Method of grinding thin-film magnetic heads using optical grinding
markers
    3.
    发明授权
    Method of grinding thin-film magnetic heads using optical grinding markers 失效
    使用光学研磨标记研磨薄膜磁头的方法

    公开(公告)号:US5579717A

    公开(公告)日:1996-12-03

    申请号:US324424

    申请日:1994-10-13

    摘要: According to the present grinding method, a plurality of optical markers are formed by photolithography such that the markers are embedded in a chiplet having a magnetic head. Markers are preferably in the shape of a bar having predetermined height, width and length and are spaced from each other by a predetermined distance where one end of the bars are sequentially offset from each other by a predetermined amount. During coarse grinding of the magnetic head as the magnetic head surface material is ground away, the end-face of the bars, one at a time, become visible. The closer the grinding surface approaches the desired inductive throat or MR element height, more end-faces become visible. Coarse grinding continues until a predetermined number of end-faces become visible at which point the grinding process is terminated and the magnetic head is ready for the final lapping process.

    摘要翻译: 根据本研磨方法,通过光刻法形成多个光学标记,使得标记物嵌入具有磁头的小芯片中。 标记优选为具有预定高度,宽度和长度的条形的形状,并且彼此隔开预定距离,其中杆的一端相互偏移预定量。 当磁头表面材料被磨掉时,在磁头粗磨时,钢筋的端面一次一个变得可见。 研磨表面越接近所需的感应喉部或MR元件高度,越多的端面变得可见。 继续进行粗磨,直到预定数量的端面变得可见,此时研磨过程终止,并且磁头准备好进行最后的研磨过程。

    Method for chemically scribing wafers
    4.
    发明授权
    Method for chemically scribing wafers 失效
    化学划片晶圆的方法

    公开(公告)号:US5462636A

    公开(公告)日:1995-10-31

    申请号:US174108

    申请日:1993-12-28

    摘要: A method for creating scribe lines on a wafer having an electronic device constructed therein. A plurality of boundary segments is formed on the wafer to define a region on the wafer. This region encompasses the electronic device. An insulating layer is formed over the boundary segments, wherein the insulating layer covers the electronic device. A portion of the insulating layer is removed such that each of the segments is exposed. The boundary segments are then etched away to expose the wafer and form a plurality of scribe lines, wherein the wafer may be cut at the scribe lines to separate the electronic device from the wafer while minimizing damage to the electronic device.

    摘要翻译: 一种在其上构造有电子器件的晶片上创建划线的方法。 在晶片上形成多个边界段以限定晶片上的区域。 该区域包括电子设备。 绝缘层形成在边界段上,其中绝缘层覆盖电子设备。 去除绝缘层的一部分,使得每个段被暴露。 然后蚀刻边界段以暴露晶片并形成多个划线,其中可以在划线处切割晶片以将电子器件与晶片分离,同时最小化对电子器件的损坏。