公开(公告)号：US20230249313A9

公开(公告)日：2023-08-10

申请号：US17099571

申请日：2020-11-16

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hirotaka Satori ,  Makoto Kashiwagi ,  Manato Furusawa

IPC: B24B37/32 ,  H01L21/683

CPC classification number: B24B37/32 ,  H01L21/6838

Abstract: Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.

公开(公告)号：US20210354262A1

公开(公告)日：2021-11-18

申请号：US17319559

申请日：2021-05-13

Applicant: EBARA CORPORATION

Inventor： Hirotaka Satori ,  Yu Ishii ,  Toshifumi Kimba ,  Masaki Kinoshita

IPC: B24B37/005 ,  B24B37/34 ,  B24B37/04

Abstract: Provided is a technique capable of suppressing a shortage of a light amount of a reflected light from wiring patterns even when a film thickness of a film is thick. A film thickness measurement apparatus 30 is applicable to a polishing apparatus 10 for polishing a film 202 of a substrate 200. The film 202 includes a plurality of wiring patterns. The film thickness measurement apparatus 30 includes a light emitter 43 configured to project an emitted light L1 during polishing of the film by the polishing apparatus, an optical condenser 44 configured to condense the emitted light projected from the light emitter to provide a predetermined spot size D and project the light onto the film, and a light receiver 45 configured to receive a reflected light L2 reflected from the film. The predetermined spot size is smaller than a minimum width of respective wiring patterns constituting the plurality of wiring patterns.

公开(公告)号：US20210170541A1

公开(公告)日：2021-06-10

申请号：US17072870

申请日：2020-10-16

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Tetsuji Togawa ,  Atsushi Yoshida

IPC: B24B37/005 ,  B24B49/16

Abstract: A polishing method capable of accurately determining a polishing end point of a substrate is disclosed. The method comprises: rotating a polishing table supporting a polishing pad; and polishing the substrate by pressing the substrate against a polishing surface of the polishing pad by a polishing head, wherein polishing the substrate includes: an oscillation polishing process of polishing the substrate while causing the polishing head to oscillate along the polishing surface; and a static polishing process of polishing the substrate with the oscillation of the polishing head stopped, the static polishing process is performed after the oscillation polishing process, and the static polishing process comprises determining a static polishing end point which is a point in time at which a rate of change of torque for rotating the polishing table has reached a change-rate threshold value.

公开(公告)号：US10651057B2

公开(公告)日：2020-05-12

申请号：US15583327

申请日：2017-05-01

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Yu Ishii ,  Keisuke Uchiyama

IPC: H01L21/02 ,  H01L21/67 ,  B08B1/00 ,  H01L21/304 ,  B08B3/04 ,  B08B1/04

Abstract: An apparatus which can remove particles, such as polishing debris, from a back surface with high removal efficiency is provided. The apparatus includes: a substrate holder configured to rotate the substrate while holding the substrate with the back surface facing upward; a scrub cleaning tool configured to be rotatable; a two-fluid nozzle disposed above the substrate holder; and a housing defining a cleaning chamber in which the substrate holder, the scrub cleaning tool, and the two-fluid nozzle are located.

公开(公告)号：US10376929B2

公开(公告)日：2019-08-13

申请号：US15647829

申请日：2017-07-12

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Masayuki Nakanishi ,  Keisuke Uchiyama

IPC: B24B37/013 ,  B24B37/10 ,  B24B37/30 ,  B08B1/04 ,  B24B37/04 ,  H01L21/687 ,  H01L21/304 ,  H01L21/67 ,  B24B27/033 ,  B24B41/06 ,  B24B49/08 ,  B24D7/06 ,  B24B7/22

Abstract: An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.

公开(公告)号：US10016875B2

公开(公告)日：2018-07-10

申请号：US15163064

申请日：2016-05-24

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Masayuki Nakanishi ,  Kenya Ito

IPC: B24D11/00 ,  B05D5/02

CPC classification number: B24D11/003 ,  B05D5/02 ,  B24D11/00 ,  B24D11/001

Abstract: A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.

公开(公告)号：US09566616B2

公开(公告)日：2017-02-14

申请号：US14315283

申请日：2014-06-25

Applicant: EBARA CORPORATION

Inventor： Tetsuji Togawa ,  Kenya Ito ,  Yu Ishii ,  Keisuke Uchiyama

IPC: B08B1/04 ,  H01L21/304 ,  H01L21/687 ,  B08B1/00 ,  H01L21/67

CPC classification number: B08B1/04 ,  B08B1/001 ,  B08B1/006 ,  B24B37/10 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/687 ,  H01L21/68728

Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

Abstract translation: 公开了一种能够检测由流体支撑的诸如晶片的基板是否适当地存在于预定处理位置中的基板处理装置。 衬底处理装置包括至少一个距离传感器，其构造成测量洗涤器和静水支撑结构之间的距离; 以及处理控制器，被配置为从所述距离的测量值计算所述静液压支撑结构和所述基板的表面之间的间隙，并且确定所述间隙是否落在预定范围内。

公开(公告)号：US10854473B2

公开(公告)日：2020-12-01

申请号：US15909758

申请日：2018-03-01

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Kenya Ito ,  Keisuke Uchiyama ,  Masayuki Nakanishi

IPC: H01L21/461 ,  H01L21/68 ,  B24B37/10 ,  B24B37/005 ,  G06F9/06 ,  H01L21/02

Abstract: A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.

公开(公告)号：US10799917B2

公开(公告)日：2020-10-13

申请号：US16405559

申请日：2019-05-07

Applicant: EBARA CORPORATION ,  TOSHIBA MEMORY CORPORATION

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

IPC: B08B1/00 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

公开(公告)号：US20200094371A1

公开(公告)日：2020-03-26

申请号：US16575844

申请日：2019-09-19

Applicant: EBARA CORPORATION

Inventor： Kenichi Akazawa ,  Makoto Kashiwagi ,  Yu Ishii ,  Atsushi Yoshida ,  Kenichi Kobayashi ,  Tetsuji Togawa ,  Hozumi Yasuda

IPC: B24B37/10 ,  B24B41/06 ,  B24B49/16

Abstract: Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.