公开(公告)号：US11760876B2

公开(公告)日：2023-09-19

申请号：US17513979

申请日：2021-10-29

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu Hsieh ,  Chih-Wei Lin ,  Ching Lo

IPC: C08L85/02 ,  C08L79/08 ,  C08L71/12 ,  C08L25/10 ,  C08J5/24 ,  B32B27/18 ,  B32B5/08 ,  C08L71/00 ,  C09J7/30 ,  C09J171/00 ,  B32B5/02 ,  B32B15/14 ,  B32B5/26 ,  B32B15/20

CPC classification number: C08L71/00 ,  B32B5/024 ,  B32B5/263 ,  B32B15/14 ,  B32B15/20 ,  C08J5/244 ,  C09J7/30 ,  C09J171/00 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/3065 ,  B32B2307/7265 ,  B32B2457/08 ,  C08J2371/12 ,  C08J2409/00 ,  C08J2409/06 ,  C08J2479/08 ,  C09J2400/14 ,  C09J2400/163 ,  C09J2423/00 ,  C09J2471/00 ,  C09J2479/08

Abstract: A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.