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23 条记录 (耗时 0.027 秒)

    Planar lightwave circuit package
    1.
    发明授权
    Planar lightwave circuit package 有权
    平面光波电路封装

    公开(公告)号：US07203390B2

    公开(公告)日：2007-04-10

    申请号：US11200696

    申请日：2005-08-10

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    IPC分类号： G02B6/12

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

    摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

    摘要翻译： 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。

    Planar lightwave circuit package
    2.
    发明授权
    Planar lightwave circuit package 失效
    平面光波电路封装

    公开(公告)号：US06945708B2

    公开(公告)日：2005-09-20

    申请号：US10368195

    申请日：2003-02-18

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

    IPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/122 ,  G02B6/34 ,  H01S5/022

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

    摘要： An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

    摘要翻译： 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。

    Redundant package for optical components
    4.
    发明授权
    Redundant package for optical components 有权
    用于光学元件的冗余封装

    公开(公告)号：US06486440B1

    公开(公告)日：2002-11-26

    申请号：US09901474

    申请日：2001-07-09

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam

    IPC分类号： H05B100

    CPC分类号： G02B6/30 ,  G02B6/1203 ,  G02B6/36

    摘要： A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

    摘要翻译： 用于光学部件的冗余封装包括封装光学部件的内部封装以及封装内部封装的外部封装。 加热器可以靠近光学部件设置在内部包装件中以控制其温度，并且为了保持该温度控制，外部包装围绕内部包装形成隔离的空气袋，其将内部包装与外部环境绝热。 外包装由具有低导热性的材料形成，以促进该绝缘功能。 如果光学组件包括平面光波电路（PLC），例如阵列波导光栅（AWG），则该封装是特别有用的，其需要严格的温度控制和结构完整性来维持光路的完整性。

    Package for optical components
    5.
    发明授权
    Package for optical components 有权
    光学元件封装

    公开(公告)号：US06664511B2

    公开(公告)日：2003-12-16

    申请号：US10281876

    申请日：2002-10-28

    申请人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam ,  Kenzo Ishida

    发明人： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Suresh Ramalingam ,  Kenzo Ishida

    IPC分类号： H05B100

    CPC分类号： G02B6/30 ,  G02B6/1203 ,  G02B6/36

    摘要： A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

    摘要翻译： 用于光学部件的封装包括封装光学部件的内部封装以及封装内部封装的外部封装。 加热器可以在靠近光学部件的内部包装件中设置以控制其温度，并且为了保持该温度控制，外部包装围绕内部包装形成隔离的空气袋，其将内部包装与外部环境热绝缘。 外包装由具有低导热性的材料形成，以促进该绝缘功能。 如果光学部件包括平面光波电路（PLC），例如， 阵列波导光栅（AWG），其需要严格的温度控制和结构完整性来维持光路的完整性。

    Transfer molded packages with embedded thermal insulation
    6.
    发明授权
    Transfer molded packages with embedded thermal insulation 有权
    具有嵌入式保温的转移成型包装

    公开(公告)号：US06606425B1

    公开(公告)日：2003-08-12

    申请号：US10100277

    申请日：2002-03-18

    申请人： Douglas E. Crafts ,  Kenzo Ishida ,  David J. Chapman ,  Duane Cook ,  James F. Farrell ,  Suresh Ramalingam ,  Steven M. Swain

    发明人： Douglas E. Crafts ,  Kenzo Ishida ,  David J. Chapman ,  Duane Cook ,  James F. Farrell ,  Suresh Ramalingam ,  Steven M. Swain

    IPC分类号： G02B612

    CPC分类号： G02B6/12026 ,  G02B6/4253 ,  G02B6/4273

    摘要： An optical component package, in which a transfer molded layer of material (e.g., syntactic foam in one embodiment) is formed at least partially around, or entirely around, the optical component to provide structural and thermal insulation around the component. The optical component may be a planar lightwave circuit (PLC), with a protective passivation layer formed between the PLC and the layer of syntactic foam, to de-couple stresses and thermal transfer between the PLC and the layer of syntactic foam. Strengthening caps, fiber assemblies, and a heater may be provided with the PLC assembly, around which the layer of syntactic foam can also be formed. The protective passivation layer can also be formed between these structures and the syntactic foam; in one embodiment between at least two strengthening caps formed on opposing edges of the PLC. The disclosed package provides numerous structural, thermal and size benefits.

    摘要翻译： 一种光学部件封装，其中材料的转移模制层（例如，一个实施例中的复合泡沫）至少部分地围绕或完全围绕光学部件形成，以在部件周围提供结构和隔热。 光学部件可以是平面光波电路（PLC），在PLC和复合泡沫层之间形成保护钝化层，以解除PLC和复合泡沫层之间的应力和热传递。 可以提供加强盖，纤维组件和加热器，PLC组件也可以形成层压泡沫层。 保护钝化层也可以在这些结构和复合泡沫之间形成; 在一个实施例中，在形成在PLC的相对边缘上的至少两个加强盖之间。 所公开的封装提供了许多结构，热和尺寸的优点。

    Thin film photovoltaic module having a lamination layer for enhanced reflection and photovoltaic output
    7.
    发明申请
    Thin film photovoltaic module having a lamination layer for enhanced reflection and photovoltaic output 审中-公开
    具有用于增强反射和光伏输出的叠层的薄膜光伏模块

