摘要:
The present description relates to a method for transmitting data from a base station according to one embodiment of the present invention comprises: a step for transmitting to the relay node a signal having a first data to be delivered to a user equipment via the relay node; a step for transmitting to the user equipment a signal having a second data; and a step for receiving from the user equipment a HARQ confirmation response information regarding the first data delivered to the user equipment through the relay node, wherein the first data is retransmitted to the user equipment from the relay node when the HARQ confirmation response information is NACK, and scheduling information for transmitting the first data from the relay node to the user equipment and scheduling information for retransmitting the first data can be designated in advance by the base station.
摘要:
The present description relates to a method for transmitting data from a base station according to one embodiment of the present invention comprises: a step for transmitting to the relay node a signal having a first data to be delivered to a user equipment via the relay node; a step for transmitting to the user equipment a signal having a second data; and a step for receiving from the user equipment a HARQ confirmation response information regarding the first data delivered to the user equipment through the relay node, wherein the first data is retransmitted to the user equipment from the relay node when the HARQ confirmation response information is NACK, and scheduling information for transmitting the first data from the relay node to the user equipment and scheduling information for retransmitting the first data can be designated in advance by the base station.
摘要:
A semiconductor package includes a lower package comprising a lower semiconductor chip mounted on a lower package substrate, an upper package comprising an upper package substrate stacked on the lower package and an upper semiconductor chip mounted on the upper package substrate, interconnection terminals electrically connecting the lower package substrate with the upper package substrate, and a lower molding film molding the lower semiconductor chip between the lower package substrate and the upper package substrate. The lower package substrate comprises a chip region on which the lower semiconductor chip is mounted, an interconnection region enclosing a portion of the chip region, and a mold injection region defined by the chip region and the interconnection region. The interconnection terminals are disposed on the lower package substrate of the interconnection region but not disposed on the lower package substrate of the mold injection region.
摘要:
An intra-edge routing-less IP communication device and communication method using the same, in a multi-subnet edge network on a single. LAN segment in which there are a plurality of premises hosts some of which originally belong to subnets different from those of the others. The communication device comprises a DHCP proxy server for changing an IP configuration information including a subnet mask contained in a. DHCP response message provided from an original DHCP server, thereby making the plurality of GIP hosts and LIP hosts believe that they belong to the same subnet, and a subnet-aware ARP proxy server, which is capable of being aware of true subnets of the plurality of client premises hosts and of the MAC addresses of the default gateways thereof, for virtually recovering the true subnets when the plurality of client premises hosts broadcast ARP Request for a remote host misunderstood to exist in the same subnets owing to the changed subnet mask, by giving the MAC address of the default gateway corresponding to one of the plurality of client premises source hosts.