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7 条记录 (耗时 0.042 秒)

    Processor-inclusive memory module
    1.
    发明授权
    Processor-inclusive memory module 失效
    包含处理器的内存模块

    公开(公告)号：US5867419A

    公开(公告)日：1999-02-02

    申请号：US903042

    申请日：1997-07-29

    申请人： David P. Chengson ,  William L. Schmidt ,  Unmesh Agarwala ,  Alan D. Foster ,  Edward C. Priest ,  John C. Manton ,  Ali Mira

    发明人： David P. Chengson ,  William L. Schmidt ,  Unmesh Agarwala ,  Alan D. Foster ,  Edward C. Priest ,  John C. Manton ,  Ali Mira

    IPC分类号： G11C5/00 ,  H01L25/18 ,  H03H11/00

    CPC分类号： H01L25/18 ,  H01L2924/0002 ,  H01L2924/3011

    摘要： A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon. Electrical connectors extend from the second surface of the printed circuit board. The electrical connectors are electrically coupled to respective contact pads of the processor. In the present PIMM, the electrical connectors are adapted to be removably attached to a mother board. In so doing, the present PIMM is removably attachable to a mother board.

    摘要翻译： 公开了一种包含处理器的存储器模块（PIMM）。 在本发明的一个实施例中，PIMM包括具有第一和第二相对表面的印刷电路板。 印刷电路板还具有形成在其中的地址线。 第一SRAM安装在印刷电路板的第一表面上。 本PIMM还包括安装在印刷电路板的第二表面上的第二SRAM。 第二SRAM安装在印刷电路板的与安装在印刷电路板的第一表面上的第一SRAM直接相对的第二表面上。 第一和第二SRAM通过相应的高速缓存总线耦合到地址线。 处理器也安装在印刷电路板的第一表面上，并且耦合到地址线。 在本发明的一个实施例中，散热器热耦合到处理器。 处理器具有设置在其上的多个接触垫。 电连接器从印刷电路板的第二表面延伸。 电连接器电耦合到处理器的相应接触垫。 在目前的PIMM中，电连接器适于可拆卸地连接到母板。 这样做，现在的PIMM可拆卸地连接到母板上。

    Processor-inclusive memory module
    3.
    发明授权
    Processor-inclusive memory module 失效

    公开(公告)号：US5999437A

    公开(公告)日：1999-12-07

    申请号：US789557

    申请日：1997-01-27

    申请人： David P. Chengson ,  William L. Schmidt ,  Unmesh Agarwala ,  Alan D. Foster ,  Edward C. Priest ,  John C. Manton ,  Ali Mira

    发明人： David P. Chengson ,  William L. Schmidt ,  Unmesh Agarwala ,  Alan D. Foster ,  Edward C. Priest ,  John C. Manton ,  Ali Mira

    IPC分类号： G06F15/78 ,  G11C5/00 ,  H01L25/18 ,  H05K7/14 ,  H05K1/14

    CPC分类号： H05K7/1422 ,  G06F15/7864 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/3011

    摘要： A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon. Electrical connectors extend from the second surface of the printed circuit board. The electrical connectors are electrically coupled to respective contact pads of the processor. In the present PIMM, the electrical connectors are adapted to be removably attached to a mother board. In so doing, the present PIMM is removably attachable to a mother board.

    Unitary heat sink for integrated circuits
    5.
    发明授权
    Unitary heat sink for integrated circuits 失效
    集成电路的单一散热器

    公开(公告)号：US5504652A

    公开(公告)日：1996-04-02

    申请号：US307516

    申请日：1994-09-16

    申请人： Alan D. Foster ,  Mark P. August

    发明人： Alan D. Foster ,  Mark P. August

    IPC分类号： H01L23/40 ,  H05H7/20

    CPC分类号： H01L23/4006 ,  H01L2023/4062 ,  H01L2924/0002

    摘要： A unitary heat sink including a planar contact portion for contacting the top of an IC. The heat sink is constructed from a material having a thermal conductivity of at least 150 watts per meter Degree Kelvin (W/m.degree.K.) but preferably is constructed from aluminum having a conductivity of 221 (W/m.degree.K.). A number of leg portions extend from the contact portion such that each leg portion has a distal end. The leg portions, being made of the same material as the contact portion, are configured to have a sufficient resiliency such that deformations of the leg portions provide a spring force in the range of 5 to 16 lbs against the top of the IC. A method for dissipating heat from an integrated circuit includes the steps of forming a unitary heat sink from a heat sink material, where the heat sink includes a contact portion and a number of integral, spring leg portions. The method continues with the attachment of an integrated circuit to a printed circuit board, and the attachment of the leg portions of the heat sink to the printed circuit board such that the contact portion of the heat sink is urged towards the heat transfer surface of the integrated circuit with a spring force in the range of 5 to 16 lbs.

