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公开(公告)号：US20230232566A1
公开(公告)日：2023-07-20
申请号：US17576713
申请日：2022-01-14
申请人： Dell Products L.P.
CPC分类号： H05K7/20 , H05K5/0213 , H05K5/0247 , H05K5/03
摘要： A computing device includes a top cover, a heater apparatus, a plurality of temperature sensors, and a heating control component. The heater apparatus includes a heater component and a connector, and the heater component is affixed to the top cover. The plurality of temperature sensors are operatively connected to the heating control component. The heating control component configured to manage the heater apparatus using the plurality of temperature sensors.
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公开(公告)号：US20230229214A1
公开(公告)日：2023-07-20
申请号：US17577602
申请日：2022-01-18
申请人： Dell Products L.P.
CPC分类号： G06F1/26 , G01K3/005 , G01K7/02 , G01K1/14 , G05D23/1931 , H05K7/20836
摘要： An improved method and system for controlling the powering-on of an electronic device when initially the internal temperature is below a safe threshold. The method and system can preheat the electronic device until it is at a safe temperature in which to safely power-on the electronic device. Alternatively or in addition, the method and system can alert a user if the temperature is below a threshold and proceed to power-on when the temperature is above the threshold.
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公开(公告)号：US20230229212A1
公开(公告)日：2023-07-20
申请号：US17577621
申请日：2022-01-18
申请人： Dell Products L.P.
发明人： Eric Michael Tunks , Joseph Andrew Vivio , Ayedin Nikazm , John Randolph Stuewe , Tyler Baxter Duncan
摘要： An improved method and system for heating and cooling an electronic device, when internal temperatures are below safe operating ranges. To do so, the system selectively heats or cools each zone of the electronic device. This may be done by individual heaters and/or cooling system for each separate zones. Alternatively, or in addition too, the system can selectively open and close baffles, causing fresh ambient air to enter and/or recirculate heated air in a device’s enclosure. This keeps sensitive components of the computing device, such as processors and memory from suffering damage, by operating them at temperatures that are either too cold or too warm.
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公开(公告)号：US12085966B2
公开(公告)日：2024-09-10
申请号：US17577632
申请日：2022-01-18
申请人： Dell Products L.P.
摘要： Embodiments of the invention may provide an improved method for pre-heating an electronic device such as an information handling system, when internal temperatures are below safe operating ranges. To do so, the system selectively heats the entire device or select zones of the electronic device for a predetermined amount of time when the system is restarted after a period of time sufficient to bring the system to ambient temperatures. The predetermined amount of time is determined based on measured ambient temperatures. Using a table that corresponds the ambient temperatures to a time that a component needs to heat up to a nominal temperature in a zone, the predetermined time can be calculated.
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公开(公告)号：US11937396B2
公开(公告)日：2024-03-19
申请号：US17576713
申请日：2022-01-14
申请人： Dell Products L.P.
CPC分类号： H05K7/20 , H05K5/0213 , H05K5/0247 , H05K5/03
摘要： A computing device includes a top cover, a heater apparatus, a plurality of temperature sensors, and a heating control component. The heater apparatus includes a heater component and a connector, and the heater component is affixed to the top cover. The plurality of temperature sensors are operatively connected to the heating control component. The heating control component configured to manage the heater apparatus using the plurality of temperature sensors.
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公开(公告)号：US20230232590A1
公开(公告)日：2023-07-20
申请号：US17576700
申请日：2022-01-14
申请人： Dell Products L.P.
CPC分类号： H05K7/20163 , H05K7/20209 , H05K7/20409 , H05K1/0201 , H05K2201/06
摘要： A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.
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公开(公告)号：US20240206106A1
公开(公告)日：2024-06-20
申请号：US18433654
申请日：2024-02-06
申请人： Dell Products L.P.
CPC分类号： H05K7/20 , H05K5/0213 , H05K5/0247 , H05K5/03
摘要： A method for heating hardware components in a computing device includes: determining a heating condition of the computing device; and in response to determination, initiating heating of a hardware component of the computing device using a heater component, in which the heater component is affixed to a top cover of the computing device.
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公开(公告)号：US20230232572A1
公开(公告)日：2023-07-20
申请号：US17576721
申请日：2022-01-14
申请人： Dell Products L.P.
CPC分类号： H05K7/20209 , H05K7/20136 , H05K5/0213 , H05K5/023
摘要： An information handling system includes a plurality of computing devices, and at least one environmental management unit external to the plurality of the computing devices and configured to manage an internal environment of the information handling system.
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公开(公告)号：US20230229181A1
公开(公告)日：2023-07-20
申请号：US17577632
申请日：2022-01-18
申请人： Dell Products L.P.
摘要： Embodiments of the invention may provide an improved method for pre-heating an electronic device such as an information handling system, when internal temperatures are below safe operating ranges. To do so, the system selectively heats the entire device or select zones of the electronic device for a predetermined amount of time when the system is restarted after a period of time sufficient to bring the system to ambient temperatures. The predetermined amount of time is determined based on measured ambient temperatures. Using a table that corresponds the ambient temperatures to a time that a component needs to heat up to a nominal temperature in a zone, the predetermined time can be calculated.
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公开(公告)号：US11706900B1
公开(公告)日：2023-07-18
申请号：US17576721
申请日：2022-01-14
申请人： Dell Products L.P.
CPC分类号： H05K7/20209 , H05K5/023 , H05K5/0213 , H05K7/20136
摘要： An information handling system includes a plurality of computing devices, and at least one environmental management unit external to the plurality of the computing devices and configured to manage an internal environment of the information handling system.
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