公开(公告)号：US20170192574A1

公开(公告)日：2017-07-06

申请号：US15455542

申请日：2017-03-10

Applicant: FUJIFILM Corporation

Inventor： Takashi KOIKE ,  Hiroyuki KOBAYASHI

IPC: G06F3/041 ,  G06F3/047 ,  G06F3/044

CPC classification number: G06F3/0412 ,  G06F3/0416 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04112

Abstract: A laminate structure has a three-dimensional shape and is provided with an optically transparent region. The laminate structure has a transparent conductive member provided with at least one conductive layer constituted of fine metal wires on a flexible transparent substrate, a wiring formed on the transparent substrate and electrically connected to the conductive layer, and a cover member protecting the transparent conductive member. The three-dimensional shape is constituted of at least a planar portion, a side portion bent continuously to the planar portion, and a side portion continued to the protrusion portion and bent with respect to the side portion, out of the planar portion, the side portion, and the protrusion portion, the planar portion and the side portion are constituted of the cover member and the transparent conductive member, and the protrusion portion is constituted of at least the transparent conductive member, and the wiring is routed to at least the protrusion portion and is connected to a flexible wiring member at the tip of the protrusion portion of the transparent conductive member.

公开(公告)号：US20170139516A1

公开(公告)日：2017-05-18

申请号：US15417394

申请日：2017-01-27

Applicant: FUJIFILM Corporation

Inventor： Takashi KOIKE ,  Hisashi TSUBATA ,  Takayoshi KUWABARA ,  Minoru ARAKI

IPC: G06F3/041 ,  B32B7/12 ,  B32B5/02 ,  G06F3/044

CPC classification number: G06F3/0412 ,  B32B1/00 ,  B32B5/028 ,  B32B7/12 ,  B32B23/08 ,  B32B23/20 ,  B32B27/08 ,  B32B27/281 ,  B32B27/30 ,  B32B27/302 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2250/244 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2457/208 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04112

Abstract: A laminate structure includes a laminate which has a three-dimensional shape and is provided with a transparent conductive member having a plurality of conductive layers constituted of fine metal wires on a flexible transparent substrate, a wiring formed on the transparent substrate and electrically connected to each conductive layer, a protective member having an optically transparent region and protecting the transparent conductive member, and an optically transparent adhesive layer positioned between the transparent conductive member and the protective member. The laminate has at least a planar portion and a bent portion formed continuously to the planar portion. The wiring is routed to the bent portion and is connected to a flexible wiring member at the tip of the bent portion.

公开(公告)号：US20130342924A1

公开(公告)日：2013-12-26

申请号：US14013659

申请日：2013-08-29

Applicant: FUJIFILM CORPORATION

Inventor： Ryo MATSUNO ,  Satoshi YONEYAMA ,  Takashi KOIKE ,  Kazuhide HASEGAWA

IPC: G02B7/02

CPC classification number: G02B7/021 ,  B29D11/00307 ,  G02B3/0062 ,  G02B3/0075 ,  G02B13/0085

Abstract: A lens module capable of preventing a deterioration of optical properties and a method for manufacturing thereof are provided. Optical axes of lens portions of superimposed lens arrays are aligned. Substrate portions of the other lens arrays of the superimposed lens arrays except the lowermost lens array are cut by a first cutting portion. Subsequently, thermosetting resins are supplied from a gap between cut surfaces of the cut substrate portion so as to fill a gap between the substrate portions of the superimposed lens arrays with the thermosetting resins and to cause the thermosetting resins to integrally cover the cut surfaces of the substrate portion and a surface of the substrate portion of the uppermost lens array. Thereafter, the thermosetting resins are cured, and an individual lens module is separated by cutting the substrate portion of the lowermost lens array using a second cutting portion.

