公开(公告)号：US08530259B2

公开(公告)日：2013-09-10

申请号：US13480351

申请日：2012-05-24

申请人： Dongmin Chen ,  Justin Payne ,  Li-Tien Tseng

发明人： Dongmin Chen ,  Justin Payne ,  Li-Tien Tseng

IPC分类号： H01L21/00

CPC分类号： G01C19/5719 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00238 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831

摘要： A method for fabricating a micro electromechanical device includes providing a first substrate including control circuitry. The first substrate has a top surface and a bottom surface. The method also includes forming an insulating layer on the top surface of the first substrate, removing a first portion of the insulating layer so as to form a plurality of standoff structures, and bonding a second substrate to the first substrate. The method further includes thinning the second substrate to a predetermined thickness and forming a plurality of trenches in the second substrate. Each of the plurality of trenches extends to the top surface of the first substrate. Moreover, the method includes filling at least a portion of each of the plurality of trenches with a conductive material, forming the micro electromechanical device in the second substrate, and bonding a third substrate to the second substrate.

摘要翻译： 一种用于制造微机电装置的方法包括提供包括控制电路的第一基板。 第一衬底具有顶表面和底表面。 该方法还包括在第一衬底的顶表面上形成绝缘层，去除绝缘层的第一部分以形成多个间隔结构，并将第二衬底接合到第一衬底。 该方法还包括将第二衬底稀薄至预定厚度，并在第二衬底中形成多个沟槽。 多个沟槽中的每一个延伸到第一衬底的顶表面。 此外，该方法包括用导电材料填充多个沟槽中的每一个的至少一部分，在第二衬底中形成微机电器件，以及将第三衬底接合到第二衬底。

公开(公告)号：US08207004B2

公开(公告)日：2012-06-26

申请号：US12620872

申请日：2009-11-18

申请人： Dongmin Chen ,  Justin Payne ,  Li-Tien Tseng

发明人： Dongmin Chen ,  Justin Payne ,  Li-Tien Tseng

IPC分类号： H01L21/00

CPC分类号： G01C19/5719 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00238 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831

摘要： A method for fabricating a micro electromechanical device includes providing a first substrate including control circuitry. The first substrate has a top surface and a bottom surface. The method also includes forming an insulating layer on the top surface of the first substrate, removing a first portion of the insulating layer so as to form a plurality of standoff structures, and bonding a second substrate to the first substrate. The method further includes thinning the second substrate to a predetermined thickness and forming a plurality of trenches in the second substrate. Each of the plurality of trenches extends to the top surface of the first substrate. Moreover, the method includes filling at least a portion of each of the plurality of trenches with a conductive material, forming the micro electromechanical device in the second substrate, and bonding a third substrate to the second substrate.

摘要翻译： 一种用于制造微机电装置的方法包括提供包括控制电路的第一基板。 第一衬底具有顶表面和底表面。 该方法还包括在第一衬底的顶表面上形成绝缘层，去除绝缘层的第一部分以形成多个间隔结构，并将第二衬底接合到第一衬底。 该方法还包括将第二衬底稀薄至预定厚度，并在第二衬底中形成多个沟槽。 多个沟槽中的每一个延伸到第一衬底的顶表面。 此外，该方法包括用导电材料填充多个沟槽中的每一个的至少一部分，在第二衬底中形成微机电器件，以及将第三衬底接合到第二衬底。

公开(公告)号：US20100109102A1

公开(公告)日：2010-05-06

申请号：US12620872

申请日：2009-11-18

申请人： Dongmin Chen ,  Justin Payne ,  Li-Tien Tseng

发明人： Dongmin Chen ,  Justin Payne ,  Li-Tien Tseng

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： G01C19/5719 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00238 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831

摘要： A method for fabricating a micro electromechanical device includes providing a first substrate including control circuitry. The first substrate has a top surface and a bottom surface. The method also includes forming an insulating layer on the top surface of the first substrate, removing a first portion of the insulating layer so as to form a plurality of standoff structures, and bonding a second substrate to the first substrate. The method further includes thinning the second substrate to a predetermined thickness and forming a plurality of trenches in the second substrate. Each of the plurality of trenches extends to the top surface of the first substrate. Moreover, the method includes filling at least a portion of each of the plurality of trenches with a conductive material, forming the micro electromechanical device in the second substrate, and bonding a third substrate to the second substrate.

