公开(公告)号：US20220107561A1

公开(公告)日：2022-04-07

申请号：US17548595

申请日：2021-12-13

Applicant: FUJIFILM Corporation

Inventor： Keiyu OU ,  Naohiro TANGO ,  Kei YAMAMOTO ,  Kazuhiro MARUMO

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  C08F220/18 ,  C08F220/28 ,  C07C381/12 ,  C07C311/51 ,  C07C311/09 ,  C07C309/17 ,  C07D333/46 ,  C07D327/06 ,  C07C309/42 ,  C07C311/48 ,  C07D333/76 ,  C07D327/08

Abstract: A method for producing an actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention is a method for producing an actinic ray-sensitive or radiation-sensitive resin composition including at least a resin having a polarity that increases due to decomposition by the action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation, and a solvent, in which the compound that generates an acid upon irradiation with actinic rays or radiation includes one or more compounds selected from the group consisting of a compound (I) to (III) below, and the actinic ray-sensitive or radiation-sensitive resin composition is produced by mixing a first solution including the resin having a polarity that increases by the action of an acid and a first solvent with the one or more compounds selected from the group consisting of the compound (I) to (III).

公开(公告)号：US20180275518A1

公开(公告)日：2018-09-27

申请号：US15994521

申请日：2018-05-31

Applicant: FUJIFILM Corporation

Inventor： Naoki INOUE ,  Naohiro TANGO ,  Michihiro SHIRAKAWA ,  Akiyoshi GOTO

IPC: G03F7/11 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  G03F7/40 ,  C08F220/16 ,  C08F220/28

CPC classification number: G03F7/11 ,  C08F220/16 ,  C08F220/28 ,  C08F2220/283 ,  G03F7/091 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2006 ,  G03F7/2041 ,  G03F7/32 ,  G03F7/38 ,  G03F7/40

Abstract: One embodiment of the present invention provides a pattern forming method including a step for forming an actinic ray-sensitive or radiation-sensitive film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition, a step for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film using a composition for forming an upper layer film, a step for exposing a laminate film including the actinic ray-sensitive or radiation-sensitive film and the upper layer film, and a step for developing the exposed laminate film using a developer including an organic solvent. The composition for forming an upper layer film contains a resin (XA), a resin (XB) containing fluorine atoms, a basic compound (XC), and a solvent (XD), and the resin (XA) is a resin not containing fluorine atoms, or in a case where the resin (XA) contains fluorine atoms, the resin (XA) is a resin having a lower content of fluorine atoms than that in the resin (XB), based on a mass.

公开(公告)号：US20170199461A1

公开(公告)日：2017-07-13

申请号：US15470113

申请日：2017-03-27

Applicant: FUJIFILM Corporation

Inventor： Kei YAMAMOTO ,  Naohiro TANGO ,  Naoki INOUE ,  Michihiro SHIRAKAWA ,  Akiyoshi GOTO

IPC: G03F7/11 ,  G03F7/16 ,  G03F7/32 ,  C08F220/18 ,  C08F220/28 ,  H01L21/027 ,  G03F7/20 ,  G03F7/38 ,  G03F7/40 ,  G03F7/039 ,  G03F7/038 ,  G03F7/004 ,  G03F7/09

Abstract: The present invention has an object to provide a pattern forming method capable of providing good DOF and EL, a resist pattern formed by the pattern forming method, and a method for manufacturing an electronic device, including the pattern forming method. The pattern forming method of the present invention includes a step a of coating an active-light-sensitive or radiation-sensitive resin composition onto a substrate to form a resist film, a step b of coating a composition for forming an upper layer film onto the resist film to form an upper layer film on the resist film, a step c of exposing the resist film having the upper layer film formed thereon, and a step d of developing the exposed resist film using a developer to form a pattern, in which the active-light-sensitive or radiation-sensitive resin composition contains a hydrophobic resin.

