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1.发明授权公开(公告)号：US11029449B2
公开(公告)日：2021-06-08
申请号：US16269271
申请日：2019-02-06
Applicant: FUJIFILM Corporation
Inventor： Kenichi Umeda , Seigo Nakamura , Yuichiro Itai , Hideki Yasuda
Abstract: An antireflection film is formed by laminating an interlayer, a silver-containing metal layer containing silver, and a dielectric layer in this order from the substrate, an anchor region including an oxide of an anchor metal is provided between the silver-containing metal layer and the interlayer, a cap region including an oxide of the anchor metal included in the anchor region is provided between the silver-containing metal layer and the dielectric layer, a crystal grain size obtained by X-ray diffraction measurement in the silver-containing metal layer is less than 6.8 nm, and the anchor metal has a surface energy less than a surface energy of silver and greater than a surface energy of a layer of the interlayer closest to the silver-containing metal layer.
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公开(公告)号：US10549311B2
公开(公告)日：2020-02-04
申请号：US16041769
申请日：2018-07-21
Applicant: FUJIFILM Corporation , THE UNIVERSITY OF TOKYO
Inventor： Seigo Nakamura , Yoshiki Maehara , Yuichiro Itai , Yoshihisa Usami , Junichi Takeya
IPC: B05C11/04 , H01L51/00 , H01L51/05 , H01L51/10 , H01L51/56 , H01L27/12 , B05C5/02 , H01L29/786 , B05C5/00
Abstract: A device for manufacturing an organic semiconductor film, including a coating member disposed to face a substrate surface while spaced therefrom for forming the film, and forming a liquid reservoir of an organic semiconductor solution between the coating member and the substrate; a supply portion that supplies the solution; and a cover portion that covers at least a crystal growth portion of the solution. The cover portion includes a guide that guides a deposit formed of an evaporated solvent of the solution to a film-unformed region of the organic semiconductor film. While the solution is supplied between the coating member and the substrate surface by the supply portion, the coating member is moved in a first direction parallel to the substrate surface in a state of being in contact with the solution, to form the film with the crystal growth portion as a starting point.
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公开(公告)号：US11422290B2
公开(公告)日：2022-08-23
申请号：US16813703
申请日：2020-03-09
Applicant: FUJIFILM Corporation
Inventor： Seigo Nakamura , Tatsuya Yoshihiro , Kenichi Umeda , Yuichiro Itai
Abstract: An antireflection film is provided on a substrate and includes an interlayer, a silver-containing metal layer containing silver, and a dielectric layer, which are laminated in this order on a side of a substrate, in which the interlayer is a multilayer film having at least two layers in which a layer of high refractive index having a relatively high refractive index and a layer of lower refractive index having a relatively low refractive index are alternately laminated, the dielectric layer has a surface exposed to air, and the dielectric layer is a multilayer film including a silicon-containing oxide layer, a magnesium fluoride layer, and an adhesion layer provided between the silicon-containing oxide layer and the magnesium fluoride layer and configured to increase adhesiveness between the silicon-containing oxide layer and the magnesium fluoride layer.
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公开(公告)号：US11422288B2
公开(公告)日：2022-08-23
申请号：US16799782
申请日：2020-02-24
Applicant: FUJIFILM Corporation
Inventor： Kenichi Umeda , Yuichiro Itai , Seigo Nakamura
IPC: G02B1/10 , C23C14/20 , C23C14/34 , C23C16/34 , G02B1/111 , C23C14/02 , B32B7/04 , B32B9/00 , B32B15/04 , C23C14/08
Abstract: In a laminated film, a resin substrate, an organic/inorganic multilayer, and a silver-containing metal layer having a thickness of 20 nm or less are laminated in this order, an anchor metal diffusion control layer having a Hamaker constant of 7.3×10−20 J or more is provided on the surface of the inorganic layer, an anchor region containing an oxide of an anchor metal having a surface energy which has a smaller difference with a surface energy of the silver-containing metal layer than a surface energy of the anchor metal diffusion control layer is provided between the anchor metal diffusion control layer and the silver-containing metal layer, and a cap region containing an oxide of the anchor metal is provided on a surface of the silver-containing metal layer that is opposite from a surface on a side closer to the anchor metal diffusion control layer.
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5.发明授权公开(公告)号：US10927446B2
公开(公告)日：2021-02-23
申请号：US16568905
申请日：2019-09-12
Applicant: FUJIFILM Corporation
Inventor： Seigo Nakamura , Kenichi Umeda , Yuichiro Itai , Shinichiro Sonoda
Abstract: This method for producing a transparent optical film includes a film formation step of forming a silver layer and a high standard electrode potential metal layer so as to be laminated on a substrate, the film formation step including a silver deposition step of forming the silver layer, at a thickness of 6 nm or less by vacuum deposition, and a high standard electrode potential metal deposition step of forming the high standard electrode potential metal layer formed of a high standard electrode potential metal having a higher standard electrode potential than that of silver by vacuum deposition, and an alloying step of forming a silver alloy layer by diffusing the high standard electrode potential metal within the silver layer by performing a heating treatment at a temperature of 50° C. or higher and 400° C. or lower.
