摘要:
The present invention relates to a process for producing an SiO2-containing insulating layer on chips and the use of specific precursors for this purpose. The invention further relates to an insulating layer obtainable in this way and also to chips which have been provided with such an insulating layer.
摘要:
The present invention relates to a specific process for preparing organosilane esters of the formula (I) and a composition comprising more than 98% by weight of organosilane esters of the formula (I) and less than 2.0% by weight of at least one hydrocarbon and to the use of such a composition as precursor for producing a layer or film having a dielectric constant of 1
摘要:
The present invention relates to a composition for coating metals to protect against corrosion, comprising (i) a sol based on silicon compounds, (ii) at least one aminoalkyl-functional alkoxysilane and/or (iii) at least one reaction product of components (i) and (ii), the amount of aminoalkyl-functional silane component from (ii) and (iii) being in total from 0.01 to 15% by weight, calculated as the particular aminoalkylalkoxysilane used and based on the SiO2 content of the sol as per (i); to a process for preparing such a composition, and to its use.
摘要:
A process for the preparation of a polymerizable dental composition comprising the steps of (a) preparing a liquid mixture comprising (i) 1 to 99% w/w of a hybrid monomer component containing at least one hybrid monomer compound having one hydrolysable siloxane group and at least one polymerizable organic moiety, and (ii) 99 to 1% w/w of a monomer component polymerizable with the polymerizable organic moiety of the hybrid monomer compounds; and (b) adding at least a stoichiometrically sufficient amount of water to the mixture to hydrolyse the hydrolysable siloxane group of the hybrid monomer compound and to form spherical polymerizable nanoparticles having an average particle size of from 1 to 100 nm dispersed in the monomer component, whereby the nanoparticles have a structure with Si—O—Si bonds and peripherally exposed polymerizable organic moieties.