公开(公告)号：US20230038825A1

公开(公告)日：2023-02-09

申请号：US17939660

申请日：2022-09-07

Applicant: FUJIFILM Corporation

Inventor： Hideyuki ISHIHARA ,  Toshiya TAKAHASHI ,  Taro MIYOSHI ,  Eiji FUKUZAKI

IPC: G03F7/029

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition containing: a resin (P) of which a solubility in a developer changes by an action of an acid; a compound (A) that has a group (a) having a polarity which changes through decomposition by an action of an acid, and generates an acid (ac1) upon irradiation with actinic rays or radiation; a compound (B) that generates an acid (ac2) having a higher pKa than the acid (ac1) generated from the compound (A), upon irradiation with actinic rays or radiation; and a basic compound (C).

公开(公告)号：US20240004293A1

公开(公告)日：2024-01-04

申请号：US18468245

申请日：2023-09-15

Applicant: FUJIFILM Corporation

Inventor： Naoya HATAKEYAMA ,  Akiyoshi GOTO ,  Hideyuki ISHIHARA ,  Michihiro SHIRAKAWA ,  Yosuke BEKKI

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/038 ,  C08F220/18 ,  C08F220/38 ,  C08F220/28 ,  C08F220/36 ,  C08F212/14

CPC classification number: G03F7/039 ,  C08F220/282 ,  G03F7/038 ,  C08F220/1809 ,  C08F220/382 ,  C08F220/281 ,  C08F220/1808 ,  C08F220/283 ,  C08F220/365 ,  C08F220/1807 ,  C08F220/1806 ,  C08F220/1811 ,  C08F212/22 ,  C08F220/1818 ,  G03F7/0045

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin which is decomposed by action of acid to increase polarity; and (B) a compound which generates an acid by irradiation with an actinic ray or a radiation, in which the resin (A) and the acid generated from the compound (B) form a bond by the actinic ray or the radiation or by the action of acid.

公开(公告)号：US20230400769A1

公开(公告)日：2023-12-14

申请号：US18457908

申请日：2023-08-29

Applicant: FUJIFILM Corporation

Inventor： Naoya HATAKEYAMA ,  Hideyuki ISHIHARA ,  Akiyoshi GOTO ,  Michihiro SHIRAKAWA

IPC: G03F7/039

CPC classification number: G03F7/039

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition containing, (A) a resin which is decomposed by action of acid to increase polarity; and an ionic compound, in which the ionic compound contains (B) an ionic compound which generates an acid by irradiation with an actinic ray or a radiation and (C) an ionic compound which is decomposed by irradiation with an actinic ray or a radiation to reduce acid-trapping property, or contains (D) an ionic compound which generates an acid by irradiation with an actinic ray or a radiation and is decomposed by irradiation with an actinic ray or a radiation to reduce acid-trapping property, and the resin (A) has a repeating unit represented by the Formula (1).