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Patent Agency Ranking
公开(公告)号：US10468597B2
公开(公告)日：2019-11-05
申请号：US16041766
申请日：2018-07-21
Applicant: FUJIFILM Corporation , THE UNIVERSITY OF TOKYO
Inventor： Seigo Nakamura , Yoshiki Maehara , Yuichiro Itai , Yoshihisa Usami , Junichi Takeya
IPC: H01L51/00 , H01L29/786 , H01L51/05 , H01L51/10 , B05C11/04
Abstract: A method of manufacturing an organic semiconductor film, including a step of moving a coating blade surface positioned to face a substrate surface in a first direction parallel to the substrate surface, while in contact with an organic semiconductor solution supplied to a portion between the blade surface and the substrate surface to form the organic semiconductor film in the first direction. The coating blade is disposed to have first and second gaps having different separation gap sizes with the substrate surface in a region where the blade surface and the organic semiconductor solution are in contact. The first gap is positioned on an upstream side of the first direction and the second gap, which is smaller than the first gap, is provided on a downstream side. A second gap size is a minimum distance between the substrate surface and the blade surface and is 40 μm or less.
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7.发明授权公开(公告)号：US11747520B2
公开(公告)日：2023-09-05
申请号：US16929100
申请日：2020-07-14
Applicant: FUJIFILM CORPORATION
Inventor： Kenichi Umeda , Seigo Nakamura , Tatsuya Yoshihiro , Yuichiro Itai
IPC: G02B1/115 , G02B1/116 , G02B5/28 , G02F1/1335
CPC classification number: G02B1/115 , G02B1/116 , G02B5/285 , G02F1/133502 , G02F2201/38
Abstract: The optical thin film is provided on a substrate and includes, in order, from the substrate side, an interlayer, a silver-containing metal layer, and a dielectric layer, in which an anchor region including an oxide of an anchor metal is provided in an interface region of the silver-containing metal layer on a side close to the interlayer, a cap region including an oxide of the anchor metal is provided in an interface region of the silver-containing metal layer on a side close to the dielectric layer, a film thickness of the silver-containing metal layer is 6 nm or less, the silver-containing metal layer contains a high standard electrode potential metal, and a peak position of a concentration distribution of the high standard electrode potential metal in a film thickness direction of the silver-containing metal layer is positioned closer to the interlayer than a peak position of a silver concentration distribution.
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公开(公告)号：US11194078B2
公开(公告)日：2021-12-07
申请号：US16288768
申请日：2019-02-28
Applicant: FUJIFILM Corporation
Inventor： Seigo Nakamura , Kenichi Umeda , Yuichiro Itai , Shinichiro Sonoda
Abstract: Provided is an antireflection film that is formed by laminating an interlayer, a silver-containing metal layer containing silver, and a dielectric layer, in this order, on a substrate, in which the interlayer is a multilayer film having two or more layers, in which a layer of high refractive index having a relatively high refractive index and a layer of low refractive index having a relatively low refractive index are alternately laminated, and the dielectric layer has a surface to be exposed to air and is a multilayer film having two or more layers including an oxide layer and a fluorocarbon layer which is a self-assembled film that is formed by a silane coupling reaction to the oxide layer in this order.
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公开(公告)号：US20230408143A1
公开(公告)日：2023-12-21
申请号：US18363812
申请日：2023-08-02
Applicant: FUJIFILM Corporation
Inventor： Yoshihiro SUGAWARA , Shogo Yamazoe , Yuichiro Itai
IPC: F24F13/24
CPC classification number: F24F13/24 , F24F2013/242
Abstract: To provide a silencing structure and a silencing system having a high sound absorbance in a low frequency region. A silencing structure that is installed in a tubular member, the silencing structure includes a cavity portion, an opening portion through which the cavity portion communicates with the tubular member, and a closing portion that closes the cavity portion at a position facing the opening portion, in which a cross-sectional area of the cavity portion on a side of the opening portion is larger than a cross-sectional area of the cavity portion on a side of the closing portion.
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公开(公告)号：US10608119B2
公开(公告)日：2020-03-31
申请号：US16114610
申请日：2018-08-28
Applicant: FUJIFILM Corporation
Inventor： Seigo Nakamura , Yoshiki Maehara , Yuichiro Itai , Yoshihisa Usami
IPC: H01L29/08 , H01L29/786 , H01L51/00 , H01L51/05
Abstract: Provided is a method of manufacturing a film, including: a manufacturing step of forming a film by performing movement, in a state in which a blade surface of a coating blade disposed to be spaced so as to face a substrate surface of a substrate is in contact with a solution for forming a film which is provided between the blade surface and the substrate surface, in a first direction in a plane parallel to the substrate surface, in which the solution is stored in a liquid reservoir between the blade surface and the substrate surface, and at least a portion of an outer peripheral end portion of the coating blade which is in contact with the solution is tilted with respect to the first direction in a plane parallel to the substrate surface. Accordingly, a method of manufacturing a film for forming a high quality film with high productivity is provided.
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