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公开(公告)号:US11787926B2
公开(公告)日:2023-10-17
申请号:US17191785
申请日:2021-03-04
Applicant: Eaton Intelligent Power Limited
Inventor: Javed Abdurrazzaq Mapkar , Richard Mauro de Luna
IPC: C08L27/18 , C08L81/04 , C08L83/04 , B29C48/29 , C08K3/04 , C08L79/08 , B29C70/02 , B29C70/88 , B29C64/124 , C08K3/08 , C08L81/06 , C08L77/00 , B29K509/08 , B29K71/00 , B29K77/00 , B29K507/04
CPC classification number: C08L27/18 , B29C48/29 , B29C64/124 , B29C70/023 , B29C70/882 , C08K3/041 , C08K3/042 , C08K3/08 , C08L77/00 , C08L79/08 , C08L81/04 , C08L81/06 , C08L83/04 , B29K2071/00 , B29K2077/00 , B29K2507/04 , B29K2509/08 , C08K2003/085 , C08K2003/0806 , C08K2201/001 , C08K2201/005
Abstract: A composite material for use as a deposition material in an additive manufacturing system comprises a polymer component, a filler component, and an extrudability component. The extrudability component is present in the composite material is an amount of from 0.05 wt % to 10 wt % based on the weight of the composite material, and can comprise polyhedral oligomeric silsesquioxane (POSS). The polymer component comprises a high temperature polymer such as an engineering polymer or a high performance polymer. The filler component comprises at least one of a conductive component and a strengthening component. In some cases, the conductive component is present in an amount such that the composite material is formed as one of an electrostatic discharge (ESD) material and an EMI/EMC shielding material. The composite material can be deposited in a liquid state on a substrate using an additive manufacturing system, to produce a three-dimensional object.
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公开(公告)号:US20210189112A1
公开(公告)日:2021-06-24
申请号:US17191785
申请日:2021-03-04
Applicant: Eaton Intelligent Power Limited
Inventor: Javed Abdurrazzaq Mapkar , Richard Mauro de Luna
IPC: C08L27/18 , C08L81/04 , C08L83/04 , B29C48/29 , C08K3/04 , C08L79/08 , B29C70/02 , B29C70/88 , B29C64/124 , C08K3/08 , C08L81/06 , C08L77/00
Abstract: A composite material for use as a deposition material in an additive manufacturing system comprises a polymer component, a filler component, and an extrudability component. The extrudability component is present in the composite material is an amount of from 0.05 wt % to 10 wt % based on the weight of the composite material, and can comprise polyhedral oligomeric silsesquioxane (POSS). The polymer component comprises a high temperature polymer such as an engineering polymer or a high performance polymer. The filler component comprises at least one of a conductive component and a strengthening component. In some cases, the conductive component is present in an amount such that the composite material is formed as one of an electrostatic discharge (ESD) material and an EMI/EMC shielding material. The composite material can be deposited in a liquid state on a substrate using an additive manufacturing system, to produce a three-dimensional object.
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公开(公告)号:US10968340B1
公开(公告)日:2021-04-06
申请号:US15883800
申请日:2018-01-30
Applicant: Eaton Intelligent Power Limited
Inventor: Javed Abdurrazzaq Mapkar , Richard Mauro de Luna
IPC: C08K3/04 , C08K3/08 , C08L77/00 , C08L61/00 , C08L79/08 , C08L83/04 , C08L81/00 , C08L27/18 , C08L81/04 , C08L81/06 , B29C64/124 , B29C70/02 , B29C70/88 , B29C48/29 , B29K509/08 , B29K71/00 , B29K77/00 , B29K507/04
Abstract: A composite material for use as a deposition material in an additive manufacturing system comprises a polymer component, a filler component, and an extrudability component. The extrudability component is present in the composite material is an amount of from 0.05 wt % to 10 wt % based on the weight of the composite material, and can comprise polyhedral oligomeric silsesquioxane (POSS). The polymer component comprises a high temperature polymer such as an engineering polymer or a high performance polymer. The filler component comprises at least one of a conductive component and a strengthening component. In some cases, the conductive component is present in an amount such that the composite material is formed as one of an electrostatic discharge (ESD) material and an EMI/EMC shielding material. The composite material can be deposited in a liquid state on a substrate using an additive manufacturing system, to produce a three-dimensional object.
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