公开(公告)号：US07203390B2

公开(公告)日：2007-04-10

申请号：US11200696

申请日：2005-08-10

申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

IPC分类号： G02B6/12

CPC分类号： G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

摘要翻译： 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。

公开(公告)号：US06945708B2

公开(公告)日：2005-09-20

申请号：US10368195

申请日：2003-02-18

申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

IPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/122 ,  G02B6/34 ,  H01S5/022

CPC分类号： G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

摘要翻译： 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。

公开(公告)号：US06606425B1

公开(公告)日：2003-08-12

申请号：US10100277

申请日：2002-03-18

申请人： Douglas E. Crafts ,  Kenzo Ishida ,  David J. Chapman ,  Duane Cook ,  James F. Farrell ,  Suresh Ramalingam ,  Steven M. Swain

发明人： Douglas E. Crafts ,  Kenzo Ishida ,  David J. Chapman ,  Duane Cook ,  James F. Farrell ,  Suresh Ramalingam ,  Steven M. Swain

IPC分类号： G02B612

CPC分类号： G02B6/12026 ,  G02B6/4253 ,  G02B6/4273

摘要： An optical component package, in which a transfer molded layer of material (e.g., syntactic foam in one embodiment) is formed at least partially around, or entirely around, the optical component to provide structural and thermal insulation around the component. The optical component may be a planar lightwave circuit (PLC), with a protective passivation layer formed between the PLC and the layer of syntactic foam, to de-couple stresses and thermal transfer between the PLC and the layer of syntactic foam. Strengthening caps, fiber assemblies, and a heater may be provided with the PLC assembly, around which the layer of syntactic foam can also be formed. The protective passivation layer can also be formed between these structures and the syntactic foam; in one embodiment between at least two strengthening caps formed on opposing edges of the PLC. The disclosed package provides numerous structural, thermal and size benefits.

摘要翻译： 一种光学部件封装，其中材料的转移模制层（例如，一个实施例中的复合泡沫）至少部分地围绕或完全围绕光学部件形成，以在部件周围提供结构和隔热。 光学部件可以是平面光波电路（PLC），在PLC和复合泡沫层之间形成保护钝化层，以解除PLC和复合泡沫层之间的应力和热传递。 可以提供加强盖，纤维组件和加热器，PLC组件也可以形成层压泡沫层。 保护钝化层也可以在这些结构和复合泡沫之间形成; 在一个实施例中，在形成在PLC的相对边缘上的至少两个加强盖之间。 所公开的封装提供了许多结构，热和尺寸的优点。

公开(公告)号：US06907147B2

公开(公告)日：2005-06-14

申请号：US09821935

申请日：2001-03-30

申请人： Douglas E. Crafts ,  Duane Cook ,  Arne Schonert ,  Steve Swain

发明人： Douglas E. Crafts ,  Duane Cook ,  Arne Schonert ,  Steve Swain

IPC分类号： G02B6/00 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42

CPC分类号： G02B6/3616 ,  G02B6/3636 ,  G02B6/3644 ,  G02B6/3803 ,  G02B6/3812 ,  G02B6/3837 ,  G02B6/4216

摘要： A capillary has an opening of a dimension for accommodating an insertion of a first and second optical fiber, a clamp to provide a clamping force to the capillary to removably couple the capillary to the clamp, and a capillary rotator removably coupled to the capillary to apply a rotational force to the capillary which is greater than the capillary force, to rotate the capillary to a selected position. An optical fiber rotator can be disposed adjacent to the first optical fiber to rotate the first optical fiber such that the first optical fiber has a selected orientation with respect to the second optical fiber.

摘要翻译： 毛细管具有用于容纳第一和第二光纤插入的尺寸的开口，夹具以向毛细管提供夹紧力以将毛细管可拆卸地连接到夹具，以及毛细管旋转器，其可移除地联接到毛细管以施加 对毛细管的旋转力大于毛细管力，以将毛细管旋转到选定位置。 光纤旋转器可以布置成与第一光纤相邻，以旋转第一光纤，使得第一光纤相对于第二光纤具有选定的取向。

公开(公告)号：US20060001310A1

公开(公告)日：2006-01-05

申请号：US11171930

申请日：2005-06-30

申请人： Douglas Crafts ,  Steve Swain ,  Duane Cook ,  Gilbert Rothweiler

发明人： Douglas Crafts ,  Steve Swain ,  Duane Cook ,  Gilbert Rothweiler

IPC分类号： B60B1/00

CPC分类号： B60B3/16

摘要： A lug bolt adapted for use on an automobile having at least a double lead to decrease the number turns a lug nut requires to screw the lug nut onto the lug bolt. The lug bolt may comprise a triple or quadruple lead, or even more leads. A racing automobile may be provided having the lug bolt for the mounting of a wheel thereon using a correspondingly-leaded lug nut. The racing automobile may be a NASCAR automobile, in one embodiment.

