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公开(公告)号：USD740031S1
公开(公告)日：2015-10-06
申请号：US29467250
申请日：2013-09-17
申请人： Entegris, Inc.
设计人： Barry Gregerson
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公开(公告)号：US20130287528A1
公开(公告)日：2013-10-31
申请号：US13847345
申请日：2013-03-19
申请人： ENTEGRIS, INC.
发明人： Barry Gregerson
IPC分类号： H01L21/673 , H01L21/677
CPC分类号： B65D25/103 , B65D25/28 , B65D43/02 , B65D85/70 , H01L21/6732 , H01L21/67369 , H01L21/67383 , H01L21/67386 , H01L21/67763
摘要： A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion includes a means for accommodating large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.
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公开(公告)号：US10388554B2
公开(公告)日：2019-08-20
申请号：US15481031
申请日：2017-04-06
申请人： Entegris, Inc.
发明人： Barry Gregerson
IPC分类号： H01L21/673 , B65D85/30
摘要： A purge configurable wafer shipper. The container includes an enclosure portion with an open side or bottom, a door to sealing close the open side or bottom. One of the door and the container portion includes an opening formed in the enclosure portion to provide a fluid passageway from an interior of the wafer shipper to an exterior region. The opening may include a module receiving structure that defines the fluid passageway. A sealing member is included for insertion into the module receiving structure. The sealing member has a body portion including a support flange positioned proximate a lower portion of the body portion, a circumferential groove in the exterior surface of the body portion, and an O-ring positioned at least partially within the circumferential groove.
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公开(公告)号：US20160254172A1
公开(公告)日：2016-09-01
申请号：US15057342
申请日：2016-03-01
申请人： Entegris, Inc.
IPC分类号： H01L21/673
CPC分类号： H01L21/67389 , H01L21/67369 , H01L21/67373 , H01L21/67376 , H01L21/67379 , H01L21/67383 , H01L21/67386
摘要： A front opening wafer container suitable for large wafers such as 450 mm utilizes componentry with separate fasteners to lock the componentry together in an expedient manner providing robust connections and cost efficiencies. A container portion has an open front and receives on a bottom surface a base plate secured by twist lock connectors that also provide recesses for purge grommets. Kinematic coupling components readily and robustly lock onto the base plate. Interior wafer support components latch onto brackets on the side walls utilizing a separate locking insert with holding tabs and locking detents. A wafer retainer provides support and counters enhanced wafer sag associated with 450 mm wafers when the door is installed and seated.
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公开(公告)号：US20150122699A1
公开(公告)日：2015-05-07
申请号：US14398958
申请日：2013-05-06
申请人： ENTEGRIS, INC.
发明人： Barry Gregerson , Matthew A. Fuller
IPC分类号： H01L21/673 , B65D85/30 , F16J15/10
CPC分类号： H01L21/67376 , B65D85/30 , F16J15/104
摘要： A wafer container may be a front opening wafer container comprising a container portion and a door, one of the container portion and the door having a radially installed seal with a plurality of opposing lateral projections that deflect from a normal position in a direction away from an install direction when the seal is installed in a groove, the lateral projections resisting removal of the seal after the seal is seated in the groove. A core portion and a cantilevered finger member engages the other of the door and container portion when the door is seated in the container portion. Other lateral projections on the seal effectively seal the path between the seal and groove surfaces.
摘要翻译： 晶片容器可以是包括容器部分和门的前开口晶片容器，容器部分和门中的一个具有径向安装的密封件，其具有多个相对的横向突起，所述多个相对的横向突起从远离正常位置的方向从正常位置偏转 当密封件安装在凹槽中时，安装方向，在密封件就位于凹槽中之后，侧向突起抵抗密封件的移除。 当门位于容器部分中时，芯部分和悬臂指部件接合门和容器部分中的另一个。 密封件上的其他横向突起有效地密封了密封和凹槽表面之间的路径。
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公开(公告)号：US08919563B2
公开(公告)日：2014-12-30
申请号：US13847345
申请日：2013-03-19
申请人： Entegris, Inc.
