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    Efficient micro-machining apparatus and method employing multiple laser beams
    1.
    发明申请
    Efficient micro-machining apparatus and method employing multiple laser beams 审中-公开
    高效的微加工设备和采用多个激光束的方法

    公开(公告)号：US20050224469A1

    公开(公告)日：2005-10-13

    申请号：US11000333

    申请日：2004-11-29

    申请人： Donald Cutler ,  Brian Baird ,  Richard Harris ,  David Hemenway ,  Ho Lo ,  Brady Nilsen ,  Yasu Osako ,  Lei Sun ,  Yunlong Sun ,  Mark Unrath

    发明人： Donald Cutler ,  Brian Baird ,  Richard Harris ,  David Hemenway ,  Ho Lo ,  Brady Nilsen ,  Yasu Osako ,  Lei Sun ,  Yunlong Sun ,  Mark Unrath

    IPC分类号： B23K26/06 ,  B23K26/00

    CPC分类号： B23K26/06

    摘要： A laser beam switching system employs a laser coupled to a beam switching device that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head is directing the laser beam to process a workpiece target location, the second beam positioning head is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs positioned such that the laser beam passes through the AOMs without being deflected. When RF is applied to the first AOM, the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM, the laser beam is diffracted toward the second beam positioning head.

    摘要翻译： 激光束切换系统采用耦合到光束切换装置的激光器，其使激光束在第一和第二光束定位头之间切换，使得当第一光束定位头引导激光束来处理工件目标位置时，第二 光束定位头正在移动到另一个目标位置，反之亦然。 优选的光束切换装置包括第一和第二AOM，其被定位成使得激光束不经偏转地穿过AOM。 当RF施加到第一AOM时，激光束朝向第一光束定位头衍射，并且当RF施加到第二AOM时，激光束被朝向第二光束定位头衍射。

    Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
    2.
    发明申请
    Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams 审中-公开
    工件处理系统，使用共同的成像光学组件来形成多个激光束的光能的空间分布

    公开(公告)号：US20060114948A1

    公开(公告)日：2006-06-01

    申请号：US11000330

    申请日：2004-11-29

    申请人： Ho Lo ,  Yunlong Sun ,  Richard Harris ,  Brian Baird

    发明人： Ho Lo ,  Yunlong Sun ,  Richard Harris ,  Brian Baird

    IPC分类号： H01S3/10 ,  H01S3/08

    CPC分类号： B23K26/067 ,  B23K26/0673

    摘要： A workpiece processing system employs a common modular imaged optics assembly and an optional variable beam expander for optically processing multiple laser beams. In one embodiment, a laser and a fixed beam expander cooperate to produce a laser beam that propagates through a beam switching device to produce multiple laser beams that propagate along separate propagation path portions and subsequently merge into a common path portion through an imaged optics assembly and optional variable expander. The beam expander sets the shape of the laser beams in the form of a Gaussian spatial distribution of light energy. The imaged optics assembly shapes the Gaussian spatial distribution of the laser beams to form output beams of uniform spatial distribution. In an alternative embodiment, the beam switching device is removed and the laser beams propagate from separate laser sources associated with separate optional beam expanders.

    摘要翻译： 工件处理系统采用通用的模块化成像光学组件和用于光学处理多个激光束的可选可变光束扩展器。 在一个实施例中，激光器和固定光束扩展器协作以产生通过光束切换装置传播的激光束，以产生沿分离的传播路径部分传播并随后通过成像的光学组件并入公共路径部分的多个激光束， 可选扩展器。 光束扩展器以光能的高斯空间分布的形式设置激光束的形状。 成像光学组件对激光束的高斯空间分布进行整形，形成均匀空间分布的输出光束。 在替代实施例中，去除光束切换装置，并且激光束从与单独的可选光束扩展器相关联的分离的激光源传播。

    Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
    3.
    发明申请
    Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure 有权
    使用在结构上纵向重叠的多个激光束点的半导体结构处理

    公开(公告)号：US20050282319A1

    公开(公告)日：2005-12-22

    申请号：US11051261

    申请日：2005-02-04

    申请人： Kelly Bruland ,  Brian Baird ,  Ho Lo ,  Richard Harris ,  Yunlong Sun

    发明人： Kelly Bruland ,  Brian Baird ,  Ho Lo ,  Richard Harris ,  Yunlong Sun

    IPC分类号： B23K26/06 ,  B23K26/067 ,  H01L21/00 ,  H01L21/26 ,  H01L21/302 ,  H01L21/324 ,  H01L21/42 ,  H01L21/461 ,  H01L21/477 ,  H01L21/84 ,  H01L23/525