    摘要翻译： 一体式散热器，包括用于接触IC顶部的平面接触部分。 散热器由热导率至少为150瓦每米开尔文（W / m℃）的材料构成，但优选由导电率为221（W / m·K）的铝构成。 多个腿部从接触部分延伸，使得每个腿部具有远端。 由与接触部分相同的材料制成的腿部部分被构造成具有足够的弹性，使得腿部部分的变形相对于IC的顶部提供5至16磅范围内的弹簧力。 从集成电路散热的方法包括从散热材料形成整体散热器的步骤，其中散热器包括接触部分和多个整体的弹簧脚部分。 该方法继续将集成电路连接到印刷电路板，以及将散热器的腿部部分附接到印刷电路板，使得散热器的接触部分被推向朝向印刷电路板的传热表面 集成电路的弹簧力在5至16磅的范围内。

    Coupler and jack assembly
    6.
    发明授权
    Coupler and jack assembly 失效
    联轴器和千斤顶总成

    公开(公告)号：US4202528A

    公开(公告)日：1980-05-13

    申请号：US888231

    申请日：1978-03-20

    申请人： Alan D. Foster

    发明人： Alan D. Foster

    IPC分类号： B60S9/02

    CPC分类号： B60S9/02

    摘要： A mobile home jack and coupler assembly is adapted for mounting to the A-frame or tongue of a mobile home. Both top mounted coupler assembly and inverted bottom mounted coupler assembly are disclosed. Each includes a screw jack which mounts from underneath. The screw jack carries, adjacent its lower end, a mounting plate which is received in underlying relation to a portion of the coupler, while the upper end thereof extends through a guide plate above the coupler. The mounting plate on the jack is welded to the jack body by an underlying weld, with the result that the tongue weight of the mobile home is carried directly by the jack support plate in compression, rather than in tension, and the compressive force is transferred by the underlying weld, also in compression, to the jack body. As a result, jack mounting screws do not carry the tongue weight applied to the jack, and greater tongue loads can more safely be carried.

    摘要翻译： 移动家用插座和耦合器组件适于安装到移动家庭的A框架或舌头。 公开了顶部安装的联接器组件和倒置的底部安装的联接器组件。 每个都包括从下面安装的螺丝千斤顶。 螺钉千斤顶在其下端附近承载安装板，该安装板与联接器的一部分接触，同时其上端延伸穿过联接器上方的引导板。 千斤顶上的安装板通过下面的焊接焊接到插座主体，结果是移动式家庭的舌头重量由插座支撑板直接承受压缩而不是张力，并且压缩力被传递 通过底层焊接，也在压缩中，到千斤顶体。 因此，千斤顶安装螺丝不会承受施加在千斤顶上的舌头重量，并能更安全地承受较大的舌头载荷。

    Offset spindle support
    7.
    发明授权
    Offset spindle support 失效
    偏移主轴支撑

    公开(公告)号：US4127306A

    公开(公告)日：1978-11-28

    申请号：US799583

    申请日：1977-05-23

    申请人： Alan D. Foster

    发明人： Alan D. Foster

    IPC分类号： B60B35/06 ,  B60G21/055

    CPC分类号： B60G21/055 ,  B60B35/06

    摘要： An offset spindle and spindle support for a mobile home axle is disclosed, in which the wheel spindle is vertically offset with respect to a conventional axle tube. The offset support comprises a generally cup-shaped stamping and utilizes the backing plate of the brake to form a box-section, low-cost high strength offset support for a forged wheel spindle.

    摘要翻译： 公开了一种用于移动式家用轴的偏移主轴和主轴支撑，其中，所述车轮主轴相对于常规的轴管垂直偏移。 偏移支撑件包括大致杯形的冲压件，并且利用制动器的背板来形成用于锻造的主轴的箱形部件，低成本的高强度偏移支撑件。