利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.015 秒)

    Wafer ring feeding apparatus
    1.
    发明授权
    Wafer ring feeding apparatus 失效
    晶圆环喂料装置

    公开(公告)号：US6062795A

    公开(公告)日：2000-05-16

    申请号：US940427

    申请日：1997-09-30

    申请人： Shigeru Fuke ,  Tsuneharu Arai ,  Eiji Kikuchi

    发明人： Shigeru Fuke ,  Tsuneharu Arai ,  Eiji Kikuchi

    IPC分类号： H01L21/683 ,  B65G49/07 ,  H01L21/677

    CPC分类号： H01L21/67346 ,  H01L21/67778 ,  Y10S414/136

    摘要： A device for preventing wafer rings from being caught on a pair of guide rails of a wafer ring conveying apparatus, including an open-and-close mechanism which moves the pair of guide rails in a closing direction when a wafer ring is supplied onto the guide rails from the wafer ring cassette so as to correct the rotational orientation and/or offset of the wafer ring.

    摘要翻译： 一种用于防止晶片环被卡在晶片环输送装置的一对导轨上的装置，包括一开闭机构，当将晶片环供应到导向件上时，关闭方向使一对导轨移动 轨道从晶片环盒中校正晶圆环的旋转取向和/或偏移。

    Die bonding method and apparatus
    2.
    发明授权
    Die bonding method and apparatus 失效
    芯片接合方法和装置

    公开(公告)号：US06547902B2

    公开(公告)日：2003-04-15

    申请号：US09738727

    申请日：2000-12-15

    申请人： Tsuneharu Arai ,  Eiji Kikuchi ,  Michio Yonemoto

    发明人： Tsuneharu Arai ,  Eiji Kikuchi ,  Michio Yonemoto

    IPC分类号： B32B3100

    CPC分类号： H01L21/67271 ,  Y10S156/942 ,  Y10T156/1978

    摘要： In die bonding in which good dies are bonded to good bonding portions of a bonding object (substrates, tapes, etc) and bad dies are bonded to bad bonding portions of the bonding object, dies on a wafer are successively detected and discriminated by a die detecting camera, dies are classified into good dies and bad dies on the basis of the results of this detection and discrimination, dies are registered on a wafer good/bad status map, and dies registered on the wafer good/bad status map are picked up by a die-transporting nozzle, transferred and bonded according to whether good dies or bad dies are requested based upon detection of bonding portions of the bonding object.

    摘要翻译： 在将接合体（基板，带等）的良好的接合部分接合良好的金属模的接合处理中，将接合对象的不良接合部分接合到不良接合部上的晶片上， 检测相机，根据该检测和辨别的结果，将模具分类为良好的裸片和不良裸片，将晶片良好/不良状态图记录在晶片良好/不良状态映射上，并记录晶片良好/不良状态映射的模具 通过模具输送喷嘴，根据是否需要检测粘结物体的粘结部分，是否请求良好的模具或不良的模具被转移和粘合。

    Bonding apparatus
    3.
    发明授权
    Bonding apparatus 失效
    接合装置

    公开(公告)号：US5603446A

    公开(公告)日：1997-02-18

    申请号：US679904

    申请日：1996-07-10

    申请人： Eiji Kikuchi ,  Tsuneharu Arai

    发明人： Eiji Kikuchi ,  Tsuneharu Arai

    IPC分类号： H01L21/60 ,  B23K20/00 ,  H01L21/00 ,  H01L21/603

    CPC分类号： H01L24/78 ,  B23K20/004 ,  H01L21/67144 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082

    摘要： A bonding apparatus which includes a function of adjusting the height level of an upper limit of a bonding stage including a standard stroke cam which raises and lowers the bonding stage, a cam holder which rotatably supports one end of the standard stroke cam and moves in a horizontal direction, a standard stroke air cylinder which drives the cam holder in a horizontal direction, a roller which is installed on the standard stroke cam, a linear cam which is contacted by the roller of the standard stroke cam, and a motor used for moving the linear cam so that the position of contact with the roller of the standard stroke cam can be changed when the raised position of the bonding stage is adjusted.

