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    Conductive pad with high abrasion
    2.
    发明申请
    Conductive pad with high abrasion 审中-公开
    高耐磨导电垫

    公开(公告)号：US20050194681A1

    公开(公告)日：2005-09-08

    申请号：US11066599

    申请日：2005-02-25

    申请人： Yongqi Hu ,  Stan Tsai ,  Martin Wohlert ,  Feng Liu ,  Liang-Yuh Chen

    发明人： Yongqi Hu ,  Stan Tsai ,  Martin Wohlert ,  Feng Liu ,  Liang-Yuh Chen

    IPC分类号： H01L23/48

    CPC分类号： B24B37/22 ,  B23H5/08 ,  H01L21/67155

    摘要： A method and apparatus for a planarizing or polishing article for Electrochemical Mechanical Planarization (ECMP) is disclosed. The polishing article is a pad assembly having a plurality of conductive domains and a plurality of abrasive domains on a processing surface. The abrasive domains and the conductive domains comprise a plurality of contact elements that are adapted to bias a semiconductor substrate while also providing abrasive qualities to enhance removal of material deposited on the substrate.

    摘要翻译： 公开了一种用于电化学机械平面化（ECMP）的平面化或抛光制品的方法和装置。 抛光制品是在处理表面上具有多个导电区域和多个磨料区域的垫组件。 研磨区域和导电区域包括适于偏置半导体衬底的多个接触元件，同时还提供磨料质量以增强沉积在衬底上的材料的去除。

    Method and apparatus for reduced wear polishing pad conditioning
    3.
    发明申请
    Method and apparatus for reduced wear polishing pad conditioning 失效
    降低磨损抛光垫调理的方法和装置

    公开(公告)号：US20060046623A1

    公开(公告)日：2006-03-02

    申请号：US11209167

    申请日：2005-08-22

    申请人： Yan Wang ,  Stan Tsai ,  Yongqi Hu ,  Feng Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Tran ,  Martin Wohlert ,  Renhe Jia ,  Yuan Tian

    发明人： Yan Wang ,  Stan Tsai ,  Yongqi Hu ,  Feng Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Tran ,  Martin Wohlert ,  Renhe Jia ,  Yuan Tian

    IPC分类号： B24B1/00

    CPC分类号： B24B53/017 ,  B23H5/08

    摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.

    摘要翻译： 提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。 在一个实施例中，调节头包括设置在中心腔中的刷子。 清洁流体通过调节头的中心空腔设置到处理垫。 刷子旋转并横向移动到处理垫的表面上。 通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻地擦拭处理垫。 调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。 清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

    Method and composition for polishing a substrate
    4.
    发明申请
    Method and composition for polishing a substrate 审中-公开
    抛光基材的方法和组合物

    公开(公告)号：US20060021974A1

    公开(公告)日：2006-02-02

    申请号：US10948958

    申请日：2004-09-24

    申请人： Feng Liu ,  Stan Tsai ,  Martin Wohlert ,  Yuan Tian ,  Renhe Jia ,  Yongqi Hu ,  Liang-Yuh Chen

    发明人： Feng Liu ,  Stan Tsai ,  Martin Wohlert ,  Yuan Tian ,  Renhe Jia ,  Yongqi Hu ,  Liang-Yuh Chen

    IPC分类号： C03C15/00 ,  C09K13/00

    CPC分类号： H01L21/7684 ,  C25F3/16 ,  C25F3/26 ,  H01L21/32125

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a conductive material from a substrate surface including sulfuric acid or derivative, phosphoric acid or derivative, a first chelating agent including an organic salt, a pH adjusting agent to provide a pH between about 2 and about 10 and a solvent. The composition may further include a second chelating agent. The composition may be used in a single step or two step electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as tungsten, with a reduction in planarization type defects.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供一种组合物，用于从包括硫酸或衍生物，磷酸或衍生物的底物表面至少去除导电材料，包括有机盐的第一螯合剂，pH调节剂以提供约2 约10和溶剂。 组合物还可以包括第二螯合剂。 组合物可以用于单步或两步电化学机械平面化工艺。 本文所述的抛光组合物和方法提高了材料从衬底表面（例如钨）的有效去除速率，同时平坦化型缺陷的减少。

    Conditioning element for electrochemical mechanical processing
    5.
    发明申请
    Conditioning element for electrochemical mechanical processing 审中-公开
    电化学机械加工的调节元件

    公开(公告)号：US20060276111A1

    公开(公告)日：2006-12-07

    申请号：US11142918

    申请日：2005-06-02

    申请人： Yuan Tian ,  Alpay Yilmaz ,  Gerald Alonzo ,  Martin Wohlert ,  Yongqi Hu ,  Stan Tsai ,  Robert Ewald ,  Shou-Sung Chang

    发明人： Yuan Tian ,  Alpay Yilmaz ,  Gerald Alonzo ,  Martin Wohlert ,  Yongqi Hu ,  Stan Tsai ,  Robert Ewald ,  Shou-Sung Chang

    IPC分类号： B24B1/00 ,  B24B33/00

    CPC分类号： B24B53/017 ,  B24B53/12

    摘要： Embodiments of a conditioning element for conditioning a processing pad are provided herein. In one embodiment, a conditioning element for conditioning a processing pad includes a body having a face. A plurality of diamond particles are disposed on the face and define a conditioning surface. The diamond particles are of a type selected from the group consisting of very blocky (4D), blocky (3D), and irregular (2D), and have a shape ratio less than or equal to 1.2. In one embodiment, the diamond particles have an average size of between about 85 and about 115 μm. In one embodiment, the size of the diamond particles may have a standard of deviation that is less than about 5 μm. In one embodiment, the diamond particles may have a spacing of greater than 400 μm.