Abstract translation: 提供了能够防止光学特性劣化的透镜模块及其制造方法。 重叠透镜阵列的透镜部分的光轴对齐。 除最低透镜阵列之外的重叠透镜阵列的另一透镜阵列的基板部分被第一切割部分切割。 随后，从切割的基板部分的切割表面之间的间隙提供热固性树脂，以便填充叠加的透镜阵列的基板部分与热固性树脂之间的间隙，并使热固性树脂一体地覆盖切割的基板部分的切割表面 衬底部分和最上面的透镜阵列的衬底部分的表面。 此后，热固化树脂固化，并且通过使用第二切割部分切割最下面的透镜阵列的基板部分来分离单独的透镜模块。

公开(公告)号：US20130301140A1

公开(公告)日：2013-11-14

申请号：US13939644

申请日：2013-07-11

Applicant: FUJIFILM Corporation

Inventor： Ryo MATSUNO ,  Satoshi YONEYAMA ,  Takashi KOIKE ,  Kazuhide HASEGAWA

IPC: G02B3/00

CPC classification number: G02B3/0062 ,  B29D11/00278 ,  B29D11/00365 ,  G02B1/11 ,  G02B5/005 ,  G02B7/025 ,  G02B13/001 ,  G02B13/0085

Abstract: Provided is a stack-type lens array capable of preventing a lens from peeling off due to stress during dicing or vibration and impact when used. The stack-type lens array is formed by stacking and bonding two lens sheets in which micro lenses are arranged on a flat portion at predetermined intervals. Antireflection films are vapor-deposited on a convex surface and a concave surface of the lens and a light shielding film is vapor-deposited such that a circular opening is formed at the center of the concave surface. The opening serves as a diaphragm aperture of the lens. An exposed surface in which neither the antireflection film nor the light shielding film is vapor-deposited is provided outside the light shielding film between adjacent lenses. A dicing line is set at the center of the exposed surface. An adhesive layer is formed in a predetermined pattern on the exposed surface.

Abstract translation: 提供一种能够防止透镜在切割时的应力或使用时的振动和冲击时的剥离的叠层型透镜阵列。 叠层型透镜阵列通过以预定间隔堆叠和粘合两个透镜片，其中微透镜布置在平坦部分上。 在透镜的凸面和凹面上蒸镀防反射膜，并且在凹面的中心形成有圆形的开口部，并且蒸镀遮光膜。 该开口用作透镜的光阑孔。 在相邻透镜之间的遮光膜的外侧，设置有既不将抗反射膜和遮光膜气相沉积的曝光表面。 切割线设在暴露表面的中心。 在暴露的表面上以预定图案形成粘合剂层。

公开(公告)号：US20160334896A1

公开(公告)日：2016-11-17

申请号：US15218518

申请日：2016-07-25

Applicant: FUJIFILM Corporation

Inventor： Takashi KOIKE ,  Hiroyuki KOBAYASHI ,  Tetsuji NISHIDA ,  Hisashi TSUBATA

IPC: G06F3/041 ,  B32B27/36 ,  B32B7/02 ,  B32B7/12 ,  B32B27/08

CPC classification number: G06F3/041 ,  B32B7/02 ,  B32B7/12 ,  B32B15/02 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B21/00 ,  B32B27/08 ,  B32B27/306 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2307/412 ,  B32B2457/208 ,  B32B2571/00 ,  B32B2603/00 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04112

Abstract: A multilayer structure has a laminate including a transparent conductive member having a conductive pattern having a mesh structure composed of thin metal wires on a transparent substrate having flexibility, a protective member for protecting the transparent conductive member, and an optically transparent adhesive layer disposed between the transparent conductive member and the protective member. The thickness of the laminate is 100 μm or more and 600 μm or less. The thickness of the adhesive layer is 20% or more of the thickness of the laminate. The thermal shrinkage of the transparent conductive member at 150° C. is 0.5% or less, and a difference between the thermal shrinkage of the transparent conductive member and the thermal shrinkage of the protective member at 150° C. is within 60% of the thermal shrinkage of the transparent conductive member at 150° C. The multilayer structure is used for a touch panel module having a three-dimensional shape.

Abstract translation: 多层结构具有层压体，其具有透明导电部件，该透明导电部件具有导电图案，该导电图案具有由具有挠性的透明基板上的细金属线构成的网状结构，保护透明导电部件的保护部件， 透明导电部件和保护部件。 层压体的厚度为100μm以上且600μm以下。 粘合剂层的厚度为层压体厚度的20％以上。 透明导电部件在150℃下的热收缩率为0.5％以下，透明导电部件的热收缩率与保护部件在150℃下的热收缩率之差在60℃以下 透明导电部件在150℃下的热收缩率。多层结构用于具有三维形状的触摸面板模块。