Magnonic magnetic random access memory device
    5.
    发明授权
    Magnonic magnetic random access memory device 有权
    磁性磁性随机存取存储器件

    公开(公告)号:US08456895B2

    公开(公告)日:2013-06-04

    申请号:US13100032

    申请日:2011-05-03

    IPC分类号: G11C11/00 G11C11/14 G11C11/15

    CPC分类号: G11C11/161 G11C11/1675

    摘要: A mechanism is provided for bidirectional writing. A structure includes a reference layer on top of a tunnel barrier, a free layer underneath the tunnel barrier, a metal spacer underneath the free layer, an insulating magnet underneath the metal spacer, and a high resistance layer underneath the insulating layer. The high resistance layer acts as a heater in which the heater heats the insulating magnet to generate spin polarized electrons. A magnetization of the free layer is destabilized by the spin polarized electrons generated from the insulating magnet. A voltage is applied to change the magnetization of the free layer when the magnetization is destabilized. A polarity of the voltage determines when the magnetization of the free layer is parallel and antiparallel to a magnetization of the reference layer.

    摘要翻译: 提供了双向写入的机制。 结构包括在隧道势垒顶部的参考层,隧道势垒下的自由层,自由层下的金属隔离物,金属间隔物下方的绝缘磁体,以及绝缘层下方的高电阻层。 高电阻层用作加热器,其中加热器加热绝缘磁体以产生自旋极化电子。 自由层的磁化由绝缘磁体产生的自旋极化电子不稳定。 当磁化不稳定时,施加电压以改变自由层的磁化。 电压的极性确定自由层的磁化何时平行并与参考层的磁化反平行。

    MAGNONIC MAGNETIC RANDOM ACCESS MEMORY DEVICE

    公开(公告)号:US20120281467A1

    公开(公告)日:2012-11-08

    申请号:US13100032

    申请日:2011-05-03

    IPC分类号: G11C11/14

    CPC分类号: G11C11/161 G11C11/1675

    摘要: A mechanism is provided for bidirectional writing. A structure includes a reference layer on top of a tunnel barrier, a free layer underneath the tunnel barrier, a metal spacer underneath the free layer, an insulating magnet underneath the metal spacer, and a high resistance layer underneath the insulating layer. The high resistance layer acts as a heater in which the heater heats the insulating magnet to generate spin polarized electrons. A magnetization of the free layer is destabilized by the spin polarized electrons generated from the insulating magnet. A voltage is applied to change the magnetization of the free layer when the magnetization is destabilized. A polarity of the voltage determines when the magnetization of the free layer is parallel and antiparallel to a magnetization of the reference layer.

    摘要翻译: 提供了双向写入的机制。 结构包括在隧道势垒顶部的参考层,隧道势垒下的自由层,自由层下的金属隔离物,金属间隔物下方的绝缘磁体,以及绝缘层下方的高电阻层。 高电阻层用作加热器,其中加热器加热绝缘磁体以产生自旋极化电子。 自由层的磁化由绝缘磁体产生的自旋极化电子不稳定。 当磁化不稳定时,施加电压以改变自由层的磁化。 电压的极性确定自由层的磁化何时平行并与参考层的磁化反平行。

    Method for fabricating synthetic antiferromagnetic (SAF) device
    8.
    发明授权
    Method for fabricating synthetic antiferromagnetic (SAF) device 有权
    制造合成反铁磁(SAF)装置的方法

    公开(公告)号:US09015927B2

    公开(公告)日:2015-04-28

    申请号:US13566130

    申请日:2012-08-03

    IPC分类号: G11B5/127 H04R31/00 G11C11/16

    摘要: A method for fabricating a synthetic antiferromagnetic device, includes depositing a reference layer on a first tantalum layer and including depositing a first cobalt iron boron layer, depositing a second cobalt iron boron layer on the first cobalt iron boron layer, depositing a second Ta layer on the second cobalt iron boron layer, depositing a magnesium oxide spacer layer on the reference layer and depositing a cap layer on the magnesium oxide spacer layer.

    摘要翻译: 一种用于制造合成反铁磁性器件的方法,包括在第一钽层上沉积参考层,并且包括沉积第一钴铁硼层,在第一钴铁硼层上沉积第二钴铁硼层,在第一钴铁硼层上沉积第二Ta层 第二钴铁硼层,在参考层上沉积氧化镁间隔层并在氧化镁间隔层上沉积覆盖层。

    Utilizing Sidewall Spacer Features to Form Magnetic Tunnel Junctions in an Integrated Circuit
    9.
    发明申请
    Utilizing Sidewall Spacer Features to Form Magnetic Tunnel Junctions in an Integrated Circuit 审中-公开
    利用侧壁间隔件在集成电路中形成磁隧道结

    公开(公告)号:US20080211055A1

    公开(公告)日:2008-09-04

    申请号:US12120915

    申请日:2008-05-15

    IPC分类号: H01L43/00 H01L43/12

    CPC分类号: H01L43/12 H01L27/222

    摘要: Novel methods for reliably and reproducibly forming magnetic tunnel junctions in integrated circuits are described. In accordance with aspects of the invention, sidewall spacer features are utilized during the processing of the film stack. Advantageously, these sidewall spacer features create a tapered masking feature which helps to avoid byproduct redeposition during the etching of the MTJ film stack, thereby improving process yield. Moreover, the sidewall spacer features may be used as encapsulating layers during subsequent processing steps and as vertical contacts to higher levels of metallization.

    摘要翻译: 描述了在集成电路中可靠且可重复地形成磁隧道结的新方法。 根据本发明的方面,在膜叠层的处理期间利用侧壁间隔物特征。 有利地,这些侧壁间隔物特征产生锥形掩蔽特征,其有助于避免在MTJ膜叠层的蚀刻期间的副产物再沉积,从而提高工艺产率。 此外,侧壁间隔物特征可以在随后的处理步骤期间用作包封层,并且可以用作垂直接触以进行更高级别的金属化。