摘要翻译： 适用于具有至少双引线以减少数量的汽车上的凸耳螺栓需要将凸耳螺母拧到凸耳螺栓上。 凸耳螺栓可以包括三重或四重引线，或甚至更多引线。 可以提供具有用于使用相应引线的凸耳螺母来安装车轮的凸耳螺栓的赛车。 在一个实施例中，赛车可能是NASCAR汽车。

公开(公告)号：US20050100261A1

公开(公告)日：2005-05-12

申请号：US09821935

申请日：2001-03-30

申请人： Douglas Crafts ,  Duane Cook ,  Arne Schonert ,  Steve Swain

发明人： Douglas Crafts ,  Duane Cook ,  Arne Schonert ,  Steve Swain

IPC分类号： G02B6/00 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42

CPC分类号： G02B6/3616 ,  G02B6/3636 ,  G02B6/3644 ,  G02B6/3803 ,  G02B6/3812 ,  G02B6/3837 ,  G02B6/4216

摘要： A capillary has an opening of a dimension for accommodating an insertion of a first and a second optical fiber, a clamp to provide a clamping force to the capillary to removably couple the capillary to the clamp, and a capillary rotator removably coupled to the capillary to apply a rotational force to the capillary which is greater than the capillary force, to rotate the capillary to a selected position. An optical fiber rotator can be disposed adjacent to the first optical fiber to rotate the first optical fiber such that the first optical fiber has a selected orientation with respect to the second optical fiber.

摘要翻译： 毛细管具有用于容纳第一和第二光纤的插入的尺寸的开口，夹具以向毛细管提供夹紧力以将毛细管可拆卸地联接到夹具，以及可拆卸地联接到毛细管的毛细管旋转器， 对大于毛细管力的毛细管施加旋转力，以将毛细管旋转到选定位置。 光纤旋转器可以布置成与第一光纤相邻，以旋转第一光纤，使得第一光纤相对于第二光纤具有选定的取向。

公开(公告)号：US06331446B1

公开(公告)日：2001-12-18

申请号：US09261648

申请日：1999-03-03

申请人： Duane Cook ,  Venkatesan Murali ,  Suresh Ramalingam ,  Nagesh Vodrahalli

发明人： Duane Cook ,  Venkatesan Murali ,  Suresh Ramalingam ,  Nagesh Vodrahalli

IPC分类号： H01L2144

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A partial gel step in the underfilling of an integrated circuit that is mounted to a substrate. The process involves dispensing a first underfill material and then heating the underfill material to a partial gel state. The partial gel step may reduce void formation and improve adhesion performance during moisture loading.

摘要翻译： 在安装到基板上的集成电路的底部填充中的部分凝胶步骤。 该方法包括分配第一底部填充材料，然后将底部填充材料加热至部分凝胶状态。 部分凝胶步骤可以减少空隙形成并改善湿气加载期间的粘附性能。

公开(公告)号：US20060034561A1

公开(公告)日：2006-02-16

申请号：US11200696

申请日：2005-08-10

申请人： Douglas Crafts ,  James Farrell ,  Mark Farrelly ,  Duane Cook ,  Satyanarayana Peddada

发明人： Douglas Crafts ,  James Farrell ,  Mark Farrelly ,  Duane Cook ,  Satyanarayana Peddada

IPC分类号： G02B6/12

CPC分类号： G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

摘要翻译： 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。

公开(公告)号：US07141448B2

公开(公告)日：2006-11-28

申请号：US09874666

申请日：2001-06-05

申请人： Suresh Ramalingam ,  Venkatesan Murali ,  Duane Cook

发明人： Suresh Ramalingam ,  Venkatesan Murali ,  Duane Cook

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： An integrated circuit package which may include the dispense of a second encapsulant material (or fillet) different from the first underfill material on an integrated circuit package which may include an integrated circuit that is mounted to a substrate. The package may further have a first underfill material and a second underfill material that are attached to the integrated circuit and the substrate. The second encapsulant material may be tailored to inhibit cracking of the epoxy itself that propagates into the substrate during thermo-mechanical loading.

公开(公告)号：US06528345B1

公开(公告)日：2003-03-04

申请号：US09262132

申请日：1999-03-03

申请人： Duane Cook ,  Suresh Ramalingam

发明人： Duane Cook ,  Suresh Ramalingam

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A high throughput process line and method for underfilling an integrated circuit that is mounted to a substrate. The process line includes a first dispensing station that dispenses a first underfill material onto the substrate and an oven which moves the substrate while the underfill material flows between the integrated circuit and the substrate. The process line removes flow time (wicking time) as the bottleneck for achieving high throughput.

摘要翻译： 用于底部填充安装到基板的集成电路的高通量处理线和方法。 工艺线包括第一分配工位，其将第一底部填充材料分配到衬底上;以及烘箱，其在衬底材料在集成电路和衬底之间流动的同时移动衬底。 流程线将流动时间（芯吸时间）作为实现高吞吐量的瓶颈。