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12 条记录 (耗时 0.016 秒)

    Method for electrically connecting a semiconductor component to an electrical subassembly
    2.
    发明授权
    Method for electrically connecting a semiconductor component to an electrical subassembly 有权
    一种用于将半导体部件电连接到电子组件的方法

    公开(公告)号：US07069653B2

    公开(公告)日：2006-07-04

    申请号：US10343873

    申请日：2001-07-20

    申请人： Rainer Topp ,  Dirk Balszunat ,  Stephan Ernst ,  Achim Henkel ,  Doerte Eimers-Klose ,  Reinhard Milich

    发明人： Rainer Topp ,  Dirk Balszunat ,  Stephan Ernst ,  Achim Henkel ,  Doerte Eimers-Klose ,  Reinhard Milich

    IPC分类号： H01R43/00

    CPC分类号： H01L23/49558 ,  H01L23/32 ,  H01L23/36 ,  H01L23/49861 ,  H01L2924/0002 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  H01L2924/00

    摘要： A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by metal strip conductors, the semiconductor component and the punched grid are joined so that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends is then possible, this mechanical mounting at the same time establishing an electric connection between the electric terminals of the semiconductor component and the internal terminal ends, whereby a metal strip grid, e.g., a punched grid, which, even before being joined to the semiconductor component, has already been embedded on at least one side in at least one partial area in a material that is not electrically conductive, is used as the metal strip grid. This procedure is used for bond-free contacting of semiconductor components for high-power applications in which a power loss of more than 1 Watt may occur.

    摘要翻译： 一种通过使用具有内部末端的冲压格栅和外部末端与电子模块的一部分建立电连接的电连接的方法，所述外部端子通过 金属带状导体，半导体部件和冲孔格栅被接合，使得半导体部件的至少两个电端子位于相应的内部端子端上，使得半导体部件在两个内部端子上的防滑安装 可能的是，这种机械安装同时在半导体部件的电端子和内部端子端之间建立电连接，由此即使在连接到半导体部件之前的金属条格栅，例如冲压格栅， 已经至少在一个部分中嵌入至少一侧 不导电的材料中的区域用作金属带网格。 该方法用于可能发生功率损耗大于1瓦特的大功率应用的半导体元件的无键接触。

    Active rectifier module for three-phase generators of vehicles
    4.
    发明申请
    Active rectifier module for three-phase generators of vehicles 有权
    用于车辆三相发电机的主动整流模块

    公开(公告)号：US20060151874A1

    公开(公告)日：2006-07-13

    申请号：US10520884

    申请日：2003-04-16

    申请人： Reinhard Milich ,  Dirk Balszunat

    发明人： Reinhard Milich ,  Dirk Balszunat

    IPC分类号： H02J7/00 ,  H01L23/34

    CPC分类号： H01L25/16 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/33181 ,  H02J7/14 ,  H02K11/048 ,  H02M7/003

    摘要： A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are triggered via switching elements of a power circuit. The power circuit is controlled via a control part, which includes a controller component. The rectifier includes a control part (control module) having control terminals and a power circuit (power module) controlled by the control module and optionally provided with a cooling device, in which all the power-conducting components are designed as power MOS components and integrated in a stacked construction.

    摘要翻译： 描述用于将交流电整流为直流电的整流器，其中三相发电机包括三相定子绕组。 定子绕组的相位通过电源电路的开关元件触发。 电源电路通过控制部件进行控制，控制部件包括控制器部件。 整流器包括具有控制端子的控制部分（控制模块）和由控制模块控制并且可选地设置有冷却装置的电力电路（功率模块），其中所有的导电部件被设计为功率MOS部件并且集成 堆叠式结构。

    Cooling device for semiconductor modules
    5.
    发明授权
    Cooling device for semiconductor modules 失效

    公开(公告)号：US06822865B2

    公开(公告)日：2004-11-23

    申请号：US10464143

    申请日：2003-06-18

    申请人： Dirk Balszunat ,  Reinhard Milich

    发明人： Dirk Balszunat ,  Reinhard Milich

    IPC分类号： H05K702

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling device for semiconductor modules having: a cooler bar for accommodating at least one, particularly actively cooled semiconductor module; at least one first channel, particularly a bore hole, in the cooler bar for the passage of a, in particular, liquid coolant; and at least one second channel, particularly a bore hole, in the cooler bar for the feeding and/or return of the coolant to/from the semiconductor module.

    Active rectifier module for three-phase generators of vehicles
    6.
    发明授权
    Active rectifier module for three-phase generators of vehicles 有权
    用于车辆三相发电机的主动整流模块

    公开(公告)号：US07420224B2

    公开(公告)日：2008-09-02

    申请号：US10520884

    申请日：2003-04-16

    申请人： Reinhard Milich ,  Dirk Balszunat

    发明人： Reinhard Milich ,  Dirk Balszunat

    IPC分类号： H01L23/34

    CPC分类号： H01L25/16 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/33181 ,  H02J7/14 ,  H02K11/048 ,  H02M7/003

    摘要： A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are triggered via switching elements of a power circuit. The power circuit is controlled via a control part, which includes a controller component. The rectifier includes a control part (control module) having control terminals and a power circuit (power module) controlled by the control module and optionally provided with a cooling device, in which all the power-conducting components are designed as power MOS components and integrated in a stacked construction.

