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公开(公告)号:US06931722B2
公开(公告)日:2005-08-23
申请号:US10395944
申请日:2003-03-24
申请人: Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
发明人: Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
CPC分类号: H05K3/243 , H05K3/28 , H05K3/3452 , H05K3/3473 , H05K3/42 , H05K2201/0391 , H05K2203/0315 , H05K2203/0574 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要: A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.
摘要翻译: 公开了一种制造印刷电路器件的方法,该印刷电路器件包括电绝缘衬底以及形成在衬底顶表面上的第一组,第二组和第三组导体。 该方法包括在第二导体组上形成氧化物层; 在氧化物层上形成焊料掩模; 在第一组导体上形成复合层; 以及在所述第三组导体的至少一部分上形成焊料层。
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公开(公告)号:US06586683B2
公开(公告)日:2003-07-01
申请号:US09844814
申请日:2001-04-27
申请人: Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A. Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
发明人: Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A. Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
IPC分类号: H05K103
CPC分类号: H05K3/243 , H05K3/28 , H05K3/3452 , H05K3/3473 , H05K3/42 , H05K2201/0391 , H05K2203/0315 , H05K2203/0574 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要: A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.
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公开(公告)号:US4971715A
公开(公告)日:1990-11-20
申请号:US272847
申请日:1988-11-18
申请人: Richard G. Armant , Edward L. Arrington , Anilkumar C. Bhatt , Donald M. Egleton , Frederick M. Ortloff , Joseph J. Sniezek , John A. Welsh
发明人: Richard G. Armant , Edward L. Arrington , Anilkumar C. Bhatt , Donald M. Egleton , Frederick M. Ortloff , Joseph J. Sniezek , John A. Welsh
IPC分类号: G03F7/42 , H01L21/027 , H01L21/30
CPC分类号: G03F7/426
摘要: A stripping composition containing O-dichlorobenzene, dodecylbenzene sulfonic acid, perchloroethylene, and optionally an aromatic hydrocarbon containing at least 8 carbon atoms, and use thereof for removing photoresist.
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