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1.发明授权Method of patterning the surface of an article using positive microcontact printing 有权使用正微接触印刷图案化制品表面的方法公开(公告)号：US06893966B2
公开(公告)日：2005-05-17
申请号：US10307069
申请日：2002-11-27
IPC分类号： B81C1/00 , G01Q60/00 , G01Q70/00 , G03F7/00 , H01L21/302 , H01L21/461
CPC分类号： G03F7/0002 , B81C1/0046 , B81C2201/036 , B82Y10/00 , B82Y30/00 , B82Y40/00 , C23F1/02
摘要： There is disclosed a method of patterning an article (10) including a layer (12) of copper formed onto an insulating substrate (11) using a positive microcontact printing (MCP) process. In a preferred embodiment where the metal is copper (Cu) and the substrate is a silicon wafer, the method includes removing the native oxide presents on the Cu in a solution of HCl. Then, a stamp (13′) having a patterned polydimethylsiloxane (PDMS) body (14) is linked with a 0.2 mM solution of pentaerythritol-tetrakis(3-mercaptopropionate) (PTMP) in ethanol for 1 min, to form the inking layer (15′). The stamp is applied on the Cu layer to print a first self-assembled monolayer (SAM) (16′) according to a desired pattern. The article is dipped in a solution of ECT which is then adsorbed only in the non printed regions, forming a second SAM (18) in a configuration that is complementary to the desired pattern. Finally, the printed areas of the Cu layer are removed using a peroxodisulfate etch bath.
摘要翻译： 公开了一种使用正微接触印刷（MCP）工艺将包含形成在绝缘基板（11）上的铜层（12）的物品（10）图案化的方法。 在金属是铜（Cu）并且衬底是硅晶片的优选实施方案中，该方法包括在HCl溶液中除去存在于Cu上的天然氧化物。 然后，将具有图案化聚二甲基硅氧烷（PDMS）体（14）的印模（13'）与0.2mM季戊四醇四（3-巯基丙酸酯）（PTMP）在乙醇中的溶液连接1分钟，形成着墨层 15'）。 将印模施加在Cu层上以根据期望的图案印刷第一自组装单层（SAM）（16'）。 将物品浸入ECT溶液中，然后将其吸附在非印刷区域上，形成与期望图案互补的构型的第二SAM（18）。 最后，使用过氧化二硫酸盐蚀刻浴去除Cu层的印刷区域。
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公开(公告)号：US20120255930A1
公开(公告)日：2012-10-11
申请号：US13525843
申请日：2012-06-18
CPC分类号： C12N11/14 , C23F1/02 , C23F1/18 , C23F1/34 , H05K3/06 , H05K3/061 , H05K3/108 , H05K2203/1163
摘要： A method for processing a surface involves depositing at least one class of enzymes (2) onto the surface (1); introducing at least a reactant (3) into an environment of the surface (1), and causing interaction between the enzymes (2) and the reactant (3), thereby to cause processing of a region of the surface (1), the processed region of the surface (1) being defined with respect to a region thereof that is proximate (4) to where the enzymes (3) have been deposited.
摘要翻译： 一种用于处理表面的方法包括将至少一类酶（2）沉积在表面（1）上; 将至少一种反应物（3）引入到表面（1）的环境中，并引起酶（2）和反应物（3）之间的相互作用，从而导致表面（1）的区域的加工，经处理 表面（1）的区域相对于其已经沉积有酶（3）的（4）的区域而定义。
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公开(公告)号：US08202438B2
公开(公告)日：2012-06-19
申请号：US11959190
申请日：2007-12-18
CPC分类号： C12N11/14 , C23F1/02 , C23F1/18 , C23F1/34 , H05K3/06 , H05K3/061 , H05K3/108 , H05K2203/1163
摘要： A method for processing a surface involves depositing at least one class of enzymes (2) onto the surface (1); introducing at least a reactant (3) into an environment of the surface (1), and causing interaction between the enzymes (2) and the reactant (3), thereby to cause processing of a region of the surface (1), the processed region of the surface (1) being defined with respect to a region thereof that is proximate (4) to where the enzymes (3) have been deposited.
摘要翻译： 一种用于处理表面的方法包括将至少一类酶（2）沉积在表面（1）上; 将至少一种反应物（3）引入到表面（1）的环境中，并引起酶（2）和反应物（3）之间的相互作用，从而导致表面（1）的区域的加工，经处理 表面（1）的区域相对于其已经沉积有酶（3）的（4）的区域而定义。
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4.发明授权公开(公告)号：US06521285B1
公开(公告)日：2003-02-18
申请号：US09763180
申请日：2001-06-27
IPC分类号： B05D310
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y30/00 , B82Y40/00 , C23C18/1608 , C23C18/1657 , H05K3/182
摘要： Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.