    摘要翻译： 描述用于将交流电整流为直流电的整流器，其中三相发电机包括三相定子绕组。 定子绕组的相位通过电源电路的开关元件触发。 电源电路通过控制部件进行控制，控制部件包括控制器部件。 整流器包括具有控制端子的控制部分（控制模块）和由控制模块控制并且可选地设置有冷却装置的电力电路（功率模块），其中所有的导电部件被设计为功率MOS部件并且集成 堆叠式结构。

    Semiconductor component
    7.
    发明授权
    Semiconductor component 有权
    半导体元件

    公开(公告)号：US07208829B2

    公开(公告)日：2007-04-24

    申请号：US10514171

    申请日：2003-02-10

    申请人： Henning Hauenstein ,  Rainer Topp ,  Jochen Seibold ,  Dirk Balszunat ,  Stefan Ernst ,  Wolfgang Feiler ,  Thomas Koester ,  Stefan Hornung ,  Dieter Streb

    发明人： Henning Hauenstein ,  Rainer Topp ,  Jochen Seibold ,  Dirk Balszunat ,  Stefan Ernst ,  Wolfgang Feiler ,  Thomas Koester ,  Stefan Hornung ,  Dieter Streb

    IPC分类号： H01L29/72

    CPC分类号： H01L23/488 ,  H01L23/3735 ,  H01L23/482 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor component that is able to be produced simply, quickly, and yet reliably and that usable for power applications, and including a semiconductor chip, a lower, first main electrode layer formed on a first side of the semiconductor chip, a lower control electrode layer formed on the first side, an insulation layer formed on the first side between the lower first main electrode layer and the lower control electrode layer and which partly covers the lower first main electrode layer, an upper first main electrode layer which is formed on the lower first main electrode layer, an upper control electrode layer which is formed on the lower control electrode layer and the insulation layer and extends on the insulation layer partially above the lower first main electrode layer, and a second main electrode layer formed on a second side of the semiconductor chip.

    摘要翻译： 一种半导体元件，其能够简单，快速且可靠地制造并且可用于功率应用，并且包括形成在半导体芯片的第一侧上的半导体芯片，下部第一主电极层，下部控制电极 形成在第一侧上的第一主电极层，形成在下第一主电极层和下控制电极层之间的第一侧上并部分覆盖下第一主电极层的绝缘层，形成在第一侧上的第一主电极层 下部第一主电极层，形成在下部控制电极层和绝缘层上的上部控制电极层，并且在绝缘层上部分地在下部第一主电极层的上方延伸，第二主电极层形成在第二侧上 的半导体芯片。

    Semiconductor component
    9.
    发明申请
    Semiconductor component 有权
    半导体元件

    公开(公告)号：US20060163648A1

    公开(公告)日：2006-07-27

    申请号：US10514171

    申请日：2003-02-10

    申请人： Henning Hauenstein ,  Rainer Topp ,  Jochen Seibold ,  Dirk Balszunat ,  Stefan Ernst ,  Wolfgang Feiler ,  Thomas Koester ,  Stefan Hornung ,  Dieter Streb

    发明人： Henning Hauenstein ,  Rainer Topp ,  Jochen Seibold ,  Dirk Balszunat ,  Stefan Ernst ,  Wolfgang Feiler ,  Thomas Koester ,  Stefan Hornung ,  Dieter Streb

    IPC分类号： H01L29/76

    CPC分类号： H01L23/488 ,  H01L23/3735 ,  H01L23/482 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor component that is able to be produced simply, quickly, and yet reliably and that usable for power applications, and including a semiconductor chip, a lower, first main electrode layer formed on a first side of the semiconductor chip, a lower control electrode layer formed on the first side, an insulation layer formed on the first side between the lower first main electrode layer and the lower control electrode layer and which partly covers the lower first main electrode layer, an upper first main electrode layer which is formed on the lower first main electrode layer, an upper control electrode layer which is formed on the lower control electrode layer and the insulation layer and extends on the insulation layer partially above the lower first main electrode layer, and a second main electrode layer formed on a second side of the semiconductor chip.

    摘要翻译： 一种半导体元件，其能够简单，快速且可靠地制造并且可用于功率应用，并且包括形成在半导体芯片的第一侧上的半导体芯片，下部第一主电极层，下部控制电极 形成在第一侧上的第一主电极层，形成在下第一主电极层和下控制电极层之间的第一侧上并部分覆盖下第一主电极层的绝缘层，形成在第一侧上的第一主电极层 下部第一主电极层，形成在下部控制电极层和绝缘层上的上部控制电极层，并且在绝缘层上部分地在下部第一主电极层的上方延伸，第二主电极层形成在第二侧上 的半导体芯片。

    Connecting device for contacting a semiconductor component
    10.
    发明授权
    Connecting device for contacting a semiconductor component 失效
    用于接触半导体部件的连接装置

    公开(公告)号：US07573727B2

    公开(公告)日：2009-08-11

    申请号：US10514104

    申请日：2003-01-10

    申请人： Henning Hauenstein ,  Dirk Balszunat

    发明人： Henning Hauenstein ,  Dirk Balszunat

    IPC分类号： H05K1/11 ,  H05K1/14

    CPC分类号： H01L23/488 ,  H01L23/49548 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A connecting device for contacting a semiconductor component to at least one further component, the connecting device comprising at least one metal connecting strip extending in a longitudinal direction and having a contact region for mounting on a terminal region of the semiconductor component. In order to achieve a contacting system that can be manufactured inexpensively but can nevertheless carry high current densities, a connecting device is proposed whose contact region is embodied in structured fashion and flexibly with respect to stresses that extend in a terminal plane parallel to the terminal region.

    摘要翻译： 一种用于将半导体部件接触至少一个其它部件的连接装置，所述连接装置包括沿纵向方向延伸的至少一个金属连接条，并具有用于安装在半导体部件的端子区域上的接触区域。 为了实现能够廉价制造但仍然能够承受高电流密度的接触系统，提出了一种连接装置，其接触区域以结构化的方式体现并且相对于平行于端子区域的端子平面中延伸的应力灵活地实现 。