公开(公告)号：US20240293897A1

公开(公告)日：2024-09-05

申请号：US18663649

申请日：2024-05-14

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Patrick RIECHEL ,  Mark UNRATH ,  Jake ROBERTS ,  Joseph HASTY

IPC: B23K26/70 ,  B23K26/03 ,  B23K26/067 ,  B23K26/08 ,  B23K26/082 ,  B65H18/10 ,  G02B27/10 ,  G02F1/33

CPC classification number: B23K26/705 ,  B23K26/032 ,  B23K26/067 ,  B23K26/082 ,  B23K26/083 ,  B65H18/103 ,  G02B27/108 ,  G02F1/33

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.

公开(公告)号：US20240017350A1

公开(公告)日：2024-01-18

申请号：US18253838

申请日：2021-11-23

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Jan KLEINERT ,  Ruolin CHEN ,  James BROOKHYSER ,  Mark UNRATH ,  Honghua HU

IPC: B23K26/0622 ,  B23K26/03

CPC classification number: B23K26/0622 ,  B23K26/03 ,  B23K2101/42

Abstract: A laser-processing apparatus can carry out a process to form a via in a workpiece, having a first material formed on a second material, by directing laser energy onto the workpiece such that the laser energy is incident upon the first material, wherein the laser energy has a wavelength to which the first material is more reflective than the second material. The apparatus can include a back-reflection sensing system operative to capture a back-reflection signal corresponding to a portion of laser energy directed to the workpiece and reflected by the first material and generate a sensor signal based on the captured back-reflection signal; and a controller communicatively coupled to an output of the back-reflection sensing system, wherein the controller is operative to control a remainder of the process by which the via is formed based on the sensor signal.

公开(公告)号：US20230415264A1

公开(公告)日：2023-12-28

申请号：US18251616

申请日：2021-10-07

Applicant: Electro Scientific Industries, Inc.

Inventor： Corie NEUFELD ,  Zachary DUNN ,  Timothy NUCKOLLS ,  Jeremy WILLEY

IPC: B23K26/142 ,  B23K26/70

CPC classification number: B23K26/142 ,  B23K26/702

Abstract: A laser-processing apparatus is disclosed. In one embodiment, the laser-processing apparatus includes a debris removal system with an integrated beam dump system, the beam dump system operative to selectively position an absorber within the beam path of a beam of laser energy. The beam dump system may allow the beam of laser energy to propagate through the scan lens of the laser-processing apparatus, but prevent the beam of laser energy from processing a workpiece. The beam dump system may include an actuator assembly operative to retract the absorber from the beam path, thereby allowing the beam to propagate to the workpiece and for debris from laser processing to be drawn into a vacuum nozzle, thereby preventing damage to the scan lens. The beam dump system may further include a heat transfer system operative to control the rate of heat transferred away from the absorber.

公开(公告)号：US11738405B2

公开(公告)日：2023-08-29

申请号：US16505422

申请日：2019-07-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark A. Unrath ,  William J. Jordens ,  James Ismail ,  Hisashi Matsumoto ,  Brian J. Lineburg

IPC: B23K26/03 ,  B23K26/082 ,  B23K26/06 ,  B23K26/08 ,  B23K26/046 ,  B23K26/40 ,  B23K103/00 ,  B23K101/40

CPC classification number: B23K26/032 ,  B23K26/046 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/08 ,  B23K26/082 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

Abstract: A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece.

公开(公告)号：US11705686B2

公开(公告)日：2023-07-18

申请号：US16636605

申请日：2018-09-20

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： James Brookhyser ,  Jan Kleinert ,  Jered Richter ,  Kurt Eaton

IPC: H01S3/106 ,  G02F1/33 ,  G02F1/29 ,  G02B6/42 ,  G02F1/00 ,  H01S5/12 ,  H01S5/14 ,  G02B26/06

CPC classification number: H01S3/1068 ,  G02B6/42 ,  G02B26/06 ,  G02F1/00 ,  G02F1/292 ,  G02F1/33 ,  H01S5/124 ,  H01S5/145

Abstract: A beam positioner can be broadly characterized as including a first acousto-optic (AO) deflector (AOD) operative to diffract an incident beam of linearly polarized laser light, wherein the first AOD has a first diffraction axis and wherein the first AOD is oriented such that the first diffraction axis has a predetermined spatial relationship with the plane of polarization of the linearly polarized laser light. The beam positioner can include at least one phase-shifting reflector arranged within a beam path along which light is propagatable from the first AOD. The at least one phase-shifting reflector can be configured and oriented to rotate the plane of polarization of light diffracted by the first AOD.