摘要翻译： 导电材料在基板上无电沉积的方法，使用两种情况下具有图案化表面的印模，该图案被压在基板的表面上以印刷基板并在基板上提供催化剂图案，在基板上发生金属沉积 提供了将印刷基板浸渍在镀浴中的无电沉积过程。 在一种情况下，对印模进行预处理，以将印模的图案用可转移到基材表面的催化墨水润湿。 在另一种情况下，在衬底的表面上提供催化层，其通过将抗蚀剂材料转移到催化剂层上的印模进行图案化，使得随后的蚀刻工艺打开用于无电沉积的催化剂层的期望图案。
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公开(公告)号：US08580129B2
公开(公告)日：2013-11-12
申请号：US13525843
申请日：2012-06-18
CPC分类号： C12N11/14 , C23F1/02 , C23F1/18 , C23F1/34 , H05K3/06 , H05K3/061 , H05K3/108 , H05K2203/1163
摘要： A method for processing a surface involves depositing at least one class of enzymes (2) onto the surface (1); introducing at least a reactant (3) into an environment of the surface (1), and causing interaction between the enzymes (2) and the reactant (3), thereby to cause processing of a region of the surface (1), the processed region of the surface (1) being defined with respect to a region thereof that is proximate (4) to where the enzymes (3) have been deposited.
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公开(公告)号：US20080245771A1
公开(公告)日：2008-10-09
申请号：US11959190
申请日：2007-12-18
CPC分类号： C12N11/14 , C23F1/02 , C23F1/18 , C23F1/34 , H05K3/06 , H05K3/061 , H05K3/108 , H05K2203/1163
摘要： A method for processing a surface involves depositing at least one class of enzymes (2) onto the surface (1); introducing at least a reactant (3) into an environment of the surface (1), and causing interaction between the enzymes (2) and the reactant (3), thereby to cause processing of a region of the surface (1), the processed region of the surface (1) being defined with respect to a region thereof that is proximate (4) to where the enzymes (3) have been deposited.
摘要翻译： 一种用于处理表面的方法包括将至少一类酶（2）沉积在表面（1）上; 将至少一种反应物（3）引入到表面（1）的环境中，并引起酶（2）和反应物（3）之间的相互作用，从而导致表面（1）的区域的加工，经处理 表面（1）的区域相对于其已经沉积有酶（3）的（4）的区域而定义。
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7.发明授权公开(公告)号：US06770558B2
公开(公告)日：2004-08-03
申请号：US10371466
申请日：2003-02-21
IPC分类号： H01L214763
CPC分类号： H01L21/76843 , H01L21/76874 , H01L21/76879 , H01L2221/1089
摘要： Methods and apparatus for forming and/or enabling interconnection in a substrate. An example embodiment of a method comprises forming a via in the substrate. A preconditioning layer is deposited on the substrate. A catalyst layer is then bound to the preconditioning layer. A conductive material is deposited on the catalyst layer by electro-less deposition to fill the via with the conductive material. Deposition of the conductive material is selectively disabled from coating surfaces of the substrate outside the via. Advantageous alternatives are presented.
摘要翻译： 用于在衬底中形成和/或实现互连的方法和装置。 方法的示例性实施例包括在衬底中形成通孔。 预处理层沉积在衬底上。 然后将催化剂层结合到预处理层。 通过无电沉积将导电材料沉积在催化剂层上，以用导电材料填充通孔。 选择性地禁止导电材料的沉积，以从通孔外部的基板的涂层表面去除。 提出了有利的替代方案。
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8.发明申请公开(公告)号：US20050277399A1
公开(公告)日：2005-12-15
申请号：US11139351
申请日：2005-05-27
CPC分类号： H04B1/0458 , H04B1/18
摘要： In a transmitting arrangement a power amplifier is coupled to a radio-frequency antenna arrangement via a controllable matching apparatus. This allows direct impedance transformation of the output of the power amplifier to the input of the radio-frequency antenna arrangement. There is no need for transformation to the 50 ohm standard. The power amplifier, matching apparatus and a control circuit for controlling the impedance of the matching apparatus form a functional unit, which is advantageously in the form of a monolithically integrated structure in a semiconductor body. A receiving arrangement is produced in the same way, comprising an antenna, a filter device and a matching apparatus connected between them.
摘要翻译： 在发射装置中，功率放大器经由可控制的匹配装置耦合到射频天线装置。 这允许功率放大器的输出到射频天线装置的输入的直接阻抗变换。 不需要转换为50欧姆标准。 功率放大器，匹配装置和用于控制匹配装置的阻抗的控制电路形成功能单元，该功能单元有利地是半导体本体中的单片集成结构的形式。 以相同的方式制造接收装置，包括天线，滤波器装置和连接在它们之间的匹配装置。
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9.发明授权公开(公告)号：US07502598B2
公开(公告)日：2009-03-10
申请号：US11139351
申请日：2005-05-27
IPC分类号： H04B1/04
CPC分类号： H04B1/0458 , H04B1/18
摘要： In a transmitting arrangement a power amplifier is coupled to a radio-frequency antenna arrangement via a controllable matching apparatus. This allows direct impedance transformation of the output of the power amplifier to the input of the radio-frequency antenna arrangement. There is no need for transformation to the 50 ohm standard. The power amplifier, matching apparatus and a control circuit for controlling the impedance of the matching apparatus form a functional unit, which is advantageously in the form of a monolithically integrated structure in a semiconductor body. A receiving arrangement is produced in the same way, comprising an antenna, a filter device and a matching apparatus connected between them.
摘要翻译： 在发射装置中，功率放大器经由可控制的匹配装置耦合到射频天线装置。 这允许功率放大器的输出到射频天线装置的输入的直接阻抗变换。 不需要转换为50欧姆标准。 功率放大器，匹配装置和用于控制匹配装置的阻抗的控制电路形成功能单元，该功能单元有利地是半导体本体中的单片集成结构的形式。 以相同的方式制造接收装置，包括天线，滤波器装置和连接在它们之间的匹配装置。
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