公开(公告)号：US20170011951A1

公开(公告)日：2017-01-12

申请号：US15273811

申请日：2016-09-23

申请人： Evatec AG

发明人： Sven Uwe Rieschl ,  Mohamed Elghazzali ,  Jurgen Weichart

IPC分类号： H01L21/687 ,  H01J37/34 ,  H01J37/32 ,  C23C16/50 ,  H01L21/67 ,  C23C16/52 ,  C23C16/458 ,  H01L21/768 ,  H01L21/683

CPC分类号： H01L21/68785 ,  C23C14/50 ,  C23C14/541 ,  C23C16/4585 ,  C23C16/4586 ,  C23C16/466 ,  C23C16/50 ,  C23C16/52 ,  H01J37/32715 ,  H01J37/347 ,  H01J37/3488 ,  H01L21/2855 ,  H01L21/67253 ,  H01L21/6833 ,  H01L21/68721 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/76838 ,  H01L21/76873 ,  H01L21/76879

摘要： Apparatus for depositing a layer on a substrate in a process gas includes a chuck containing a first surface for supporting the substrate, a clamp for securing the substrate to the first surface of the chuck, an evacuatable enclosure enclosing the chuck and the clamp and control apparatus. The evacuatable enclosure includes an inlet, through which the processing gas is insertable into the enclosure. The control apparatus is adapted to move at least one of the chuck and the clamp relative to, and independently of, one another to adjust a spacing between the chuck and the clamp during a single deposition process whilst maintaining a flow of the processing gas and a pressure within the enclosure that is less than atmospheric pressure.

摘要翻译： 用于在工艺气体中在衬底上沉积层的装置包括：卡盘，其包含用于支撑衬底的第一表面;用于将衬底固定到卡盘的第一表面的夹具;封闭卡盘的可抽空外壳以及夹具和控制装置 。 可抽空的外壳包括入口，处理气体可通过入口插入外壳中。 控制装置适于相对于并且彼此独立地移动卡盘和夹具中的至少一个，以在单个沉积过程中调节卡盘和夹具之间的间隔，同时保持处理气体的流动和 外壳内的压力小于大气压力。

公开(公告)号：US09624572B2

公开(公告)日：2017-04-18

申请号：US14765975

申请日：2014-02-07

申请人： Evatec AG

发明人： Sven Uwe Rieschl ,  Juergen Weichart

IPC分类号： C23C14/35 ,  H01J37/34 ,  C23C14/34

CPC分类号： C23C14/351 ,  C23C14/3407 ,  C23C14/3485 ,  C23C14/3492 ,  C23C14/35 ,  H01J37/3405 ,  H01J37/3426 ,  H01J37/3455 ,  H01J37/3467

摘要： So as to control the operation of a sputter target (9) during lifetime of the target and under HIPIMS operation part (I) of a magnet arrangement associated to the target (9) is retracted from the target (9) whereas a second part II of the magnet arrangement is, if at all, retracted less from the addressed backside (7) during lifetime of the target (9). Thereby, part I is closer to the periphery of target (9) than part II, as both are eccentrically rotated about a rotational axis (A).

公开(公告)号：US10388559B2

公开(公告)日：2019-08-20

申请号：US15273811

申请日：2016-09-23

申请人： Evatec AG

发明人： Sven Uwe Rieschl ,  Mohamed Elghazzali ,  Jurgen Weichart

IPC分类号： H01L21/687 ,  C23C14/50 ,  C23C14/54 ,  C23C16/458 ,  C23C16/46 ,  H01L21/285 ,  H01L21/768 ,  C23C16/50 ,  C23C16/52 ,  H01J37/32 ,  H01J37/34 ,  H01L21/67 ,  H01L21/683

摘要： Apparatus for depositing a layer on a substrate in a process gas includes a chuck containing a first surface for supporting the substrate, a clamp for securing the substrate to the first surface of the chuck, an evacuatable enclosure enclosing the chuck and the clamp and control apparatus. The evacuatable enclosure includes an inlet, through which the processing gas is insertable into the enclosure. The control apparatus is adapted to move at least one of the chuck and the clamp relative to, and independently of, one another to adjust a spacing between the chuck and the clamp during a single deposition process while maintaining a flow of the processing gas and a pressure within the enclosure that is less than atmospheric pressure.

公开(公告)号：US20170204511A1

公开(公告)日：2017-07-20

申请号：US15475331

申请日：2017-03-31

申请人： Evatec AG

发明人： Sven Uwe Rieschl ,  Juergen Weichart

IPC分类号： C23C14/34 ,  C23C14/35 ,  H01J37/34

CPC分类号： C23C14/351 ,  C23C14/3407 ,  C23C14/3485 ,  C23C14/3492 ,  C23C14/35 ,  H01J37/3405 ,  H01J37/3426 ,  H01J37/3455 ,  H01J37/3467

摘要： So as to control the operation of a sputter target during the lifetime of the target and under HIPIMS operation, part of a magnet arrangement associated to the target is retracted from the target whereas a second part II of the magnet arrangement is, if at all, retracted less from the addressed backside during the lifetime of the target. Thereby, part I is closer to the periphery of target than part II, as both are eccentrically rotated about a rotational axis.

公开(公告)号：US10202682B2

公开(公告)日：2019-02-12

申请号：US15475331

申请日：2017-03-31

申请人： Evatec AG

发明人： Sven Uwe Rieschl ,  Juergen Weichart

IPC分类号： C23C14/35 ,  H01J37/34 ,  C23C14/34

摘要： So as to control the operation of a sputter target during the lifetime of the target and under HIPIMS operation, part of a magnet arrangement associated to the target is retracted from the target whereas a second part II of the magnet arrangement is, if at all, retracted less from the addressed backside during the lifetime of the target. Thereby, part I is closer to the periphery of target than part II, as both are eccentrically rotated about a rotational axis.