Powered hinge assembly for vehicle doors

    公开(公告)号:US11365578B2

    公开(公告)日:2022-06-21

    申请号:US16555055

    申请日:2019-08-29

    IPC分类号: E05F15/70 B60J5/04 E05F15/614

    摘要: An automated door system includes a hinge assembly having a movable hinge portion coupled to a door and a fixed hinge portion coupled to a vehicle body at a hinge pillar. The movable hinge portion includes first and second mounting portions. The first mounting portion is rotatably connected to the fixed hinge portion for rotation about a hinge axis of the hinge assembly. A power assist device is coupled to the fixed hinge portion and further coupled to the second mounting portion of the movable hinge portion by a drive shaft. The power assist device includes a motor that is configured to drive the drive shaft for providing at least one of an opening and a closing movement of the door about the hinge axis of the hinge assembly.

    POLYMERIC OVERCOATED ANODIZED WIRE
    9.
    发明申请
    POLYMERIC OVERCOATED ANODIZED WIRE 有权
    聚合物过氧化阳极化线

    公开(公告)号:US20140110147A1

    公开(公告)日:2014-04-24

    申请号:US13654781

    申请日:2012-10-18

    IPC分类号: H01B9/02 H01B15/00

    摘要: An insulated electric conductor and method for making such a conductor are disclosed. The conductor comprises a copper core, a layer of aluminum formed over the copper core, an aluminum oxide dielectric layer formed over the layer of aluminum, and a thin polymeric layer formed over said aluminum oxide dielectric layer. The thin polymeric layer is preferably between about 30 microns (0.001″) and about 500 microns (0.02″) and is more preferably between about 45 microns (0.0015″) and about 250 microns (0.01″). The polymeric layer may be any polymeric material selected from the group consisting of acrylic resins, epoxy resins, polyurethane resins, and silicone resins. Other polymeric materials may be used. The polymeric layer may be formed by a variety of methods including, but not limited to, spraying, brushing, dipping, and powder coating.

    摘要翻译: 公开了一种用于制造这种导体的绝缘电导体和方法。 导体包括铜芯,在铜芯上形成的铝层,在铝层上形成的氧化铝电介质层,以及形成在所述氧化铝介电层上的薄聚合物层。 薄聚合物层优选在约30微米(0.001“)至约500微米(0.02”)之间,更优选在约45微米(0.0015“)至约250微米(0.01”)之间。 聚合物层可以是选自丙烯酸树脂,环氧树脂,聚氨酯树脂和有机硅树脂的任何聚合材料。 可以使用其它聚合物材料。 聚合物层可以通过多种方法形成,包括但不限于喷涂,刷涂,浸渍和粉末涂料。