摘要:
A magnetic write head having a tapered trailing edge and having a magnetic layer formed over a trailing edge of the write pole at a location recessed from the ABS, the magnetic layer being separated from the trailing edge of the write pole by a thin non-magnetic layer. The thin non-magnetic layer is preferably sufficiently thin that the magnetic layer can function as a portion of the write pole in a region removed from the ABS. A trailing magnetic shield is formed over the write pole and is separated from the write pole by a non-magnetic trailing gap layer. A non-magnetic spacer layer can be formed over the magnetic layer to provide additional separation between the magnetic layer and the trailing magnetic shield.
摘要:
A method for manufacturing a magnetic write head having a leading magnetic shield and a trailing magnetic shield that are arranged to prevent the lost of magnetic write field to the trailing magnetic shield. The write head includes a non-magnetic step layer that provides additional spacing between the trailing magnetic shield and the write pole at a region removed from the air bearing surface.
摘要:
According to the present grinding method, a plurality of optical markers are formed by photolithography such that the markers are embedded in a chiplet having a magnetic head. Markers are preferably in the shape of a bar having predetermined height, width and length and are spaced from each other by a predetermined distance where one end of the bars are sequentially offset from each other by a predetermined amount. During coarse grinding of the magnetic head as the magnetic head surface material is ground away, the end-face of the bars, one at a time, become visible. The closer the grinding surface approaches the desired inductive throat or MR element height, more end-faces become visible. Coarse grinding continues until a predetermined number of end-faces become visible at which point the grinding process is terminated and the magnetic head is ready for the final lapping process.
摘要:
A method for creating scribe lines on a wafer having an electronic device constructed therein. A plurality of boundary segments is formed on the wafer to define a region on the wafer. This region encompasses the electronic device. An insulating layer is formed over the boundary segments, wherein the insulating layer covers the electronic device. A portion of the insulating layer is removed such that each of the segments is exposed. The boundary segments are then etched away to expose the wafer and form a plurality of scribe lines, wherein the wafer may be cut at the scribe lines to separate the electronic device from the wafer while minimizing damage to the electronic device.