    摘要翻译： 本文提供了用于调节加工垫的调节元件的实施例。 在一个实施例中，用于调节处理垫的调节元件包括具有面的主体。 多个金刚石颗粒设置在面上并限定调理表面。 金刚石颗粒是选自非常块状（4D），块状（3D）和不规则（2D）的类型，并且具有小于或等于1.2的形状比。 在一个实施方案中，金刚石颗粒的平均尺寸为约85至约115μm。 在一个实施方案中，金刚石颗粒的尺寸可以具有小于约5μm的偏差标准。 在一个实施例中，金刚石颗粒可以具有大于400μm的间隔。

    Metal CMP process on one or more polishing stations using slurries with oxidizers
    6.
    发明申请
    Metal CMP process on one or more polishing stations using slurries with oxidizers 审中-公开
    使用具有氧化剂的浆料在一个或多个抛光站上进行金属CMP处理

    公开(公告)号：US20060219663A1

    公开(公告)日：2006-10-05

    申请号：US11338146

    申请日：2006-01-23

    申请人： Shi-Ping Wang ,  Martin Wohlert ,  Alain Duboust ,  Renhe Jia ,  Feng Liu ,  Yuan Tian ,  Liang-Yuh Chen ,  Stan Tsai ,  Wei-Yung Hsu

    发明人： Shi-Ping Wang ,  Martin Wohlert ,  Alain Duboust ,  Renhe Jia ,  Feng Liu ,  Yuan Tian ,  Liang-Yuh Chen ,  Stan Tsai ,  Wei-Yung Hsu

    IPC分类号： C03C15/00 ,  H01L21/302 ,  B44C1/22 ,  H01L21/461

    CPC分类号： H01L21/3212 ,  C09G1/02 ,  C23F3/04 ,  C23F3/06 ,  H01L21/32125 ,  H01L21/7684

    摘要： Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. In one aspect, a full sequence electrochemical mechanical planarization technique is provided. In another aspect, a hybrid planarization technique using combination of at least one chemical mechanical polishing process and at least one electrochemical mechanical polishing process is provided. In addition, a multi-step polishing process for polishing a substrate surface using at least two oxidizers in one or more polishing composition is described. The polishing composition may be used in the full sequence or the hybrid planarization technique. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface with a reduction in planarization defects.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料和阻挡材料的方法。 一方面，提供了全序列电化学机械平面化技术。 在另一方面，提供了使用至少一种化学机械抛光工艺和至少一种电化学机械抛光工艺的组合的混合平面化技术。 此外，描述了在一种或多种研磨组合物中使用至少两种氧化剂来研磨衬底表面的多步抛光方法。 抛光组合物可以以全序或混合平面化技术使用。 本文所述的抛光组合物和方法改善了材料从衬底表面的有效去除速率，同时减小了平坦化缺陷。

    Integrated Edge Clamping Mechanism for Processing of Laminates
    7.
    发明申请
    Integrated Edge Clamping Mechanism for Processing of Laminates 审中-公开
    用于加工层压板的集成边缘夹紧机构

    公开(公告)号：US20100263715A1

    公开(公告)日：2010-10-21

    申请号：US12425857

    申请日：2009-04-17

    申请人： Martin Wohlert ,  Pierluigi Lo-Menzo ,  Nicolas Barrois

    发明人： Martin Wohlert ,  Pierluigi Lo-Menzo ,  Nicolas Barrois

    IPC分类号： H01L31/048 ,  B32B37/06

    CPC分类号： B32B37/003 ,  B32B37/1018 ,  B32B2309/105 ,  B32B2457/12 ,  H01L31/048 ,  Y02E10/50 ,  Y10T156/1093

    摘要： Apparatuses, assemblies and methods for decreasing the frequency and severity of bubble defects in a photovoltaic module laminate. The apparatuses, assemblies and methods utilize at least one clamp having a plurality of grooves sized to apply pressure on the back surface of the glass substrate in the direction of the top glass layer and pressure on the top glass layer of the module directed toward the glass substrate to apply compressive force to the module without causing damage to the module.

    摘要翻译： 用于降低光伏组件层压板中气泡缺陷的频率和严重性的装置，组件和方法。 装置，组件和方法利用至少一个夹具，其具有多个凹槽，其尺寸适于在顶部玻璃层的方向上对玻璃基板的背面施加压力，并且在朝向玻璃的模块的顶部玻璃层上施加压力 基板对模块施加压力，而不会造成模块损坏。