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公开(公告)号：US11865824B2
公开(公告)日：2024-01-09
申请号：US17919771
申请日：2020-04-20
CPC分类号： B32B37/025 , C23C14/0005 , C23C14/0605 , C23C16/01 , C23C16/26
摘要： The invention relates to a device for the transfer of a transfer layer from a substrate, in particular from a growth substrate, to a carrier substrate.
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公开(公告)号：US20230211592A1
公开(公告)日：2023-07-06
申请号：US17919771
申请日：2020-04-20
CPC分类号： B32B37/025 , C23C14/0005 , C23C14/0605 , C23C16/01 , C23C16/26
摘要： The invention relates to a device for the transfer of a transfer layer from a substrate, in particular from a growth substrate, to a carrier substrate.
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公开(公告)号：US20230251580A1
公开(公告)日：2023-08-10
申请号：US18008739
申请日：2020-07-06
CPC分类号： G03F7/70466 , G03F7/0957
摘要： The invention relates to a method and a device for the exposure of a photosensitive coating.
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公开(公告)号：US11534868B2
公开(公告)日：2022-12-27
申请号：US16644283
申请日：2017-09-12
发明人： Elisabeth Brandl , Boris Povazay , Thomas Uhrmann
IPC分类号： B29C63/00 , B23K26/53 , B23K26/0622 , B23K26/082 , B23K26/00 , B23K26/046 , B23K26/08 , B32B43/00 , B23K101/40
摘要： A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.
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