公开(公告)号：US20160026083A1

公开(公告)日：2016-01-28

申请号：US14873700

申请日：2015-10-02

Applicant: FUJIFILM CORPORATION

Inventor： Naohiro TANGO ,  Yuichiro ENOMOTO

IPC: G03F7/16 ,  G03F7/32 ,  G03F7/20

CPC classification number: G03F7/16 ,  G03F7/0397 ,  G03F7/091 ,  G03F7/11 ,  G03F7/20 ,  G03F7/2041 ,  G03F7/32 ,  G03F7/322 ,  G03F7/325

Abstract: The present invention has an object to provide a pattern forming method, in which even when a pattern which is fine and has a high aspect ratio is formed, the collapse or peeling of the pattern is inhibited; a method for manufacturing an electronic device, including the pattern forming method; and an electronic device manufactured by the manufacturing method. The pattern forming method of the present invention includes an adhesion aiding layer forming step of forming an adhesion aiding layer containing a polymerizable group and having a light transmittance of 80% or more at a wavelength of 193 nm on a substrate; a resist film forming step of applying a radiation-sensitive resin composition onto the adhesion aiding layer to form a resist film; an exposing step of exposing the resist film; and a developing step of developing the exposed resist film to form a pattern.

Abstract translation: 本发明的目的是提供一种图案形成方法，其中即使形成精细且具有高纵横比的图案，也可以抑制图案的塌陷或剥离; 包括图案形成方法的电子装置的制造方法; 以及通过该制造方法制造的电子装置。 本发明的图案形成方法包括粘附辅助层形成工序，在基板上形成含有可聚合基团并且在193nm波长下的透光率为80％以上的粘附助剂层; 抗敏剂膜形成步骤，将辐射敏感性树脂组合物施加到粘附辅助层上以形成抗蚀剂膜; 暴露所述抗蚀剂膜的曝光步骤; 以及显影步骤，使曝光的抗蚀剂膜显影以形成图案。

公开(公告)号：US20240280362A1

公开(公告)日：2024-08-22

申请号：US18610609

申请日：2024-03-20

Applicant: FUJIFILM Corporation

Inventor： Naohiro TANGO ,  Michihiro SHIRAKAWA ,  Kei YAMAMOTO ,  Satomi TAKAHASHI

IPC: G01B21/10 ,  G03F7/004 ,  G03F7/32

CPC classification number: G01B21/10 ,  G03F7/0045 ,  G03F7/325

Abstract: The present invention provides a method for testing a photosensitive composition and a method for producing a photosensitive composition that can easily test whether or not the photosensitive composition exhibits a predetermined LWR. The method for testing a photosensitive composition has a step 1 of using a reference photosensitive composition including an acid decomposable resin having a group that is decomposed by an action of an acid to generate a polar group and a photoacid generator, to form a resist film on a substrate, exposing the resist film, using a developer to perform a development treatment to form a resist pattern, and obtaining any one reference data selected from the group consisting of a line width or a space width of a line-shaped resist pattern, an opening diameter of an opening portion in the resist pattern, and a dot diameter of a dot-like resist pattern; a step 2 of using a photosensitive composition for measurement including components of the same types as types of components included in the reference photosensitive composition, to form a resist film on a substrate, exposing the resist film, using a developer to perform a development treatment to form a resist pattern, and obtaining measurement data of the resist pattern; and a step 3 of performing comparison between the reference data and the measurement data to determine whether or not an allowable range is satisfied, wherein the developer is an organic solvent-based developer including an aliphatic hydrocarbon solvent, an aromatic hydrocarbon, and at least one metal atom selected from the group consisting of Al, Fe, and Ni, and a mass ratio of a content of the aromatic hydrocarbon to a content of the metal atom in the developer is 5.0×104 to 2.0×1010.

公开(公告)号：US20230221644A1

公开(公告)日：2023-07-13

申请号：US18176150

申请日：2023-02-28

Applicant: FUJIFILM Corporation

Inventor： Naohiro TANGO ,  Kei YAMAMOTO

IPC: G03F7/11 ,  C08F220/28 ,  C08F220/38 ,  C08F220/24

CPC classification number: G03F7/11 ,  C08F220/24 ,  C08F220/281 ,  C08F220/282 ,  C08F220/387

Abstract: A method for producing a composition for forming a non-photosensitive upper layer film that is disposed on a workpiece and a photosensitive resist film, the production method includes cleaning a production device for a composition XA for forming a non-photosensitive upper layer film with a cleaning liquid to clean the production device until a concentration of a resin included in the cleaning liquid reaches 10 ppm by mass or less, discharging the cleaning liquid from the production device, and producing the composition XA for forming a non-photosensitive upper layer film using the production device. The cleaning, the discharging, and the producing are performed in this order.