摘要翻译： 一种用于制造微机电装置的方法包括提供包括控制电路的第一基板。 第一衬底具有顶表面和底表面。 该方法还包括在第一衬底的顶表面上形成绝缘层，去除绝缘层的第一部分以形成多个间隔结构，并将第二衬底接合到第一衬底。 该方法还包括将第二衬底稀薄至预定厚度，并在第二衬底中形成多个沟槽。 多个沟槽中的每一个延伸到第一衬底的顶表面。 此外，该方法包括用导电材料填充多个沟槽中的每一个的至少一部分，在第二衬底中形成微机电器件，以及将第三衬底接合到第二衬底。

公开(公告)号：US20120228727A1

公开(公告)日：2012-09-13

申请号：US13480351

申请日：2012-05-24

申请人： Dongmin Chen ,  Justin Payne ,  Li-Tien Tseng

发明人： Dongmin Chen ,  Justin Payne ,  Li-Tien Tseng

IPC分类号： H01L29/84 ,  H01L21/02

CPC分类号： G01C19/5719 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00238 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831

摘要： A method for fabricating a micro electromechanical device includes providing a first substrate including control circuitry. The first substrate has a top surface and a bottom surface. The method also includes forming an insulating layer on the top surface of the first substrate, removing a first portion of the insulating layer so as to form a plurality of standoff structures, and bonding a second substrate to the first substrate. The method further includes thinning the second substrate to a predetermined thickness and forming a plurality of trenches in the second substrate. Each of the plurality of trenches extends to the top surface of the first substrate. Moreover, the method includes filling at least a portion of each of the plurality of trenches with a conductive material, forming the micro electromechanical device in the second substrate, and bonding a third substrate to the second substrate.

摘要翻译： 一种用于制造微机电装置的方法包括提供包括控制电路的第一基板。 第一衬底具有顶表面和底表面。 该方法还包括在第一衬底的顶表面上形成绝缘层，去除绝缘层的第一部分以形成多个间隔结构，并将第二衬底接合到第一衬底。 该方法还包括将第二衬底稀薄至预定厚度，并在第二衬底中形成多个沟槽。 多个沟槽中的每一个延伸到第一衬底的顶表面。 此外，该方法包括用导电材料填充多个沟槽中的每一个的至少一部分，在第二衬底中形成微机电器件，以及将第三衬底接合到第二衬底。

公开(公告)号：US20080000803A1

公开(公告)日：2008-01-03

申请号：US11770468

申请日：2007-06-28

申请人： Li-Tien Tseng ,  Chun-Jung Tsuo ,  Ting-Hui Chih

发明人： Li-Tien Tseng ,  Chun-Jung Tsuo ,  Ting-Hui Chih

IPC分类号： B65D81/02

CPC分类号： B65D81/1075 ,  B65D81/113

摘要： A packing system is provided. The packing system includes a box, a partition, and a first article and a second article to be packed. The box has an inner space. The partition is movably disposed within the inner space and divides the inner space into a first space and a second space. The second article is stored in the second space. The first article is partially compressed and contained in the first space. The first article is in contact with the partition to support the partition and absorb a shock and movement of the partition, and therefore reduce the possible damage occurred on the second article.

摘要翻译： 提供包装系统。 包装系统包括盒子，分隔件以及待包装的第一制品和第二制品。 盒子有一个内部空间。 分隔件可移动地设置在内部空间内并将内部空间分成第一空间和第二空间。 第二篇文章存储在第二个空格中。 第一篇文章被部分压缩并包含在第一个空格中。 第一个物品与分隔件接触以支撑隔板并吸收隔板的冲击和运动，因此减少了在第二物品上发生的可能的损坏。

公开(公告)号：US20070247795A1

公开(公告)日：2007-10-25

申请号：US11697897

申请日：2007-04-09

申请人： Li-Tien Tseng

发明人： Li-Tien Tseng

IPC分类号： G06F1/16

CPC分类号： F16M11/046 ,  F16M2200/047

摘要： The invention provides a height adjustable support apparatus and a display with the same. The height adjustable support apparatus includes a frame device, a slide member, a supporting device, and a constant force device, and a vertical direction is defined on the frame device. The frame device provides a first slide along the vertical direction. The slide member is engaged within the frame device and deviates from the vertical direction in an angle θ and provides a second slide. The supporting device includes a supporting member for mounting an object, a clamping member for clamping the constant force device, and a guide member for sliding within the first slide. The constant force device urges against the second slide via a compressible rod. The object together with the supporting device and the constant force device are moved upward or downward by applying an external force on the object to make the compressible rod compressed or released.

摘要翻译： 本发明提供了一种高度可调的支撑装置和具有该支撑装置的显示器。 高度可调节支撑装置包括框架装置，滑动构件，支撑装置和恒力装置，并且在框架装置上限定垂直方向。 框架装置沿垂直方向提供第一滑动件。 滑动构件接合在框架装置内并以角度θ离开垂直方向并提供第二滑动件。 支撑装置包括用于安装物体的支撑构件，用于夹紧恒力装置的夹紧构件和用于在第一滑动件内滑动的引导构件。 恒力装置通过可压缩的杆推动抵靠第二滑块。 通过在物体上施加外力使物体与支撑装置和恒力装置一起向上或向下移动，以使可压缩杆被压缩或释放。

公开(公告)号：US20110049652A1

公开(公告)日：2011-03-03

申请号：US12860655

申请日：2010-08-20

申请人： Hua-Shu Wu ,  Yu-Hao Chien ,  Shih-Yung Chung ,  Li-Tien Tseng ,  Yu-Te Yeh

发明人： Hua-Shu Wu ,  Yu-Hao Chien ,  Shih-Yung Chung ,  Li-Tien Tseng ,  Yu-Te Yeh

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： B81C1/00246 ,  B81B2201/0235 ,  B81B2207/015 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/0735

摘要： A micro electro-mechanical (MEMS) device assembly is provided. The MEMS device assembly includes a first substrate that has a plurality of electronic devices, a plurality of first bonding regions, and a plurality of second bonding regions. The MEMS device assembly also includes a second substrate that is bonded to the first substrate at the plurality of first bonding regions. A third substrate having a recessed region and a plurality of standoff structures is disposed over the second substrate and bonded to the first substrate at the plurality of second bonding regions. The plurality of first bonding regions provide a conductive path between the first substrate and the second substrate and the plurality of the second bonding regions provide a conductive path between the first substrate and the third substrate.