    摘要翻译： 一种接合装置，其具有调节包括升高和降低接合台的标准行程凸轮的接合台的上限的高度水平的功能，可旋转地支撑标准行程凸轮的一端并在其中移动的凸轮保持器 水平方向，在水平方向驱动凸轮保持架的标准冲程气缸，安装在标准行程凸轮上的滚子，与标准行程凸轮的滚子接触的直线凸轮和用于移动的马达 线性凸轮使得当调节接合台的升高位置时可以改变与标准行程凸轮的辊的接触位置。

    Wafer ring supply and return device
    4.
    发明授权
    Wafer ring supply and return device 失效
    晶圆环供电和返回装置

    公开(公告)号：US5853532A

    公开(公告)日：1998-12-29

    申请号：US698666

    申请日：1996-08-16

    申请人： Osamu Nakamura ,  Shigeru Ichikawa ,  Tsuneharu Arai

    发明人： Osamu Nakamura ,  Shigeru Ichikawa ,  Tsuneharu Arai

    IPC分类号： H01L21/00 ,  H01L21/301 ,  H01L21/67 ,  H01L21/677 ,  B32B35/00

    CPC分类号： H01L21/67144 ,  H01L21/67769 ,  Y10S414/135 ,  Y10S414/137 ,  Y10T156/1944

    摘要： A device for conveying a wafer ring between a wafer ring container and a pellet pick-up device. A pair of guide rails which guide both side edges of a wafer ring that is conveyed by a wafer ring conveying assembly are installed pivotally in a vertical direction near the wafer ring cassette. The guide rails are pivoted so as to take a horizontal position when the conveying of the wafer ring is performed and take a vertical position when the pellet pick-up device is in operation. Thus, the operation of the pellet pick-up device is not hindered by the guide rails.

    摘要翻译： 一种用于在晶圆环容器和颗粒捕获装置之间输送晶片环的装置。 引导由晶片环输送组件输送的晶片环的两个侧边缘的一对导轨在垂直方向上可枢转地安装在晶片环盒附近。 当执行晶片环的输送时，导轨枢转以便水平位置，并且当小片拾取装置运行时，导轨处于垂直位置。 因此，小球拾取装置的操作不受导轨的阻碍。

    Die transporting device
    7.
    发明授权
    Die transporting device 失效
    模具输送装置

    公开(公告)号：US5823418A

    公开(公告)日：1998-10-20

    申请号：US699235

    申请日：1996-08-19

    申请人： Osamu Nakamura ,  Tsuneharu Arai

    发明人： Osamu Nakamura ,  Tsuneharu Arai

    IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L21/52 ,  H01L21/67 ,  H01L21/677

    CPC分类号： H01L21/67144 ,  H01L21/67721 ,  Y10S414/141

    摘要： A device for transporting a die from a die pick-up position to a die placement position in the process of manufacturing, for instance, semiconductor devices, including a slider which is vertically movable, a suction holding nozzle installed on the slider, a feeder screw which causes a horizontal movement of the slider, a transport guide shaft which guides the slider so as to make its horizontal movement, a pair of pivotal swing levers respectively installed above the die pick-up position and the die placement position so as to guide the slider to ascend and descend, and driving cams which cause the pivot motions of the swing levers.

    摘要翻译： 一种用于在制造过程中将模具从模具拾取位置传送到模具放置位置的装置，例如包括可垂直移动的滑块的半导体装置，安装在滑块上的吸入保持喷嘴，进给螺杆 这导致滑块的水平移动，引导滑块以便使其水平运动的传送引导轴，分别安装在模具拾取位置和模具放置位置上方的一对枢转摆动杆，以便引导 滑块上升和下降，以及驱动凸轮，其引起摆动杆的枢转运动。