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1.发明申请SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MANUFACTURING 失效使用铅笔和夹子的半导体芯片封装及其制造方法公开(公告)号：US20080044946A1
公开(公告)日：2008-02-21
申请号：US11856635
申请日：2007-09-17
申请人： Erwin Victor Cruz , Elsie Cabahug , Ti Ching Shian , Venkat Iyer
发明人： Erwin Victor Cruz , Elsie Cabahug , Ti Ching Shian , Venkat Iyer
IPC分类号： H01L21/60
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/568 , H01L23/49548 , H01L23/49551 , H01L23/49562 , H01L24/33 , H01L24/37 , H01L24/39 , H01L24/83 , H01L24/97 , H01L2224/16245 , H01L2224/29109 , H01L2224/29111 , H01L2224/29116 , H01L2224/2919 , H01L2224/32057 , H01L2224/32245 , H01L2224/37147 , H01L2224/73253 , H01L2224/83385 , H01L2224/83801 , H01L2224/8485 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12032 , H01L2924/12041 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/19043 , H01L2924/3651 , H01L2224/83 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).
摘要翻译： 公开了一种用于半导体封装的夹子结构。 夹子结构包括主要部分，从主要部分延伸的至少一个基座，下降部分和引导部分。 凹陷部分在引导部分和主要部分之间。 夹子结构可用于MLP（微引线框封装）。
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公开(公告)号：US08513059B2
公开(公告)日：2013-08-20
申请号：US13186246
申请日：2011-07-19
IPC分类号： H01L21/00
CPC分类号： H01L23/49562 , H01L23/49524 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/03912 , H01L2224/37147 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
摘要翻译： 公开了一种制造预制夹子结构的方法。 该方法包括获得第一夹子和第二夹子，以及围绕第一夹子形成包括第一表面的模制材料，并且第二夹子包括第二表面。 第一夹子结构的第一表面和第二夹子结构的第二表面通过模制材料暴露，然后形成预制的夹子结构。
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公开(公告)号：US20090224383A1
公开(公告)日：2009-09-10
申请号：US12044314
申请日：2008-03-07
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/37 , H01L24/40 , H01L2224/32245 , H01L2224/37011 , H01L2224/37147 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/40249 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A clip structure and semiconductor die package. The clip structure includes a first portion and a second portion, with a connecting structure located between the first and second portion. The clip structure is substantially planar. The semiconductor die package includes a semiconductor die located between a leadframe structure and a clip structure. Slots are formed within the molding material covering portions of the semiconductor die package. The slots are located between a first portion and the second portion of the clip structure, and the slot overlap with the semiconductor die.
摘要翻译： 夹子结构和半导体管芯封装。 夹子结构包括第一部分和第二部分，其中连接结构位于第一部分和第二部分之间。 夹子结构基本上是平面的。 半导体管芯封装包括位于引线框架结构和夹子结构之间的半导体管芯。 在覆盖半导体管芯封装的部分的成型材料内形成槽。 槽位于夹结构的第一部分和第二部分之间，并且槽与半导体管芯重叠。
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公开(公告)号：US20090057855A1
公开(公告)日：2009-03-05
申请号：US11847670
申请日：2007-08-30
申请人： Maria Clemens Quinones , Erwin Victor Cruz , Marvin Gestole , Ruben P. Madrid , Connie N. Tangpuz
发明人： Maria Clemens Quinones , Erwin Victor Cruz , Marvin Gestole , Ruben P. Madrid , Connie N. Tangpuz
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/49562 , H01L23/49551 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L2224/16245 , H01L2224/32245 , H01L2224/371 , H01L2224/37599 , H01L2224/40245 , H01L2224/40247 , H01L2224/73153 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor die package. It includes a semiconductor die including a first surface and a second surface opposite the first surface, an optional conductive structure, and a leadframe structure. The leadframe structure comprises a central portion suitable for supporting the semiconductor die, and a plurality of stand-off structures coupled to the central portion of the leadframe structure. The stand-off structures can support the conductive structure, and the conductive structure is attached to the second surface of the semiconductor die.
摘要翻译： 半导体管芯封装。 其包括半导体管芯，其包括第一表面和与第一表面相对的第二表面，可选的导电结构和引线框架结构。 引线框架结构包括适于支撑半导体管芯的中心部分，以及耦合到引线框架结构的中心部分的多个隔离结构。 支架结构可以支撑导电结构，并且导电结构附着到半导体管芯的第二表面。
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公开(公告)号：US20100258924A1
公开(公告)日：2010-10-14
申请号：US12822932
申请日：2010-06-24
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/49524 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/03912 , H01L2224/37147 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
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公开(公告)号：US20110272794A1
公开(公告)日：2011-11-10
申请号：US13186246
申请日：2011-07-19
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/49524 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/03912 , H01L2224/37147 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
摘要翻译： 公开了一种制造预制夹子结构的方法。 该方法包括获得第一夹子和第二夹子，以及围绕第一夹子形成包括第一表面的模制材料，并且第二夹子包括第二表面。 第一夹子结构的第一表面和第二夹子结构的第二表面通过模制材料暴露，然后形成预制的夹子结构。
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公开(公告)号：US08008759B2
公开(公告)日：2011-08-30
申请号：US12822932
申请日：2010-06-24
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49562 , H01L23/49524 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/03912 , H01L2224/37147 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
摘要翻译： 公开了一种制造预制夹子结构的方法。 该方法包括获得第一夹子和第二夹子，以及围绕第一夹子形成包括第一表面的模制材料，并且第二夹子包括第二表面。 第一夹子结构的第一表面和第二夹子结构的第二表面通过模制材料暴露，然后形成预制的夹子结构。
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公开(公告)号：US20080173991A1
公开(公告)日：2008-07-24
申请号：US11626503
申请日：2007-01-24
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49562 , H01L23/49524 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/03912 , H01L2224/37147 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
摘要翻译： 公开了一种制造预制夹子结构的方法。 该方法包括获得第一夹子和第二夹子，以及围绕第一夹子形成包括第一表面的模制材料，并且第二夹子包括第二表面。 第一夹子结构的第一表面和第二夹子结构的第二表面通过模制材料暴露，然后形成预制的夹子结构。
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公开(公告)号：US20060189116A1
公开(公告)日：2006-08-24
申请号：US11404650
申请日：2006-04-14
申请人： Rajeev Joshi , Consuelo Tangpuz , Margie Rios , Erwin Victor Cruz
发明人： Rajeev Joshi , Consuelo Tangpuz , Margie Rios , Erwin Victor Cruz
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2224/11 , H01L2224/1134 , H01L2224/13099 , H01L2224/13111 , H01L2224/13147 , H01L2224/16 , H01L2224/81192 , H01L2224/81193 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2224/29099 , H01L2924/00 , H01L2224/05655 , H01L2924/00014 , H01L2224/05666 , H01L2224/05124
摘要： A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed to the conductive region on the semiconductor die. The coated wire is cut, thereby leaving a conductive stud bump on the conductive region, where the conductive stud bump includes an inner conductive portion and an outer oxidation-resistant layer.
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公开(公告)号：US07838340B2
公开(公告)日：2010-11-23
申请号：US12822675
申请日：2010-06-24
IPC分类号： H01L21/00
CPC分类号： H01L23/49562 , H01L23/49524 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/03912 , H01L2224/37147 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
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