Processes for the preparation of benzotriazole UV absorbers
    2.
    发明授权
    Processes for the preparation of benzotriazole UV absorbers 失效
    制备苯并三唑紫外线吸收剂的方法

    公开(公告)号:US06815550B2

    公开(公告)日:2004-11-09

    申请号:US10315693

    申请日:2002-12-10

    IPC分类号: C07D24920

    CPC分类号: C07D249/20 C07C245/08

    摘要: Provided is a process for preparing 2H-benzotriazole UV absorbers containing a perfluoroalkyl moiety at the 5-position of the benzoic ring, for example a trifluoromethyl group, which involves digitizing the perfluoroalkyl substituted o-nitroaniline using concentrated sulfuric acid plus sodium nitrite or nitrosylsulfuric acid to form the corresponding monoazobenzene intermediate via the diazonium salt intermediate which is reduced to the corresponding 5-perfluoroalkyl substituted 2H-benzotriazole UV absorber compound by conventional reduction means. Also provided is a novel one-pot, multiphase reaction for the preparation of 2(2-nitrophenylazo) substituted phenols, which are precursors for 2H-benzotriazole UV absorbers.

    摘要翻译: 提供了制备在苯甲酸环的5位上含有全氟烷基部分的2H-苯并三唑UV吸收剂的方法,例如三氟甲基,其涉及使用浓硫酸加亚硝酸钠或亚硝酰基硫酸将全氟烷基取代的邻硝基苯胺数字化 通过重氮盐中间体形成相应的单偶氮苯中间体,其通过常规还原方法还原成相应的5-全氟烷基取代的2H-苯并三唑UV吸收剂化合物。 还提供了用于制备2(2-硝基苯基偶氮)取代的酚的新颖的一锅多相反应,其是2H-苯并三唑UV吸收剂的前体。

    Method of making ceramic microwave electronic package
    6.
    发明授权
    Method of making ceramic microwave electronic package 失效
    陶瓷微波电子封装方法

    公开(公告)号:US5448826A

    公开(公告)日:1995-09-12

    申请号:US231492

    申请日:1994-04-22

    IPC分类号: H01L21/00 H01L23/66 H05K13/00

    摘要: A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A ceramic seal ring with a second cavity corresponding to that of the RF substrate, but slightly larger, is attached to the RF substrate by seal glass which is patterned to generally match the dimensions of the seal ring. A ceramic lid is attached to the top of the seal ring by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译: 适用于高频微电子器件的陶瓷微电子封装包括至少部分导电的基底,其通过密封玻璃或通过焊料附着到具有形成在其中心的空腔的陶瓷RF基板,以及用于提供从 内到外包装。 基底可以是金属或陶瓷,其上沉积有金属层。 具有对应于RF衬底的第二腔但稍大的陶瓷密封环通过被图案化以与密封环的尺寸大体匹配的密封玻璃附接到RF衬底。 陶瓷盖通过非导电粘合剂(例如聚合物粘合剂或低温密封玻璃)附接到密封环的顶部,以在微电子装置安装在内部之后密封包装。

    High frequency microelectronics package
    8.
    发明授权
    High frequency microelectronics package 失效
    高频微电子封装

    公开(公告)号:US5736783A

    公开(公告)日:1998-04-07

    申请号:US645848

    申请日:1996-05-14

    摘要: A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译: 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底,其中心形成有空腔。 基底可以是金属或陶瓷,其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗,而与用于覆盖导电图案的材料的介电性质无关。 也就是说,由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂(例如聚合物粘合剂或低温密封玻璃)附接到RF基板上,以密封包装,一旦微电子器件 已经安装在里面

    High frequency microelectronics package
    10.
    发明授权
    High frequency microelectronics package 有权
    高频微电子封装

    公开(公告)号:US06172412B2

    公开(公告)日:2001-01-09

    申请号:US09220133

    申请日:1998-12-23

    IPC分类号: H01L2940

    摘要: A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译: 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底,其中心形成有空腔。 基底可以是金属或陶瓷,其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗,而与用于覆盖导电图案的材料的介电性质无关。 也就是说,由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂(例如聚合物粘合剂或低温密封玻璃)附接到RF基板上,以密封包装,一旦微电子器件 已经安装在里面