IPC分类号： H01L21/673 , H01L21/677
CPC分类号： B65D25/103 , B65D25/28 , B65D43/02 , B65D85/70 , H01L21/6732 , H01L21/67369 , H01L21/67383 , H01L21/67386 , H01L21/67763
摘要： A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion can accommodate large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.
摘要翻译： 用于大直径晶片的前半导体开口晶片容器包括容器部分和门。 容器部分包括左封闭侧，右封闭侧，闭合背部，开放前部和包括用于接收和容纳晶片的多个狭槽的开放内部。 门可附接到容器部分以封闭敞开的前部，并可选择性地闩锁到容器部分。 容器部分可以容纳大直径晶片，特别是450mm晶片。 提供优化的下垂控制以及增强的结构刚度和晶片座位功能。
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公开(公告)号：US10304710B2
公开(公告)日：2019-05-28
申请号：US14899423
申请日：2014-06-18
申请人： ENTEGRIS, INC.
发明人： Eric A. Kirkland , Barry Gregerson , Eric S. Olson , Christian Andersen , Jason Todd Steffens , Ryan Mushel , Karen Anderson
IPC分类号： H01L21/673
摘要： Apparatuses and methods providing a ballast system for adjusting the center of gravity of a standardized front opening wafer container. Various embodiments of the disclosure present ballast systems that are low profile, do not require modifications to the shell of the wafer container, and can be retrofit to existing wafer carriers. In some embodiments, these capabilities are accomplished by a ballast that mounts to a kinematic coupling plate of the wafer container. In one embodiment, the ballasting can also provide sufficient counter force to the lifting forces associated with purging of the wafer container, thereby preventing “lift off” of the wafer container during purging operations. The ballasts can be removed for shipping of the wafer container, thereby decreasing shipping costs.
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公开(公告)号：US10276414B2
公开(公告)日：2019-04-30
申请号：US15269368
申请日：2016-09-19
申请人： Entegris, Inc.
IPC分类号： H01L21/673
摘要： An improved wafer support mechanism in a wafer container useful for carrying a plurality of axially aligned thin mostly circular wafer substrates. The container includes a cassette that has a plurality of adjacently disposed teeth for receiving the substrates, wherein each rib member is continuous from the cassette open top to the cassette open bottom, a removable top cover portion, a removable bottom cover portion, a cushion assembly removably attached to the container top cover, and another cushion assembly removably located in the container bottom cover and held in place by the weight of the wafer cassette. The top cushions are formed of individual segments having an extended lead-in feature at the end of each segment, spring sections in each segment and each segment has a V-shaped cross section to receive the wafer edge. The top and bottom cushions are installed in the top and bottom container covers, respectively, and extend the wafer support to approximately the entire circumference of each wafer.
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公开(公告)号：US20190019704A1
公开(公告)日：2019-01-17
申请号：US16076820
申请日：2017-02-09
申请人： ENTEGRIS, Inc.
IPC分类号： H01L21/673
摘要： A substrate container (100) includes a base (105) and a cover (115). The cover (115) mates with the base (105) to define an enclosure. A stack of interlocking trays (405) can be disposed within the base (105). Each interlocking tray (405) includes an inset flange (410) defining a registration face (420) for supporting a substrate. The interlocking tray (405) also includes a shoulder portion (415). A relief feature (435) is defined at the junction point between the shoulder portion (415) and the registration face (420). The relief feature (435) may prevent the sharp edges of the substrate from contacting the shoulder portion (415), thereby reducing particle generation.
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公开(公告)号：US20190019703A1
公开(公告)日：2019-01-17
申请号：US16076817
申请日：2017-02-09
IPC分类号： H01L21/673
摘要： A substrate container (100) includes a receptacle (105) and a cover (110). The receptacle (105) includes a base portion (115) for supporting a substrate and a side wall portion (120) extending upward from the base portion (115). The cover (110) defines a closure over the receptacle (105). In one embodiment, the receptacle (105) includes a first alignment feature (300, 305) located on an exterior surface of the receptacle (105). The first alignment feature (300, 305) interfaces with automation for aligning the receptacle (105). In another embodiment, the cover (110) includes a contoured surface (135) for applying a compressive load to the contents of the substrate container (100).
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