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公开(公告)号：US20130256850A1
公开(公告)日：2013-10-03
申请号：US13433317
申请日：2012-03-29
IPC分类号： H01L23/66
CPC分类号： H01L23/66 , H01L2223/6616 , H01L2223/6633 , H01L2223/6683 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00
摘要： A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.
摘要翻译： 由通用印刷电路板（PCB）技术和金属盖构成的mmWave电子封装。 封装的组装使用标准的拾放技术，热量直接耗散到封装上的焊盘上。 mm波形信号的输入/输出通过矩形波导实现。 使用常规回流焊工艺将电子封装安装到电气印刷电路板（PCB）上，并包括连接到mmWave天线的波导管I / O。 电子封装提供从封装内的半导体芯片到其所安装的PCB的低频，直流和地信号的传输。 阻抗匹配方案通过改变芯片内的接地平面将芯片与高频板转换相匹配。 高频板上的接地层包围高频信号突起，将电磁场限制在凸点区域，减少辐射损耗。
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2.发明授权High frequency transition matching in an electronic package for millimeter wave semiconductor dies 有权用于毫米波半导体管芯的电子封装中的高频转换匹配公开(公告)号：US08912634B2
公开(公告)日：2014-12-16
申请号：US13433313
申请日：2012-03-29
CPC分类号： H01L23/66 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L2223/6616 , H01L2223/6633 , H01L2223/6683 , H01L2224/05554 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32235 , H01L2224/48227 , H01L2224/48235 , H01L2224/49171 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2924/00014 , H01L2924/15153 , H01L2924/1517 , H01L2924/30107 , H01L2924/3011 , H01P5/107 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.
摘要翻译： 由通用印刷电路板（PCB）技术和金属盖构成的mmWave电子封装。 封装的组装使用标准的拾放技术，热量直接耗散到封装上的焊盘上。 mm波形信号的输入/输出通过矩形波导实现。 使用常规回流焊工艺将电子封装安装到电气印刷电路板（PCB）上，并包括连接到mmWave天线的波导管I / O。 电子封装提供从封装内的半导体芯片到其所安装的PCB的低频，直流和地信号的传输。 阻抗匹配方案通过改变芯片内的接地平面将芯片与高频板转换相匹配。 高频板上的接地层包围高频信号突起，将电磁场限制在凸点区域，减少辐射损耗。
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3.发明申请HIGH FREQUENCY TRANSITION MATCHING IN AN ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES 有权用于微波半导体器件的电子封装中的高频转换匹配公开(公告)号：US20130256849A1
公开(公告)日：2013-10-03
申请号：US13433313
申请日：2012-03-29
CPC分类号： H01L23/66 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L2223/6616 , H01L2223/6633 , H01L2223/6683 , H01L2224/05554 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32235 , H01L2224/48227 , H01L2224/48235 , H01L2224/49171 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2924/00014 , H01L2924/15153 , H01L2924/1517 , H01L2924/30107 , H01L2924/3011 , H01P5/107 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.
摘要翻译： 由通用印刷电路板（PCB）技术和金属盖构成的mmWave电子封装。 封装的组装使用标准的拾放技术，热量直接耗散到封装上的焊盘上。 mm波形信号的输入/输出通过矩形波导实现。 使用常规回流焊工艺将电子封装安装到电气印刷电路板（PCB）上，并包括连接到mmWave天线的波导管I / O。 电子封装提供从封装内的半导体芯片到其所安装的PCB的低频，直流和地信号的传输。 阻抗匹配方案通过改变芯片内的接地平面将芯片与高频板转换相匹配。 高频板上的接地层包围高频信号突起，将电磁场限制在凸点区域，减少辐射损耗。
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