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    Apparatus for marking metal
    1.
    发明授权
    Apparatus for marking metal 失效
    金属标记设备

    公开(公告)号：US4106435A

    公开(公告)日：1978-08-15

    申请号：US559438

    申请日：1975-03-18

    申请人： Eric Douglas Woodhouse ,  Alexander Murray Lawrie ,  Thomas McNeil

    发明人： Eric Douglas Woodhouse ,  Alexander Murray Lawrie ,  Thomas McNeil

    IPC分类号： B05B15/04 ,  B21C51/00 ,  C23C4/00 ,  G09F7/16 ,  B05C5/00

    CPC分类号： B21C51/005 ,  B05B15/04 ,  C23C4/01

    摘要： An apparatus for marking metal in which a main carriage having a spray gun assembly with a stencil assembly mounted on it is moved toward and away from a piece of metal to be marked. Either the spray gun assembly or the stencil assembly is movable relative to the other in a direction transverse to the direction of movement of the main carriage. The stencil assembly has a plurality of stencil rings each having a plurality of cutouts with each ring being indexable so as to bring a specific cutout next to the piece of metal to be marked. After the indexing operation, the spray gun assembly is activated to spray molten metal through a cut-out in each stencil ring for forming the indicia.

    摘要翻译： 一种用于标记金属的装置，其中具有安装有模板组件的喷枪组件的主滑架朝向和远离待标记的金属片移动。 喷枪组件或模板组件可以在横向于主滑架的运动方向的方向上相对于另一个运动。 模板组件具有多个模板环，每个模板环具有多个切口，每个环可转位，以便在待标记的金属片的旁边带有特定切口。 在分度操作之后，喷枪组件被激活以通过每个模版环中的切口喷射熔融金属以形成标记。

    Ultraviolet laser ablative patterning of microstructures in semiconductors
    2.
    发明申请
    Ultraviolet laser ablative patterning of microstructures in semiconductors 审中-公开
    半导体微结构的紫外激光烧蚀图案化

    公开(公告)号：US20060091126A1

    公开(公告)日：2006-05-04

    申请号：US11280957

    申请日：2005-11-15

    申请人： Brian Baird ,  Michael Wolfe ,  Richard Harris ,  Kevin Fahey ,  Lian-Cheng Zou ,  Thomas McNeil

    发明人： Brian Baird ,  Michael Wolfe ,  Richard Harris ,  Kevin Fahey ,  Lian-Cheng Zou ,  Thomas McNeil

    IPC分类号： B23K26/38 ,  B23K26/067

    CPC分类号： H01L21/78 ,  B23K26/0604 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

    摘要： Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, GaAs, indium phosphide, or single crystalline sapphire, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindrical through-hole openings for integrated circuit connections; singulation of processed die contained on semiconductor wafers; and microtab cutting to separate microcircuit workpieces from a parent semiconductor wafer. Laser output pulses (32) from a diode-pumped, Q-switched frequency-tripled Nd:YAG, Nd:YVO4, or Nd:YLF is directed to the workpiece (12) with high speed precision using a compound beam positioner. The optical system produces a Gaussian spot size, or top hat beam profile, of about 10 microns. The pulse energy used for high-speed ablative processing of semiconductors using this focused spot size is greater than 200 μJ per pulse at pulse repetition frequencies greater than 5 kHz and preferably above 15 kHz. The laser pulsewidth measured at the full width half-maximum points is preferably less than 80 ns.

    摘要翻译： 特征尺寸小于50微米的图案使用紫外激光烧蚀直接在半导体，特别是硅，GaAs，磷化铟或单晶蓝宝石中形成。 这些图案包括用于集成电路连接的非常高的纵横比圆柱形通孔开口; 包含在半导体晶片上的加工芯片的分割; 和微型切割以从母半导体晶片分离微电路工件。 来自二极管泵浦Q开关频率三倍的Nd：YAG，Nd：YVO 4或Nd：YLF的激光输出脉冲（32）以高速精度被引导到工件（12） 使用复合光束定位器。 光学系统产生约10微米的高斯光点尺寸或顶帽光束轮廓。 用于使用这种聚焦光点尺寸的半导体高速烧蚀处理的脉冲能量大于5kHz，优选高于15kHz的脉冲重复频率时，每脉冲大于200μJ。 在全宽度半最大点处测量的激光脉冲宽度优选小于80ns。

    Series wiring of highly reliable light sources
    3.
    发明申请
    Series wiring of highly reliable light sources 有权
    高可靠性光源系列接线

    公开(公告)号：US20070030678A1

    公开(公告)日：2007-02-08

    申请号：US10577513

    申请日：2004-10-29

    申请人： Jon Bedson ,  Thomas McNeil ,  Mark Owen

    发明人： Jon Bedson ,  Thomas McNeil ,  Mark Owen

    IPC分类号： F21V21/00

    CPC分类号： H05B33/0821 ,  H05B33/0809 ,  H05B33/0818 ,  H05B33/089 ,  Y10S362/80

    摘要： The light array of this invention includes a number of columns and rows of LED's connected in a series/parallel combination. The series parallel combinations effectively optimize the impedance, accommodate failure rate, facilitate light mixing, provide a means of imbedding redundancy, and common cathodes or anodes. This arrangement provides a superior light source for consumer, industrial and specialty markets in respect to mean time between failure, process control, radiant intensity, wavelength mixing, power requirements and other characteristics of the light source. Each column includes a number of rows of plural LED's. The LED's in each row are wired in series and each column is wired in parallel so that if one LED fails only the LED's connected in series with the failed LED will also fail. There is redundancy in the circuit as well as the arrays so that if there are failures different current carrying elements or different series LEDS will automatically by powered on. The array may be connected in series with one or more LED arrays to form a module. Multiple modules may be connected in series with other multiple modules.

    摘要翻译： 本发明的光阵列包括串联/并联组合连接的多个列和LED列。 串联并联组合有效优化阻抗，适应故障率，便于光混合，提供嵌入式冗余的方式，以及常见的阴极或阳极。 这种布置为消费者，工业和专业市场提供了在故障，过程控制，辐射强度，波长混合，功率需求和光源的其他特性之间的平均时间方面的优异光源。 每列包含多行多个LED。 每行中的LED串联连接，每列并联连接，以便如果一个LED发生故障，则只有与故障LED串联的LED也将失败。 在电路和阵列中存在冗余，以便如果存在故障，不同的载流元件或不同的LED系列将自动通过电源接通。 阵列可以与一个或多个LED阵列串联连接以形成模块。 多个模块可以与其他多个模块串联连接。