    公开(公告)号：US20110017293A1

    公开(公告)日：2011-01-27

    申请号：US12584079

    申请日：2009-08-31

    申请人： James F. Farrell ,  Satyanarayana Rao Peddada

    发明人： James F. Farrell ,  Satyanarayana Rao Peddada

    IPC分类号： H01L31/18 ,  H01L31/00

    CPC分类号： H01L31/0445 ,  H01L31/048 ,  H02S40/22 ,  H02S40/42 ,  Y02E10/52

    摘要： An improved thin film PV module and simplified fabrication process are provided that achieve higher PV module efficiency, while eliminating expensive process steps, and reducing the capital cost of thin film processing equipment. A lamination material, characterized by high reflectivity as well as thermal conductivity and emissivity, is provided directly adjacent the active region of a thin film stack, eliminating the need for complex sputtering or deposition process steps ordinarily required for providing a reflective layer. The lamination material reflects unabsorbed light back into the thin film stack, thereby increasing photocurrent generation, and obviating the need for a reflective metallization layer. The lamination layer and back sheet for sealing the light-absorbing stack against the ingress of moisture also can be applied in a single process step.

    摘要翻译： 提供了改进的薄膜光伏组件和简化的制造工艺，其实现了更高的光伏组件效率，同时消除了昂贵的工艺步骤，并降低了薄膜加工设备的投资成本。 直接邻近薄膜叠层的有源区域提供特征在于具有高反射率以及热导率和发射率的层压材料，从而不需要为提供反射层通常需要的复杂溅射或沉积工艺步骤。 层压材料将未吸收的光反射回薄膜堆叠中，从而增加光电流产生，并且消除了对反射性金属化层的需要。 用于将光吸收堆叠与水分进入密封的层压层和背板也可以在单个工艺步骤中应用。

    Photovoltaic module with conductive cooling and enhanced reflection
    8.
    发明申请
    Photovoltaic module with conductive cooling and enhanced reflection 审中-公开
    具有导电冷却和增强反射的光伏模块

    公开(公告)号：US20110017265A1

    公开(公告)日：2011-01-27

    申请号：US12583888

    申请日：2009-08-26

    申请人： James F. Farrell ,  Satyanarayana Rao Peddada

    发明人： James F. Farrell ,  Satyanarayana Rao Peddada

    IPC分类号： H01L31/052

    CPC分类号： H01L31/02327 ,  H01L31/0488 ,  H01L31/052 ,  H02S40/42 ,  Y02E10/50

    摘要： A thermally conductive material is provided adjacent to or close to the active light-absorbing surface in silicon PV modules made with x-Si or p-Si cells or in thin film PV modules. The material is characterized by high thermal conduction and emissivity as well as high reflectance with respect to the solar spectrum. An exterior portion of the thermally conductive material is wrapped around the rearward facing, shaded surface of the PV module, thereby defining a thermal gradient for conduction of heat from the interior of the PV module to the cooler exterior, where heat is dissipated into the ambient surroundings. The thermally conductive, highly reflective material may be incorporated in or otherwise integrated with a lamination material used to adhere the back sheet to the front sheet of a thin film PV module.

    摘要翻译： 在由x-Si或p-Si电池或薄膜光伏组件制成的硅PV模块中靠近或接近有源吸光表面设置导热材料。 该材料的特征在于高的热传导和发射率以及相对于太阳光谱的高反射率。 导热材料的外部部分缠绕在PV模块的面向后方的阴影表面上，从而限定了用于将热量从PV模块的内部传导到较冷的外部的热梯度，其中热消散到环境中 周围环境 导热高反射材料可以结合在用于将背片粘附到薄膜PV模块的前片上的层压材料中或以其它方式集成。

    Scanning spectrometer with multiple photodetectors
    10.
    发明授权
    Scanning spectrometer with multiple photodetectors 有权
    具有多个光电探测器的扫描光谱仪

    公开(公告)号：US07852475B2

    公开(公告)日：2010-12-14

    申请号：US12189993

    申请日：2008-08-12

    申请人： Douglas E. Crafts ,  Jinxi Shen ,  Philip Duggan ,  James F. Farrell ,  Barthelemy Fondeur ,  Eliseo Ranalli

    发明人： Douglas E. Crafts ,  Jinxi Shen ,  Philip Duggan ,  James F. Farrell ,  Barthelemy Fondeur ,  Eliseo Ranalli

    IPC分类号： G01J3/28

    CPC分类号： G01J3/2803 ,  G01J3/18 ,  G02B6/12019

    摘要： A scanning optical spectrometer with a detector array is disclosed, in which position of focused spot of light at the input of a dispersive element such as arrayed waveguide grating (AWG) with a slab input, is scanned using a micro-electro-mechanical (MEMS) tiltable micromirror so as to make the dispersed spectrum of light scan over the detector array coupled to the AWG. Sub-spectra recorded using individual detectors are concatenated by a processor unit to obtain the spectrum of input light.

    摘要翻译： 公开了一种具有检测器阵列的扫描光谱仪，其中使用微机电（MEMS）扫描在诸如具有板输入的阵列波导光栅（AWG）等分散元件的输入处的聚焦光点的位置 ）可倾斜微镜，以便使光的分散光谱扫描耦合到AWG的检测器阵列。 使用各个检测器记录的子光谱由处理器单元连接以获得输入光的光谱。