摘要翻译： 提供了微机电（MEMS）装置组件。 MEMS器件组件包括具有多个电子器件的第一衬底，多个第一接合区域和多个第二接合区域。 MEMS器件组件还包括在多个第一接合区域处接合到第一衬底的第二衬底。 具有凹陷区域和多个间隔结构的第三基板设置在第二基板上并且在多个第二接合区域处接合到第一基板。 多个第一接合区域在第一基板和第二基板之间提供导电路径，并且多个第二接合区域在第一基板和第三基板之间提供导电路径。

公开(公告)号：US07804682B2

公开(公告)日：2010-09-28

申请号：US11679185

申请日：2007-02-27

申请人： Li-Tien Tseng

发明人： Li-Tien Tseng

IPC分类号： H05K7/12

CPC分类号： F16M11/2064 ,  F16M11/105 ,  F16M2200/024 ,  Y10S248/917

摘要： A positioning device includes a fixing component including an arc slot with an end. A positioning plate is connected to the fixing component in a rotatable manner relative to the fixing component. The positioning plate includes a pillar positioned within the arc slot. The positioning device further includes a stopper positioned near on the end for stopping the pillar when the pillar slides near the end. A portion of the stopper protrudes over the arc slot to limit a rotational range of the positioning plate relative to the fixing component.

摘要翻译： 定位装置包括固定部件，其包括具有一端的弧槽。 定位板相对于固定部件以可旋转的方式连接到固定部件。 定位板包括定位在弧槽内的支柱。 定位装置还包括一个止动件，该止动件位于靠近端部的位置，以便当支柱在靠近末端的位置上滑动时停止支柱。 止动件的一部分突出在弧槽上，以限制定位板相对于固定部件的旋转范围。

公开(公告)号：US07621490B2

公开(公告)日：2009-11-24

申请号：US12040061

申请日：2008-02-29

申请人： Li-Tien Tseng

发明人： Li-Tien Tseng

IPC分类号： F16M11/00

CPC分类号： F16M11/18 ,  F16M11/046 ,  F16M2200/047 ,  Y10S248/917

摘要： A height adjustable holding apparatus for supporting a display comprises a holding component, a moving component, an elastic component, an active component, a first rolling component, a driven component, a second rolling component, a first cable and a second cable. The moving component is movable along the holding component. The display is connected to the moving component and is movable along the holding component. The elastic component is disposed in one end of the holding component and is stretchable along the moving direction of the moving component. When the moving component generates a first displacement, the first cable drives the active component to rotate together with the driven component. The second rolling component rolls back the second cable and makes the elastic component to generate a second displacement smaller than the first displacement.

摘要翻译： 用于支撑显示器的高度可调保持装置包括保持部件，移动部件，弹性部件，有源部件，第一滚动部件，从动部件，第二滚动部件，第一缆线和第二缆线。 移动部件沿着保持部件移动。 显示器连接到移动部件并且可沿着保持部件移动。 弹性部件设置在保持部件的一端，并且沿着移动部件的移动方向是可拉伸的。 当移动部件产生第一位移时，第一缆线驱动有源部件与驱动部件一起旋转。 第二滚动部件回滚第二缆线并使弹性部件产生小于第一位移的第二位移。

公开(公告)号：US20080048959A1

公开(公告)日：2008-02-28

申请号：US11894109

申请日：2007-08-20

申请人： Li-Tien Tseng

发明人： Li-Tien Tseng

IPC分类号： A47F7/00 ,  G09G3/36

CPC分类号： F16M11/10 ,  F16M2200/024 ,  F16M2200/041 ,  F16M2200/08

摘要： A support structure includes a base and a support unit. The base has a restricting member for restricting movement of a lower portion of the display device with respect to the base. The support unit includes a pivot unit and a support plate. The pivot unit is disposed on the base at a location rearward from the restricting member. The support plate has a lower part pivoted to the pivot unit and an upper part abutting against the display device so as to dispose the display device at a predetermined angle with respect to the base.

摘要翻译： 支撑结构包括基座和支撑单元。 基座具有用于限制显示装置的下部相对于基座的移动的限制构件。 支撑单元包括枢轴单元和支撑板。 枢轴单元在距离限制构件的后方的位置处设置在基座上。 支撑板具有枢转到枢转单元的下部和抵靠显示装置的上部，以将显示装置相对于基部布置成预定角度。