公开(公告)号：US08465995B2

公开(公告)日：2013-06-18

申请号：US13301015

申请日：2011-11-21

Applicant: Young-Ki Jung ,  Seok-Woo Lee ,  Kum-Mi Oh ,  Dong-Cheon Shin ,  In-Hyuk Song ,  Han-Seok Lee ,  Won-Keun Park

Inventor： Young-Ki Jung ,  Seok-Woo Lee ,  Kum-Mi Oh ,  Dong-Cheon Shin ,  In-Hyuk Song ,  Han-Seok Lee ,  Won-Keun Park

IPC: H01L21/00 ,  H01L21/84 ,  G02F1/1337 ,  G02F1/1343

CPC classification number: H01L27/088 ,  G02F2001/134372 ,  G02F2001/136236 ,  H01L27/1248 ,  H01L27/1288 ,  H01L29/66757 ,  H01L29/78633

Abstract: A method of manufacturing an array substrate for a fringe field switching mode liquid crystal display includes: forming an auxiliary insulating layer having a first thickness; forming first and second photoresist patterns on the auxiliary insulating layer; performing an ashing to remove the second photoresist pattern and expose the auxiliary insulating layer therebelow; performing a dry etching to remove the auxiliary insulating layer not covered by the first photoresist pattern and expose a first passivation layer and to form an insulating pattern below the first photoresist pattern, the insulating pattern and the first photoresist pattern forming an undercut shape; forming a transparent conductive material layer having a fourth thickness less than the first thickness; and performing a lift-off process to remove the first photoresist pattern and the transparent conductive material layer thereon together and form a pixel electrode.

Abstract translation: 制造用于边缘场开关模式液晶显示器的阵列基板的方法包括：形成具有第一厚度的辅助绝缘层; 在辅助绝缘层上形成第一和第二光致抗蚀剂图案; 执行灰化以去除第二光致抗蚀剂图案并在其下方露出辅助绝缘层; 进行干蚀刻以除去未被第一光致抗蚀剂图案覆盖的辅助绝缘层，并露出第一钝化层并在第一光致抗蚀剂图案下形成绝缘图案，绝缘图案和第一光致抗蚀剂图案形成底切形状; 形成具有小于第一厚度的第四厚度的透明导电材料层; 并且执行剥离处理以将第一光致抗蚀剂图案和透明导电材料层去除在一起并形成像素电极。

公开(公告)号：US08580356B2

公开(公告)日：2013-11-12

申请号：US12003776

申请日：2007-12-31

Applicant: Dong-Cheon Shin

Inventor： Dong-Cheon Shin

IPC: B05D3/02 ,  B05D3/06 ,  H05B3/00

CPC classification number: G02F1/133788 ,  G02F1/133723

Abstract: A method of fabricating an alignment layer for a liquid crystal display device includes forming an alignment material layer on a substrate by coating an alignment material, irradiating UV rays onto the alignment material layer and pre-baking the alignment material layer; and post-baking the alignment material layer.

Abstract translation: 一种制造液晶显示装置的取向层的方法包括：通过涂布取向材料在基板上形成取向材料层，将UV光照射到取向材料层上并对其进行预烘烤; 并对后述的定向材料层进行后烘烤。

公开(公告)号：US07485494B2

公开(公告)日：2009-02-03

申请号：US11413938

申请日：2006-04-27

Applicant: Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

Inventor： Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

IPC: H01L21/00

CPC classification number: H01L24/29 ,  C09J7/10 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2463/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.

Abstract translation: 本发明的半导体用切割模粘合膜具有3层结构，其包括附着在半导体晶片背面的第一粘接层; 附着在第一粘合剂层上的第二粘合剂层; 以及附着在第二粘合剂层上的切割膜，因此具有能够确保半导体封装工艺的可靠性的优点，因为它可以防止模切现象和切割过程中的模具拾取不良并保持足够的 模头与芯片之间的粘合力。

公开(公告)号：US20090198013A1

公开(公告)日：2009-08-06

申请号：US11915280

申请日：2005-10-31

Applicant: Dong-Cheon Shin ,  Byoung-Un Kang ,  Tae-Hyun Sung ,  Jai-Hoon Kim ,  Kyung-Tae Wi ,  Joon-Mo Seo ,  Hyuk-Soo Moon

Inventor： Dong-Cheon Shin ,  Byoung-Un Kang ,  Tae-Hyun Sung ,  Jai-Hoon Kim ,  Kyung-Tae Wi ,  Joon-Mo Seo ,  Hyuk-Soo Moon

IPC: C08L63/00

CPC classification number: H01L24/83 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2463/00 ,  H01L24/27 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/05032

Abstract: An adhesive film for semiconductor is disclosed. The present invention provides an adhesive film for semiconductor used in semiconductor packaging, comprising an adhesive layer, wherein the adhesive layer has surface tension of 19 to 52 erg/cm at 60 ° C. Accordingly, the adhesive film for semiconductor according to the present invention may prevent bubbles from being formed between the adhesive film and a supporting member by controlling surface tension in an optimum condition, and also obtain higher reliability in use of the adhesive film in the semi-conductor packaging by controlling tackiness and adhesive force in an optimum condition.

Abstract translation: 公开了一种用于半导体的粘合膜。 本发明提供一种半导体封装用半导体用粘接膜，其特征在于，具有粘合层，其粘合层在60℃下的表面张力为19〜52erg / cm。因此，本发明的半导体用粘接膜 可以通过在最佳条件下控制表面张力来防止在粘合剂膜和支撑构件之间形成气泡，并且通过在最佳条件下控制粘性和粘合力，在半导体封装中使用粘合剂膜也获得更高的可靠性 。

公开(公告)号：US20080231786A1

公开(公告)日：2008-09-25

申请号：US12003776

申请日：2007-12-31

Applicant: Dong-Cheon Shin

Inventor： Dong-Cheon Shin

IPC: G02F1/1337

CPC classification number: G02F1/133788 ,  G02F1/133723

Abstract: A method of fabricating an alignment layer for a liquid crystal display device includes forming an alignment material layer on a substrate by coating an alignment material, irradiating UV rays onto the alignment material layer and pre-baking the alignment material layer; and post-baking the alignment material layer.

Abstract translation: 一种制造液晶显示装置的取向层的方法包括：通过涂布取向材料在基板上形成取向材料层，将UV光照射到取向材料层上并对其进行预烘烤; 并对后述的定向材料层进行后烘烤。

公开(公告)号：US20060244132A1

公开(公告)日：2006-11-02

申请号：US11413938

申请日：2006-04-27

Applicant: Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

Inventor： Byoung-Un Kang ,  Jai-Hoon Kim ,  Joon-Mo Seo ,  Tae-Hyun Sung ,  Dong-Cheon Shin ,  Kyung-Tae Wi

IPC: H01L23/34

CPC classification number: H01L24/29 ,  C09J7/10 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2463/00 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.