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公开(公告)号：US20240091899A1
公开(公告)日：2024-03-21
申请号：US18521813
申请日：2023-11-28
申请人： EBARA CORPORATION
IPC分类号： B24B37/04 , B24B7/22 , B24B21/00 , B24B21/10 , B24B37/005 , B24B37/10 , B24B37/30 , B24B41/06 , H01L21/02 , H01L21/67 , H01L21/687
CPC分类号： B24B37/042 , B24B7/228 , B24B21/004 , B24B21/008 , B24B21/10 , B24B37/005 , B24B37/105 , B24B37/30 , B24B41/067 , H01L21/0209 , H01L21/67034 , H01L21/67051 , H01L21/68728 , H01L21/68742 , H01L21/68764
摘要： A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.
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公开(公告)号：US20190118335A1
公开(公告)日：2019-04-25
申请号：US16163070
申请日：2018-10-17
申请人： EBARA CORPORATION
IPC分类号： B24B37/04 , H01L21/02 , H01L21/67 , H01L21/687 , B24B37/005
摘要： A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.
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公开(公告)号：US20170165804A1
公开(公告)日：2017-06-15
申请号：US15118184
申请日：2015-02-12
申请人： Ebara Corporation
发明人： Masaya SEKI , Manao HOSHINA
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B37/04 , H01L21/02021
摘要： The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).
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公开(公告)号：US20190054589A1
公开(公告)日：2019-02-21
申请号：US16166767
申请日：2018-10-22
申请人： Ebara Corporation
发明人： Masaya SEKI , Manao HOSHINA
摘要： The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).
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公开(公告)号：US20240282619A1
公开(公告)日：2024-08-22
申请号：US18650935
申请日：2024-04-30
申请人： EBARA CORPORATION
发明人： Makoto KASHIWAGI , Manao HOSHINA
IPC分类号： H01L21/687 , B24B37/10 , B24B41/06 , G03F7/00 , H01L21/677
CPC分类号： H01L21/68764 , B24B37/105 , B24B41/067 , G03F7/707 , G03F7/70758 , H01L21/67706 , H01L21/68728 , H01L21/68792
摘要： A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer, is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers capable of contacting a periphery of the substrate; a roller rotating mechanism configured to rotate the rollers; and eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.
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公开(公告)号：US20190184519A1
公开(公告)日：2019-06-20
申请号：US16222779
申请日：2018-12-17
申请人： EBARA CORPORATION
发明人： Makoto KASHIWAGI , Fong-Jie DU , Manao HOSHINA
IPC分类号： B24B37/30
CPC分类号： B24B37/30 , B24B21/004 , B24B21/08 , H01L21/304
摘要： A polishing head having a simple construction and a compact size is disclosed. The polishing head includes: a polishing-tool pressing member for supporting a polishing tool; a movable shaft coupled to the polishing-tool pressing member; a housing which houses the movable shaft therein; and a diaphragm which forms a pressure chamber between an end portion of the movable shaft and the housing, the diaphragm including a central portion in contact with the end portion of the movable shaft, an inner wall portion connecting with the central portion and extending along a side surface of the movable shaft, a folded-back portion connecting with the inner wall portion and having a curved cross section, and an outer wall portion connecting with the folded-back portion and located outside the inner wall portion.
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公开(公告)号：US20190131166A1
公开(公告)日：2019-05-02
申请号：US16168301
申请日：2018-10-23
申请人： EBARA CORPORATION
发明人： Makoto KASHIWAGI , Manao HOSHINA
IPC分类号： H01L21/687 , H01L21/677
摘要： A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer, is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers capable of contacting a periphery of the substrate; a roller rotating mechanism configured to rotate the rollers; and eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.
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