公开(公告)号：US07514921B2

公开(公告)日：2009-04-07

申请号：US10595980

申请日：2004-11-23

申请人： Eung Je Woo ,  Jin Keun Seo ,  Oh In Kwon ,  Tae Seong Kim ,  Byung II Lee ,  Suk Ho Lee

发明人： Eung Je Woo ,  Jin Keun Seo ,  Oh In Kwon ,  Tae Seong Kim ,  Byung II Lee ,  Suk Ho Lee

IPC分类号： G01V3/00 ,  A61B5/05

CPC分类号： A61B5/0536 ,  A61B5/055 ,  A61B5/4504 ,  G01N27/72 ,  G01R33/4808

摘要： System for visualizing conductivity and current density distributions including a plurality of current injecting devices (100) for injecting currents into a measuring object; a measuring unit(200) for measuring a magnetic flux density due to the currents injected into a measuring object; an operating unit(300) for selecting one pair of the current injecting devices in succession so as to inject currents of different directions into the measuring object, and calculating directional components of an anisotropic conductivity inside of the measuring object on the basis of the measured magnetic flux density; and displaying means for visualizing an inside of the measuring object by using the calculated directional components of the anisotropic conductivity.

摘要翻译： 用于可视化电导率和电流密度分布的系统，包括用于将电流注入到测量对象中的多个电流注入装置（100） 测量单元（200），用于测量由于注入到测量对象中的电流引起的磁通密度; 操作单元（300），用于连续选择一对电流注入装置，以便将不同方向的电流注入到测量对象中，并且基于测量的磁体计算测量对象内的各向异性导电率的方向分量 通量密度; 以及显示装置，用于通过使用所计算的各向异性导电率的方向分量来可视化测量对象的内部。

公开(公告)号：US20070088210A1

公开(公告)日：2007-04-19

申请号：US10595980

申请日：2004-11-23

申请人： Eung Je Woo ,  Jin Keun Seo ,  Oh In Kwon ,  Tae Seong Kim ,  Byung Il Lee ,  Suk Ho Lee

发明人： Eung Je Woo ,  Jin Keun Seo ,  Oh In Kwon ,  Tae Seong Kim ,  Byung Il Lee ,  Suk Ho Lee

IPC分类号： A61B5/05

CPC分类号： A61B5/0536 ,  A61B5/055 ,  A61B5/4504 ,  G01N27/72 ,  G01R33/4808

摘要： System for visualizing conductivity and current density distributions including a plurality of current injecting devices (100) for injecting currents into a measuring object; a measuring unit (200) for measuring a magnetic flux density due to the currents injected into a measuring object; an operating unit (300) for selecting one pair of the current injecting devices in succession so as to inject currents of different directions into the measuring object, and calculating directional components of an anisotropic conductivity inside of the measuring object on the basis of the measured magnetic flux density; and displaying means for visualizing an inside of the measuring object by using the calculated directional components of the anisotropic conductivity.

摘要翻译： 用于可视化电导率和电流密度分布的系统，包括用于将电流注入到测量对象中的多个电流注入装置（100） 测量单元（200），用于测量由于注入到测量对象中的电流引起的磁通密度; 操作单元（300），用于连续选择一对电流注入装置，以便将不同方向的电流注入到测量对象中，并且基于测量的磁体计算测量对象内的各向异性导电率的方向分量 通量密度; 以及显示装置，用于通过使用所计算的各向异性导电率的方向分量来可视化测量对象的内部。

公开(公告)号：US08749555B2

公开(公告)日：2014-06-10

申请号：US12420004

申请日：2009-04-07

申请人： Tae Seong Kim ,  Min Jeong Lee ,  Hang Shin Cho

发明人： Tae Seong Kim ,  Min Jeong Lee ,  Hang Shin Cho

IPC分类号： G06T13/00 ,  G06K9/46 ,  G06K9/48

CPC分类号： H04N13/275 ,  A63F13/10 ,  A63F13/213 ,  A63F13/65 ,  A63F2300/1087 ,  A63F2300/406 ,  A63F2300/6045 ,  G06F3/04883 ,  H04N13/10 ,  H04N13/261

摘要： A processing method of interfacing a 3D image and a camera image is provided. In the processing method, a specific image pattern defined by a user is recognized, the recognized pattern is traced within an image, and a camera image and a 3D image are interfaced based on the tracing result. A 3D object is animated and rendered using a 3D graphic engine. The rendered image of the 3D object and the camera image are integrated and displayed.

