公开(公告)号：US20060126677A1

公开(公告)日：2006-06-15

申请号：US11067299

申请日：2005-02-25

申请人： Yunlong Sun ,  Richard Harris ,  William Jordens ,  Lei Sun

发明人： Yunlong Sun ,  Richard Harris ,  William Jordens ,  Lei Sun

IPC分类号： H01S3/13

CPC分类号： H01L23/5258 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/067 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/50 ,  H01L2924/0002 ,  H01S3/10046 ,  H01S3/2383 ,  Y10S438/94 ,  H01L2924/00

摘要： A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.

摘要翻译： 在轮廓不同时刻，不同激光波长的特殊形状的激光脉冲能量分布提供了减少的受控抖动，从而能够实现高质量处理和较小可能光斑尺寸的半导体器件微机械加工。

公开(公告)号：US20050224469A1

公开(公告)日：2005-10-13

申请号：US11000333

申请日：2004-11-29

申请人： Donald Cutler ,  Brian Baird ,  Richard Harris ,  David Hemenway ,  Ho Lo ,  Brady Nilsen ,  Yasu Osako ,  Lei Sun ,  Yunlong Sun ,  Mark Unrath

发明人： Donald Cutler ,  Brian Baird ,  Richard Harris ,  David Hemenway ,  Ho Lo ,  Brady Nilsen ,  Yasu Osako ,  Lei Sun ,  Yunlong Sun ,  Mark Unrath

IPC分类号： B23K26/06 ,  B23K26/00

CPC分类号： B23K26/06

摘要： A laser beam switching system employs a laser coupled to a beam switching device that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head is directing the laser beam to process a workpiece target location, the second beam positioning head is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs positioned such that the laser beam passes through the AOMs without being deflected. When RF is applied to the first AOM, the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM, the laser beam is diffracted toward the second beam positioning head.

摘要翻译： 激光束切换系统采用耦合到光束切换装置的激光器，其使激光束在第一和第二光束定位头之间切换，使得当第一光束定位头引导激光束来处理工件目标位置时，第二 光束定位头正在移动到另一个目标位置，反之亦然。 优选的光束切换装置包括第一和第二AOM，其被定位成使得激光束不经偏转地穿过AOM。 当RF施加到第一AOM时，激光束朝向第一光束定位头衍射，并且当RF施加到第二AOM时，激光束被朝向第二光束定位头衍射。

公开(公告)号：US07396706B2

公开(公告)日：2008-07-08

申请号：US11067299

申请日：2005-02-25

申请人： Yunlong Sun ,  Richard Harris ,  William J. Jordens ,  Lei Sun

发明人： Yunlong Sun ,  Richard Harris ,  William J. Jordens ,  Lei Sun

IPC分类号： B23K26/36 ,  H01L35/34 ,  H01L21/30

CPC分类号： H01L23/5258 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/067 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/50 ,  H01L2924/0002 ,  H01S3/10046 ,  H01S3/2383 ,  Y10S438/94 ,  H01L2924/00

摘要： A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.

摘要翻译： 在轮廓不同时刻，不同激光波长的特殊形状的激光脉冲能量分布提供了减少的受控抖动，从而能够实现高质量处理和较小可能光斑尺寸的半导体器件微机械加工。

公开(公告)号：US20060128073A1

公开(公告)日：2006-06-15

申请号：US11067464

申请日：2005-02-25

申请人： Yunlong Sun ,  Richard Harris ,  Kelly Bruland ,  Robert Hainsey ,  Ho Lo ,  Lei Sun

发明人： Yunlong Sun ,  Richard Harris ,  Kelly Bruland ,  Robert Hainsey ,  Ho Lo ,  Lei Sun

IPC分类号： H01L21/82 ,  B23K26/16

CPC分类号： H01L23/5258 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/067 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/50 ,  H01L2924/0002 ,  H01S3/10046 ,  H01S3/2383 ,  Y10S438/94 ,  H01L2924/00

摘要： A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.

摘要翻译： 在轮廓不同时刻，不同激光波长的特殊形状的激光脉冲能量分布提供了减少的受控抖动，从而能够实现高质量处理和较小可能光斑尺寸的半导体器件微机械加工。

公开(公告)号：US20060138110A1

公开(公告)日：2006-06-29

申请号：US11360964

申请日：2006-02-22

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/16

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060138108A1

公开(公告)日：2006-06-29

申请号：US11360120

申请日：2006-02-22

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/16

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060131288A1

公开(公告)日：2006-06-22

申请号：US11292327

申请日：2005-11-30

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/16

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20050087522A1

公开(公告)日：2005-04-28

申请号：US10777973

申请日：2004-02-11

申请人： Yunlong Sun ,  Liu Jinjiao ,  Richard Harris ,  Pradeep Subrahmanyan ,  Robert Hainsey ,  Weixiong Lu

发明人： Yunlong Sun ,  Liu Jinjiao ,  Richard Harris ,  Pradeep Subrahmanyan ,  Robert Hainsey ,  Weixiong Lu

IPC分类号： B23K26/06 ,  B23K26/38 ,  H05K3/00

CPC分类号： B23K26/0608 ,  B23K26/0604 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/56 ,  H05K3/0038 ,  H05K2203/108 ,  H05K2203/1105

摘要： A method and laser system effect rapid removal of material from a workpiece by applying heating energy in the form of a light beam to a target location on the workpiece to elevate its temperature while maintaining its dimensional stability. When the target portion of the workpiece is heated, a laser beam is directed for incidence on the heated target location. The laser beam preferably has a processing laser output that is appropriate to effect removal of the target material from the workpiece. The combined incidence of the processing laser output and the heating energy on the target location enables the processing laser output to remove a portion of the target material at a material removal rate that is higher than the material removal rate achievable when the target material is not heated.

摘要翻译： 一种方法和激光系统通过将光束形式的加热能量施加到工件上的目标位置来实现材料从工件的快速移除，以提高其温度同时保持其尺寸稳定性。 当工件的目标部分被加热时，激光束被引导以被加热到目标位置上。 激光束优选地具有适合于从工件去除目标材料的处理激光输出。 处理激光输出和加热能量在目标位置的组合发生率使得处理激光输出能够以高于目标材料不加热时可实现的材料去除速率的材料去除速率去除目标材料的一部分 。

公开(公告)号：US20060141680A1

公开(公告)日：2006-06-29

申请号：US11359216

申请日：2006-02-21

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： H01L21/82

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

摘要翻译： 使用一组（50）激光脉冲（52）来切断存储器或其它IC芯片中的导电链路（22）。 组（50）的持续时间优选短于1,000ns; 并且组（50）内的每个激光脉冲（52）的脉冲宽度优选在约0.1ps至30ns的范围内。 传统的激光定位系统（62）可将组（50）视为单个“脉冲”，以便在激光系统（60）激发一组（50）激光脉冲（50） 52）。 可以使用传统的IR波长或它们的谐波。

公开(公告)号：US20060138107A1

公开(公告)日：2006-06-29

申请号：US11360094

申请日：2006-02-22

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/16

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.