert J. Gregoritsch, III , Ruth A. Machell Julianelle , Charles H. Keeler , Doris P. Pulaski , Mary A. Schaffer , David L. Smith , David J. Specht , Adolf E. Wirsing
IPC分类号： H01L21/44
CPC分类号： H01L23/528 , H01L23/544 , H01L24/10 , H01L24/11 , H01L24/13 , H01L2223/54406 , H01L2223/54493 , H01L2224/05001 , H01L2224/05022 , H01L2224/05111 , H01L2224/05124 , H01L2224/05147 , H01L2224/05171 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13611 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
摘要： A shadow mask for depositing solder bumps includes additional dummy holes located adjacent holes corresponding to most of the perimeter chips of the wafer. The additional dummy provide more uniform plasma etching of contacts of the wafer, improve etching of contacts of perimeter chips, and lower contact resistance of contacts of perimeter chips. The extra holes also provide solder bumps outside the perimeter chips that can be used to support a second shadow mask for deposition of an additional material, such as tin, on the reflowed solder bumps for mounting the chips on a plastic substrate at low temperature. An improved mask to wafer alignment aid is formed from standard solder bumps. The improved alignment aid avoids damage to test probes and provides improved course alignment.
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