公开(公告)号：US20220299555A1

公开(公告)日：2022-09-22

申请号：US17633828

申请日：2020-09-09

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Doug GARCIA

IPC: G01R31/01 ,  H01R13/24 ,  G01R1/067

Abstract: An electrical measurement contacting system for use with a component testing system operable to convey devices includes: a first module including a test contact module having a test contact adapted to electrically contact devices conveyed by the component testing system, and a second module including circuitry electrically coupled to the test contact module and operative to perform an electrical measurement on devices conveyed to the test contact. The circuitry is connected, within the second module, to a first conductive path and a second conductive path. The first conductive path and the second conductive path extend into the first module. The first conductive path and the second conductive path are electrically connected to each other and to the test contact module in the first module.

公开(公告)号：US20180369957A1

公开(公告)日：2018-12-27

申请号：US15780072

申请日：2017-01-26

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark Kosmowski

IPC: B23K26/08 ,  B23K26/70 ,  B23K26/042 ,  G01R31/28

Abstract: A laser processing system is disclosed, which includes a system frame, a process frame movably supported by the system frame, an optics wall coupled to the process frame, a process shroud coupled to the system frame and extending over and alongside upper and lateral peripheral regions of the optics wall and an optics shroud coupled to the process shroud. The process frame is configured to support a laser source, a workpiece positioning system and a beam delivery system. The process frame is moveable relative to the process shroud and the process frame is moveable relative to the optics shroud. The process shroud, the optics wall and the process frame enclose a first space for laser processing of a workpiece. The optics shroud, the optics wall and the process frame enclose a second space for accommodating the laser source.

公开(公告)号：US20180243872A1

公开(公告)日：2018-08-30

申请号：US15966615

申请日：2018-04-30

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Guang Lu ,  Mehmet E. Alpay ,  Mike Tyler ,  Qian XU ,  Jan Kleinert ,  Zhibin Lin ,  Jim D. Brookhyser ,  Ho Wai Lo ,  Kurt M. Eaton

IPC: B23Q15/14 ,  G05B19/402

CPC classification number: B23Q15/14 ,  G05B19/19 ,  G05B19/402 ,  G05B2219/34015 ,  G05B2219/41196 ,  G05B2219/41217 ,  G05B2219/41427 ,  G05B2219/50218

Abstract: One embodiment of the present invention can be characterized as a method for controlling a multi-axis machine tool that includes obtaining a preliminary rotary actuator command (wherein the rotary actuator command has frequency content exceeding a bandwidth of a rotary actuator), generating a processed rotary actuator command based, at least in part, on the preliminary rotary actuator command, the processed rotary actuator command having frequency content within a bandwidth of the rotary actuator and generating a first linear actuator command and a second linear actuator command based, at least in part, on the processed rotary actuator command. The processed rotary actuator command can be output to the rotary actuator, the first linear actuator command can be output to a first linear actuator and the second linear actuator command can be output to a second linear actuator.

公开(公告)号：US09983562B2

公开(公告)日：2018-05-29

申请号：US14962732

申请日：2015-12-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Joseph Matthew Hasty ,  Alexander Anatolievich Myachin ,  Mark Theodore Kosmowski

IPC: G05B19/25 ,  G05B15/02 ,  G05B19/401

CPC classification number: G05B19/401

Abstract: Alignment features (60) associated with a support fixture (36) provide side scan data and top scan data reference points. Side scan displacement sensors (112) obtain side scan data of workpiece edge segments (23), and one or more cameras (130) obtain top scan data to provide a machining reference for the side scan data. The side scan data can be transformed into a top-view coordinate system usable by the laser machining system (140).

公开(公告)号：US09931713B2

公开(公告)日：2018-04-03

申请号：US14211115

申请日：2014-03-14

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark A. Unrath

IPC: B23K26/08 ,  B23K26/082

CPC classification number: B23K26/082 ,  B23K26/0853

Abstract: Laser systems and methods improve the processing velocity of the routs or other features to avoid exceeding the laser system's dynamic limits. A laser processing system divides laser processing commands corresponding to a plurality of features to be processed on or in the workpiece into process segments. Laser processing parameters and beam trajectories are simulated to determine a maximum processing velocity for each of the process segments. The laser processing system selects one or more of the maximum processing velocities for processing the plurality of features on or within the workpiece. A slowest processing velocity of the maximum processing velocities may be used to process each of the plurality of features. Alternatively, each continuous rout sequence may be processed using a different processing velocity. In other embodiments, each process segment is processed using its corresponding maximum processing velocity.