    CPC分类号： B23K26/067 ,  B23K26/0604 ,  B23K26/0613 ,  H01L21/76894 ,  H01L23/5258 ,  H01L27/1052 ,  H01L27/10894 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Methods and systems use laser pulses to process a selected structure on or within a semiconductor substrate. The structure has a surface, a width, and a length. The laser pulses propagate along axes that move along a scan beam path relative to the substrate as the laser pulses process the selected structure. The method simultaneously generates on the selected structure first and second laser beam pulses that propagate along respective first and second laser beam axes intersecting the selected structure at distinct first and second locations. The first and second laser beam pulses impinge on the surface of the selected structure respective first and second beam spots. Each beam spot encompasses at least the width of the selected link. The first and second beam spots are spatially offset from one another along the length of the selected structure to define an overlapping region covered by both the first and the second beam spots and a total region covered by one or both of the first and second beam spots. The total region is larger than the first beam spot and also larger than the second beam spot. The method sets respective first and second energy values of the first and second laser beam pulses to cause complete depthwise processing of the selected structure across the width of the structure in at least a portion of the total region.

    摘要翻译： 方法和系统使用激光脉冲来处理半导体衬底上或其中的选定结构。 该结构具有表面，宽度和长度。 随着激光脉冲处理所选择的结构，激光脉冲沿着沿扫描光束路径相对于衬底移动的轴传播。 所述方法同时在所选择的结构上产生沿相应的第一和第二激光束轴线在不同的第一和第二位置与所选择的结构相交的第一和第二激光束脉冲。 第一和第二激光束脉冲冲击所选结构的表面上相应的第一和第二光束点。 每个光束点至少包含所选链接的宽度。 第一和第二光束斑点沿着所选择的结构的长度在空间上彼此偏移以限定由第一和第二光束点两者覆盖的重叠区域，以及由第一和第二光束斑点中的一个或两个覆盖的总区域 。 总区域大于第一束斑，并且大于第二束斑。 该方法设置第一和第二激光束脉冲的相应的第一和第二能量值，以便在整个区域的至少一部分中跨结构的宽度对所选结构进行完全深度处理。

    Methods of and laser systems for link processing using laser pulses with specially tailored power profiles
    4.
    发明申请
    Methods of and laser systems for link processing using laser pulses with specially tailored power profiles 有权
    使用激光脉冲进行链接处理的特殊定制功率曲线的方法和激光系统

    公开(公告)号：US20050067388A1

    公开(公告)日：2005-03-31

    申请号：US10921481

    申请日：2004-08-18

    申请人： Yunlong Sun ,  Richard Harris ,  Ho Lo ,  Brian Baird ,  Jay Johnson

    发明人： Yunlong Sun ,  Richard Harris ,  Ho Lo ,  Brian Baird ,  Jay Johnson

    IPC分类号： B23K20060101 ,  B23K26/06 ,  B23K26/38 ,  H01S20060101 ,  H04J14/02

    CPC分类号： H01L23/5258 ,  B23K26/0613 ,  B23K26/0622 ,  B23K2101/40 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

    摘要翻译： 具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层 链接。

    Methods of and laser systems for link processing using laser pulses with specially tailored power profiles
    6.
    发明授权
    Methods of and laser systems for link processing using laser pulses with specially tailored power profiles 有权
    使用激光脉冲进行链接处理的特殊定制功率曲线的方法和激光系统

    公开(公告)号：US07348516B2

    公开(公告)日：2008-03-25

    申请号：US10921481

    申请日：2004-08-18

    申请人： Yunlong Sun ,  Richard Harris ,  Ho Wai Lo ,  Brian Baird ,  Jay Johnson ,  Robert F. Hainsey

    发明人： Yunlong Sun ,  Richard Harris ,  Ho Wai Lo ,  Brian Baird ,  Jay Johnson ,  Robert F. Hainsey

    IPC分类号： B23K26/00 ,  B23K26/14 ,  B23K26/16

    CPC分类号： H01L23/5258 ,  B23K26/0613 ,  B23K26/0622 ,  B23K2101/40 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

    摘要翻译： 具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层 链接。

    LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES
    7.
    发明申请
    LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES 审中-公开
    使用具有特殊定制电源配置的激光脉冲进行链接处理

    公开(公告)号：US20080203071A1

    公开(公告)日：2008-08-28

    申请号：US12052577

    申请日：2008-03-20

    申请人： Yunlong Sun ,  Richard Harris ,  Ho Wai Lo ,  Brian Baird ,  Jay Johnson ,  Robert F. Hainsey

    发明人： Yunlong Sun ,  Richard Harris ,  Ho Wai Lo ,  Brian Baird ,  Jay Johnson ,  Robert F. Hainsey

    IPC分类号： B23K26/00

    CPC分类号： H01L23/5258 ,  B23K26/0613 ,  B23K26/0622 ,  B23K2101/40 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

    摘要翻译： 具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层 链接。