Fabricating Bipolar Junction Select Transistors for Semiconductor Memories
    4.
    发明申请
    Fabricating Bipolar Junction Select Transistors for Semiconductor Memories 有权
    制造半导体存储器的双极结选择晶体管

    公开(公告)号:US20110039391A1

    公开(公告)日:2011-02-17

    申请号:US12912829

    申请日:2010-10-27

    IPC分类号: H01L21/331

    CPC分类号: H01L29/73 H01L27/24

    摘要: A bipolar junction transistor may act as a select device for a semiconductor memory. The bipolar junction transistor may be formed of a stack of base and collector layers. Sets of parallel trenches are formed in a first direction down to the base and in a second direction down to the collector. The trenches may be used to form local enhancement implants into the exposed portion of the base and collector in each trench. As a result of the local enhancement implants, in some embodiments, leakage current may be reduced, active current capability may be higher, gain may be higher, base resistance may be reduced, breakdown voltage may be increased, and parasitic effects with adjacent junctions may be reduced.

    摘要翻译: 双极结型晶体管可以用作半导体存储器的选择器件。 双极结晶体管可以由基极和集电极层的堆叠形成。 一组平行的沟槽沿着第一方向下降到底部并且沿着第二方向形成在收集器的下方。 沟槽可以用于在每个沟槽中的基底和收集器的暴露部分中形成局部增强植入物。 作为局部增强植入物的结果,在一些实施例中,泄漏电流可能降低,有效电流能力可能更高,增益可能更高,基极电阻可能降低,击穿电压可能增加,并且具有相邻接点的寄生效应 减少

    Fabricating bipolar junction select transistors for semiconductor memories
    5.
    发明授权
    Fabricating bipolar junction select transistors for semiconductor memories 有权
    制造用于半导体存储器的双极结选择晶体管

    公开(公告)号:US08076211B2

    公开(公告)日:2011-12-13

    申请号:US12912829

    申请日:2010-10-27

    IPC分类号: H01L21/8222 H01L21/331

    CPC分类号: H01L29/73 H01L27/24

    摘要: A bipolar junction transistor may act as a select device for a semiconductor memory. The bipolar junction transistor may be formed of a stack of base and collector layers. Sets of parallel trenches are formed in a first direction down to the base and in a second direction down to the collector. The trenches may be used to form local enhancement implants into the exposed portion of the base and collector in each trench. As a result of the local enhancement implants, in some embodiments, leakage current may be reduced, active current capability may be higher, gain may be higher, base resistance may be reduced, breakdown voltage may be increased, and parasitic effects with adjacent junctions may be reduced.

    摘要翻译: 双极结型晶体管可以用作半导体存储器的选择器件。 双极结晶体管可以由基极和集电极层的堆叠形成。 一组平行的沟槽沿着第一方向下降到底部并且沿着第二方向形成在收集器的下方。 沟槽可以用于在每个沟槽中的基底和收集器的暴露部分中形成局部增强植入物。 作为局部增强植入物的结果,在一些实施例中,泄漏电流可能降低,有效电流能力可能更高,增益可能更高,基极电阻可能降低,击穿电压可能增加,并且具有相邻接点的寄生效应 减少

    Fabricating bipolar junction select transistors for semiconductor memories
    6.
    发明授权
    Fabricating bipolar junction select transistors for semiconductor memories 有权
    制造用于半导体存储器的双极结选择晶体管

    公开(公告)号:US07847373B2

    公开(公告)日:2010-12-07

    申请号:US12341027

    申请日:2008-12-22

    CPC分类号: H01L29/73 H01L27/24

    摘要: A bipolar junction transistor may act as a select device for a semiconductor memory. The bipolar junction transistor may be formed of a stack of base and collector layers. Sets of parallel trenches are formed in a first direction down to the base and in a second direction down to the collector. The trenches may be used to form local enhancement implants into the exposed portion of the base and collector in each trench. As a result of the local enhancement implants, in some embodiments, leakage current may be reduced, active current capability may be higher, gain may be higher, base resistance may be reduced, breakdown voltage may be increased, and parasitic effects with adjacent junctions may be reduced.

    摘要翻译: 双极结型晶体管可以用作半导体存储器的选择器件。 双极结晶体管可以由基极和集电极层的堆叠形成。 一组平行的沟槽沿着第一方向下降到底部并且沿着第二方向形成在收集器的下方。 沟槽可以用于在每个沟槽中的基底和收集器的暴露部分中形成局部增强植入物。 作为局部增强植入物的结果,在一些实施例中,泄漏电流可能降低,有效电流能力可能更高,增益可能更高,基极电阻可能降低,击穿电压可能增加,并且具有相邻接点的寄生效应 减少

    Forming Resistive Random Access Memories Together With Fuse Arrays
    7.
    发明申请
    Forming Resistive Random Access Memories Together With Fuse Arrays 有权
    与保险丝阵列一起形成电阻随机存取存储器

    公开(公告)号:US20120032136A1

    公开(公告)日:2012-02-09

    申请号:US12849864

    申请日:2010-08-04

    IPC分类号: H01L45/00 H01L21/82

    摘要: A resistive random access memory array may be formed on the same substrate with a fuse array. The random access memory and the fuse array may use the same active material. For example, both the fuse array and the memory array may use a chalcogenide material as the active switching material. The main array may use a pattern of perpendicular sets of trench isolations and the fuse array may only use one set of parallel trench isolations. As a result, the fuse array may have a conductive line extending continuously between adjacent trench isolations. In some embodiments, this continuous line may reduce the resistance of the conductive path through the fuses.

