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公开(公告)号：US08827498B2
公开(公告)日：2014-09-09
申请号：US12286438
申请日：2008-09-30
IPC分类号： F21V29/00 , F21S8/10 , F21S8/02 , F21Y101/02
CPC分类号： F21V29/51 , F21S8/02 , F21S45/47 , F21V29/004 , F21V29/70 , F21V29/74 , F21Y2115/10
摘要： A light source (10) comprises a tubular glass heat pipe (12) having a given inside diameter ID. A tubular fiberglass wick (14) is positioned within the glass heat pipe (12). The fiberglass wick (14) has an outside diameter OD substantially equal to the given inside diameter ID and has a substantially centrally located open chamber (16) extending the length thereof. A quantity of an evaporable-condensable medium (17) is provided within the glass heat pipe (12) and a metal cap (18) selected from the group of glass-sealing metals and alloys is fixed to a proximal end (20) of the glass heat pipe (12). Heat dissipaters (22) are fixed to the distal end (24) of the heat pipe (12) and a light emitting diode (26) is fixed to the metal cap (18). Power conducting traces (28) are formed with the heat pipe (12) and are electrically connected to the light emitting diode (26). A lamp (40) can be formed with a plurality of the light sources (10).
摘要翻译： 光源（10）包括具有给定内径ID的管状玻璃热管（12）。 管状玻璃纤维芯（14）位于玻璃热管（12）内。 玻璃纤维芯（14）具有基本上等于给定的内径ID的外径OD，并且具有延伸其长度的基本中心定位的开放室（16）。 在玻璃热管（12）内设有一定数量的可蒸发冷凝介质（17），从该组玻璃密封金属和合金中选择的金属帽（18）固定到 玻璃热管（12）。 散热器（22）固定在热管（12）的远端（24）上，发光二极管（26）固定在金属盖（18）上。 功率传导迹线（28）与热管（12）形成并且电连接到发光二极管（26）。 灯（40）可以形成有多个光源（10）。
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公开(公告)号：US20140332825A1
公开(公告)日：2014-11-13
申请号：US13891874
申请日：2013-05-10
申请人： Jeffery J. Serre
发明人： Jeffery J. Serre
CPC分类号： H01L33/62 , G06F17/5045 , G06F17/5068 , G06F2217/64 , H01L21/485 , H01L23/5382 , H01L24/95 , H01L25/0753 , H01L25/50 , H01L2224/16225 , H01L2224/95085 , H01L2224/95101 , H01L2224/95146 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： The present disclosure is directed to circuitry configurable based on device orientation. Example circuitry may comprise at least one device location and configurable conductors. The at least one device location may include at least two conductive pads onto which a device may be populated by a manufacturing process. The configurable conductors may be coupled to each of the at least two conductive pads. The configurable conductors may be configured by adding conductive material to at least one configurable conductor or subtracting at least part of at least one configurable conductor. For example, conductive material may be added to close a space between two segments of a configurable conductor to form a conduction path. Alternatively, at least part of at least one of a plurality of configurable conductors coupled to a conductive pad may be subtracted (e.g., cut) to stop conduction in the at least one configurable conductor.
摘要翻译： 本公开涉及基于设备取向配置的电路。 示例电路可以包括至少一个设备位置和可配置导体。 至少一个设备位置可以包括至少两个导电焊盘，其上可以通过制造工艺填充设备。 可配置导体可以耦合到至少两个导电焊盘中的每一个。 可配置导体可以通过将导电材料添加到至少一个可配置导体或减去至少一个可配置导体的至少一部分来配置。 例如，可以添加导电材料以封闭可配置导体的两个部分之间的空间以形成传导路径。 或者，可以减去耦合到导电焊盘的多个可配置导体中的至少一个的至少一个，以便减少（例如，切割）以停止在至少一个可配置导体中的导通。
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公开(公告)号：US08884314B1
公开(公告)日：2014-11-11
申请号：US13891874
申请日：2013-05-10
申请人： Jeffery J. Serre
发明人： Jeffery J. Serre
CPC分类号： H01L33/62 , G06F17/5045 , G06F17/5068 , G06F2217/64 , H01L21/485 , H01L23/5382 , H01L24/95 , H01L25/0753 , H01L25/50 , H01L2224/16225 , H01L2224/95085 , H01L2224/95101 , H01L2224/95146 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： The present disclosure is directed to circuitry configurable based on device orientation. Example circuitry may comprise at least one device location and configurable conductors. The at least one device location may include at least two conductive pads onto which a device may be populated by a manufacturing process. The configurable conductors may be coupled to each of the at least two conductive pads. The configurable conductors may be configured by adding conductive material to at least one configurable conductor or subtracting at least part of at least one configurable conductor. For example, conductive material may be added to close a space between two segments of a configurable conductor to form a conduction path. Alternatively, at least part of at least one of a plurality of configurable conductors coupled to a conductive pad may be subtracted (e.g., cut) to stop conduction in the at least one configurable conductor.
摘要翻译： 本公开涉及基于设备取向配置的电路。 示例电路可以包括至少一个设备位置和可配置导体。 至少一个设备位置可以包括至少两个导电焊盘，其上可以通过制造工艺填充设备。 可配置导体可以耦合到至少两个导电焊盘中的每一个。 可配置导体可以通过将导电材料添加到至少一个可配置导体或减去至少一个可配置导体的至少一部分来配置。 例如，可以添加导电材料以封闭可配置导体的两个部分之间的空间以形成传导路径。 或者，可以减去耦合到导电焊盘的多个可配置导体中的至少一个的至少一个，以便减少（例如，切割）以停止在至少一个可配置导体中的导通。
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