公开(公告)号：US20210286263A1

公开(公告)日：2021-09-16

申请号：US17320364

申请日：2021-05-14

Applicant: FUJIFILM Corporation

Inventor： Naohiro TANGO ,  Masafumi KOJIMA ,  Minoru UEMURA ,  Akiyoshi GOTO ,  Michihiro SHIRAKAWA ,  Kei YAMAMOTO

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/039 ,  G03F7/20

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin A having polarity that increases by an action of an acid; one or more resins B selected from the group consisting of a resin B1 including a fluorine atom and having polarity that increases by the action of an acid, a resin B2 including a fluorine atom and having polarity that increases by the action of an alkali, and a resin B3 including a fluorine atom and having polarity that increases by any of an action of an acid and an action of an alkali; and a compound that generates an acid upon irradiation with actinic rays or radiation, in which the compound that generates an acid upon irradiation with actinic rays or radiation includes one or more selected from the group consisting of a compound (I) to a compound (III), provided that the resin B1 to the resin B3 include no repeating unit including an ion-bonding group.

公开(公告)号：US20190204736A1

公开(公告)日：2019-07-04

申请号：US16298459

申请日：2019-03-11

Applicant: FUJIFILM Corporation

Inventor： Kazuhiro MARUMO ,  Naohiro TANGO

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/20

CPC classification number: G03F7/039 ,  G03F7/004 ,  G03F7/0045 ,  G03F7/20 ,  G03F7/2002 ,  G03F7/2041

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition is an actinic ray-sensitive or radiation-sensitive resin composition including a resin A whose solubility in an alkali developer increases by the action of an acid, a compound B that generates an acid upon irradiation with actinic rays or radiation, a resin C that has a surface energy of more than 25 mJ/m2 and has at least one of a fluorine atom or a silicon atom and a polarity conversion group, and a resin D that has a surface energy of 25 mJ/m2 or less, in which the content of the resin D is 1.1% by mass or more with respect to the total solid content of the actinic ray-sensitive or radiation-sensitive resin composition.

公开(公告)号：US20170351179A1

公开(公告)日：2017-12-07

申请号：US15685630

申请日：2017-08-24

Applicant: FUJIFILM Corporation

Inventor： Akiyoshi GOTO ,  Naoki INOUE ,  Naohiro TANGO ,  Kei YAMAMOTO ,  Michihiro SHIRAKAWA

IPC: G03F7/11 ,  G03F7/16 ,  C09D133/10 ,  C09D133/14 ,  G03F7/32 ,  G03F7/20

Abstract: Provided are a composition for forming an upper layer film for a photoresist, including a polymer having a molecular weight distribution in which a peak area of a high-molecular-weight component having a weight-average molecular weight of 40,000 or more accounts for 0.1% or less with respect to the entire peak area in the molecular weight distribution, measured by the gel permeation chromatography.

公开(公告)号：US20240231235A1

公开(公告)日：2024-07-11

申请号：US18610588

申请日：2024-03-20

Applicant: FUJIFILM Corporation

Inventor： Kei YAMAMOTO ,  Naohiro TANGO ,  Michihiro SHIRAKAWA

IPC: G03F7/30 ,  G03F7/32

CPC classification number: G03F7/3028 ,  G03F7/325

Abstract: Provided are a method for testing a photosensitive composition and a method for producing a photosensitive composition that can easily test whether or not the photosensitive composition exhibits a predetermined LWR. A method for testing a photosensitive composition according to the present invention has a step 1 of using a reference photosensitive composition to form a resist film, bringing the resist film into contact with a treatment liquid, and measuring a dissolution rate of the resist film to obtain reference data; a step 2 of using a photosensitive composition for measurement to form a resist film, bringing the resist film into contact with a treatment liquid, and measuring a dissolution rate of the resist film to obtain measurement data; and a step 3 of performing comparison between the reference data and the measurement data to determine whether or not an allowable range is satisfied, wherein the treatment liquid includes an organic solvent and a metal X, the organic solvent does not include an aromatic hydrocarbon and includes an aliphatic hydrocarbon, and a mass ratio of a content of the aromatic hydrocarbon to a content of the metal X is 5.0×102 to 5.0×1012.