摘要翻译： 提供了一种连接3D图像和摄像机图像的处理方法。 在处理方法中，识别由用户定义的特定图像图案，在图像中追踪识别的图案，并且基于跟踪结果来连接相机图像和3D图像。 3D对象是使用3D图形引擎进行动画和渲染的。 3D对象和相机图像的渲染图像被集成并显示。

公开(公告)号：US07718523B1

公开(公告)日：2010-05-18

申请号：US11875597

申请日：2007-10-19

申请人： Min Yoo ,  Tae Seong Kim ,  Ji Young Chung

发明人： Min Yoo ,  Tae Seong Kim ,  Ji Young Chung

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L2224/03828 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/111 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H05K2201/10734 ,  H05K2203/033 ,  H05K2203/043 ,  H05K2203/0485 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A solder attach film includes a first cover film, a flux layer, a solder layer, and a second cover film, and it can be treated or kept in a roll shape. A solder ball forming method using the solder attach film includes preparing a semiconductor package or a semiconductor die, adhering the solder attach film, gridding, and reflowing. In the solder attach film adhering operation, the first cover film and the second cover film are removed, and the flux layer is adhered to electrically conductive pads of the semiconductor package or the semiconductor die. Subsequently, in the reflowing operation, the flux layer is volatilized and removed, and the solder layer is fused and fixed to the electrically conductive pads, so that solder balls are formed.

摘要翻译： 焊接附着膜包括第一覆盖膜，焊剂层，焊料层和第二覆盖膜，并且其可以被处理或保持为辊状。 使用焊料附着膜的焊球形成方法包括制备半导体封装或半导体管芯，粘附焊料附着膜，网格化和回流。 在焊料附着膜附着操作中，去除第一覆盖膜和第二覆盖膜，并且将焊剂层粘附到半导体封装或半导体管芯的导电焊盘。 随后，在回流操作中，磁通层被挥发除去，焊料层被熔融固定在导电焊盘上，从而形成焊球。

公开(公告)号：US08988479B2

公开(公告)日：2015-03-24

申请号：US12062365

申请日：2008-04-03

申请人： Tae Seong Kim ,  Yeon Woo Park

发明人： Tae Seong Kim ,  Yeon Woo Park

IPC分类号： H04N7/14 ,  H04M3/42 ,  H04B1/00

CPC分类号： H04N7/147

摘要： A video communication method, computer program product and video communication terminal implementing the same are disclosed, by which a terminal user is assisted by identifying what kind of conversation he had with a specific correspondent user by reading a phone call list on a terminal. The present invention includes a step of accessing the video communication, a step of storing a video of the video communication, and a step of displaying a communication list item of the video communication together with the stored video.

摘要翻译： 公开了一种视频通信方法，实现该方法的视频通信方法，计算机程序产品和视频通信终端，通过该终端用户通过在终端上阅读电话呼叫列表来识别与特定通信用户的通话类型进行协助。 本发明包括访问视频通信的步骤，存储视频通信的视频的步骤以及与存储的视频一起显示视频通信的通信列表项的步骤。

公开(公告)号：US07859107B1

公开(公告)日：2010-12-28

申请号：US12798412

申请日：2010-04-02

申请人： Min Yoo ,  Tae Seong Kim ,  Ji Young Chung

发明人： Min Yoo ,  Tae Seong Kim ,  Ji Young Chung

IPC分类号： H01L23/12

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L2224/03828 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/111 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H05K2201/10734 ,  H05K2203/033 ,  H05K2203/043 ,  H05K2203/0485 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A solder attach film includes a first cover film, a flux layer, a solder layer, and a second cover film, and it can be treated or kept in a roll shape. A solder ball forming method using the solder attach film includes preparing a semiconductor package or a semiconductor die, adhering the solder attach film, gridding, and reflowing. In the solder attach film adhering operation, the first cover film and the second cover film are removed, and the flux layer is adhered to electrically conductive pads of the semiconductor package or the semiconductor die. Subsequently, in the reflowing operation, the flux layer is volatilized and removed, and the solder layer is fused and fixed to the electrically conductive pads, so that solder balls are formed.

摘要翻译： 焊接附着膜包括第一覆盖膜，焊剂层，焊料层和第二覆盖膜，并且其可以被处理或保持为辊状。 使用焊料附着膜的焊球形成方法包括制备半导体封装或半导体管芯，粘附焊料附着膜，网格化和回流。 在焊料附着膜附着操作中，去除第一覆盖膜和第二覆盖膜，并且将焊剂层粘附到半导体封装或半导体管芯的导电焊盘。 随后，在回流操作中，磁通层被挥发除去，焊料层被熔融固定在导电焊盘上，从而形成焊球。