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公开(公告)号：US20160203994A1
公开(公告)日：2016-07-14
申请号：US15076869
申请日：2016-03-22
申请人： FUJIMI INCORPORATED
IPC分类号： H01L21/306 , C09G1/04
CPC分类号： C09G1/04 , B24B37/044 , C09G1/02 , H01L21/30612 , H01L21/30625 , H01L29/20
摘要： A polishing composition of the present invention is to be used for polishing an object including a portion containing a group III-V compound material. The polishing composition contains an oxidizing agent and an anticorrosive agent. The anticorrosive agent is preferably a nitrogen-containing organic compound, such as 1H-1,2,4-triazole and benzotriazole, or an organic compound having a carboxyl group, for example, dicarboxylic acid, such as malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, maleic acid, phthalic acid, malic acid, and tartaric acid, or tricarboxylic acid, such as citric acid.
摘要翻译： 本发明的抛光组合物用于抛光包含含III-V族化合物的部分的物体。 抛光组合物含有氧化剂和防腐蚀剂。 防腐剂优选为1H-1,2,4-三唑和苯并三唑等含氮有机化合物或具有羧基的有机化合物，例如二羧酸，如丙二酸，琥珀酸，戊二酸 酸，己二酸，庚二酸，马来酸，邻苯二甲酸，苹果酸和酒石酸，或三羧酸如柠檬酸。
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公开(公告)号：US20210130751A1
公开(公告)日：2021-05-06
申请号：US16492338
申请日：2018-01-23
申请人： FUJIMI INCORPORATED
摘要： The present invention provides a means by which it is possible to sufficiently suppress an organic residue while favorably decreasing a ceria residue on a polished object to be polished obtained after being polished using a polishing composition containing ceria.
The present invention relates to a composition for surface treatment, which is for a surface treatment of a polished object to be polished obtained after being polished using a polishing composition containing ceria, contains a carboxy group-containing (co)polymer having a structural unit derived from a monomer having a carboxy group or a salt group of the carboxy group, a SOx or NOy partial structure-containing compound having a partial structure represented by SOx or NOy (where x and y each independently denote a real number 1 to 5), and a dispersing medium, and has a pH of 1 or more and 8 or less.-
公开(公告)号：US20220010207A1
公开(公告)日：2022-01-13
申请号：US17486008
申请日：2021-09-27
申请人： FUJIMI INCORPORATED
发明人： Tsutomu YOSHINO , Ayano YAMAZAKI , Satoru YARITA , Shogo ONISHI , Yasuto ISHIDA
IPC分类号： C09K13/06 , H01L21/321 , C09G1/02 , C09G1/04 , H01L21/02 , H01L21/306 , C09K13/00
摘要： An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.
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公开(公告)号：US20210139739A1
公开(公告)日：2021-05-13
申请号：US16492835
申请日：2018-01-23
申请人： FUJIMI INCORPORATED
IPC分类号： C09G1/02
摘要： The present invention provides a polishing composition with which it is possible to decrease a level difference to be unintentionally generated between dissimilar materials and a level difference to be unintentionally generated between coarse and dense portions of a pattern. The present invention relates to a polishing composition which contains abrasive grains having an average primary particle size of 5 to 50 nm, a level difference modifier containing a compound with a specific structure, having an aromatic ring and a sulfo group or a salt group thereof which is directly bonded to this aromatic ring, and a dispersing medium and of which the pH is less than 7.
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5.发明申请公开(公告)号：US20190093051A1
公开(公告)日：2019-03-28
申请号：US16132863
申请日：2018-09-17
申请人： FUJIMI INCORPORATED
摘要： A surface treatment composition according to the present invention is used for treating a surface of a polished object to be polished which is obtained after polishing with a polishing composition including ceria, using the surface treatment composition including a (co)polymer having a monomer-derived structural unit having a carboxyl group or a salt group thereof, a residue removing accelerator composed of a specific compound having a hydroxyl group, and a dispersing medium, wherein pH is less than 7.
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6.发明申请公开(公告)号：US20200095467A1
公开(公告)日：2020-03-26
申请号：US16579323
申请日：2019-09-23
申请人： FUJIMI INCORPORATED
发明人： Tsutomu YOSHINO , Ayano YAMAZAKI , Satoru YARITA , Shogo ONISHI , Yasuto ISHIDA
IPC分类号： C09G1/02 , H01L21/321
摘要： An intermediate raw material according to the present invention includes a charge control agent having a critical packing parameter of 0.6 or more and a dispersing medium and a pH of the intermediate raw material is less than 7.
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公开(公告)号：US20190300821A1
公开(公告)日：2019-10-03
申请号：US16337241
申请日：2017-06-29
申请人： FUJIMI INCORPORATED
摘要： The present invention relates to a surface treatment composition including: at least one water-soluble polymer selected from the following Group A; at least one anionic surfactant selected from the following Group B; and water. Group A: water-soluble polysaccharides, polyvinyl alcohols and derivatives thereof, and polyvinylpyrrolidones and derivatives thereof (with the proviso that compounds included in the following Group B are excluded)Group B: compounds having a sulfonic acid (salt) group, compounds having a sulfuric acid ester (salt) group, compounds having a phosphonic acid (salt) group, compounds having a phosphoric acid (salt) group, and compounds having a phosphinic acid (salt) group. According to the present invention, a surface treatment composition capable of efficiently removing foreign bodies, such as particles and organic residues, remaining on the surface of an object to be polished after polishing is provided.
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公开(公告)号：US20150287609A1
公开(公告)日：2015-10-08
申请号：US14736711
申请日：2015-06-11
申请人： FUJIMI INCORPORATED
IPC分类号： H01L21/306
CPC分类号： C09G1/02 , B24B1/00 , B24B37/044 , C09K3/1409 , C09K3/1463 , H01L21/30625 , H01L29/16 , H01L29/20
摘要： A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises an oxidizing agent and abrasive grains having an average primary particle diameter of 40 nm or less. The polishing composition preferably further contains a hydrolysis-suppressing compound that bonds to a surface OH group of the portion containing a silicon material of the object to function to suppress hydrolysis of the portion containing a silicon material. Alternatively, a polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis-suppressing compound. The polishing composition preferably has a neutral pH.
摘要翻译： 本发明的抛光组合物用于抛光包含含有高迁移率材料的部分和含有硅材料的部分的物体。 抛光组合物包含平均一次粒径为40nm以下的氧化剂和磨粒。 抛光组合物优选还含有水解抑制化合物，其结合到含有该物质的硅材料的部分的表面OH基上，以抑制含硅材料部分的水解。 或者，本发明的研磨用组合物含有磨粒，氧化剂和水解抑制性化合物。 抛光组合物优选具有中性pH。
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