    摘要翻译: 可以在具有熔丝阵列的同一基板上形成电阻随机存取存储器阵列。 随机存取存储器和熔丝阵列可以使用相同的活性材料。 例如,熔丝阵列和存储器阵列都可以使用硫族化物材料作为有源开关材料。 主阵列可以使用垂直组沟槽隔离的图案,并且熔丝阵列可以仅使用一组平行沟槽隔离。 结果,熔丝阵列可以具有在相邻沟槽隔离之间连续延伸的导电线。 在一些实施例中,该连续线可以减小通过保险丝的导电路径的电阻。

    PROCESS FOR FORMING DIFFERENTIAL SPACES IN ELECTRONICS DEVICE INTEGRATED ON A SEMICONDUCTOR SUBSTRATE
    8.
    发明申请
    PROCESS FOR FORMING DIFFERENTIAL SPACES IN ELECTRONICS DEVICE INTEGRATED ON A SEMICONDUCTOR SUBSTRATE 有权
    在半导体基板上集成的电子器件中形成差分空间的方法

    公开(公告)号:US20100047980A1

    公开(公告)日:2010-02-25

    申请号:US12606997

    申请日:2009-10-27

    IPC分类号: H01L21/336

    摘要: A forms spacers in a electronic device integrated on a semiconductor substrate that includes: first and second transistors each comprising a gate electrode projecting from the substrate and respective source/drain regions. The process comprises: forming in cascade a first protective layer and a first conformal insulating layer of a first thickness on the whole electronic device; forming a first mask to cover the first transistor; removing the first conformal insulating layer not covered by the first mask; removing the first mask; forming a second conformal insulating layer of a second thickness on the whole device; and removing the insulating layers until the protective layer is exposed to form first spacers of a first width on the side walls of the gate electrodes of the first transistor and second spacers of a second width on the side walls of the gate electrodes of the second transistor.

    摘要翻译: A在集成在半导体衬底上的电子器件中形成间隔物,其包括:第一和第二晶体管,每个包括从衬底突出的栅电极和相应的源极/漏极区。 该方法包括:在整个电子设备上级联形成第一厚度的第一保护层和第一共形绝缘层; 形成第一掩模以覆盖所述第一晶体管; 去除未被第一掩模覆盖的第一保形绝缘层; 去除第一个面罩; 在整个装置上形成第二厚度的第二共形绝缘层; 并且去除所述绝缘层直到所述保护层暴露以在所述第一晶体管的栅电极的侧壁上形成第一宽度的第一间隔物,并且在所述第二晶体管的栅电极的侧壁上形成第二宽度的第二间隔物 。

    PROCESS FOR FORMING DIFFERENTIAL SPACES IN ELECTRONICS DEVICE INTEGRATED ON A SEMICONDUCTOR SUBSTRATE
    9.
    发明申请
    PROCESS FOR FORMING DIFFERENTIAL SPACES IN ELECTRONICS DEVICE INTEGRATED ON A SEMICONDUCTOR SUBSTRATE 审中-公开
    在半导体基板上集成的电子器件中形成差分空间的方法

    公开(公告)号:US20080206945A1

    公开(公告)日:2008-08-28

    申请号:US11680507

    申请日:2007-02-28

    IPC分类号: H01L21/336

    摘要: A forms spacers in a electronic device integrated on a semiconductor substrate that includes: first and second transistors each comprising a gate electrode projecting from the substrate and respective source/drain regions. The process comprises: forming in cascade a first protective layer and a first conformal insulating layer of a first thickness on the whole electronic device; forming a first mask to cover the first transistor; removing the first conformal insulating layer not covered by the first mask; removing the first mask; forming a second conformal insulating layer of a second thickness on the whole device; and removing the insulating layers until the protective layer is exposed to form first spacers of a first width on the side walls of the gate electrodes of the first transistor and second spacers of a second width on the side walls of the gate electrodes of the second transistor.

    摘要翻译: A在集成在半导体衬底上的电子器件中形成间隔物,其包括:第一和第二晶体管,每个包括从衬底突出的栅电极和相应的源极/漏极区。 该方法包括:在整个电子设备上级联形成第一厚度的第一保护层和第一共形绝缘层; 形成第一掩模以覆盖所述第一晶体管; 去除未被第一掩模覆盖的第一保形绝缘层; 去除第一个面罩; 在整个装置上形成第二厚度的第二共形绝缘层; 并且去除所述绝缘层直到所述保护层暴露以在所述第一晶体管的栅电极的侧壁上形成第一宽度的第一间隔物,并且在所述第二晶体管的栅电极的侧壁上形成第二宽度的第二间隔物 。

    NON-VOLATILE MEMORY ELECTRONIC DEVICE
    10.
    发明申请
    NON-VOLATILE MEMORY ELECTRONIC DEVICE 审中-公开
    非易失性存储器电子设备

    公开(公告)号:US20070181933A1

    公开(公告)日:2007-08-09

    申请号:US11617472

    申请日:2006-12-28

    IPC分类号: H01L29/76

    摘要: A non-volatile memory device integrated on semiconductor substrate and having a matrix of non-volatile memory cells organized in rows, called word lines, and columns, called bit lines, the device including a plurality of active areas formed on the semiconductor substrate equidistant from each other, and having at least a first and a second group of active areas; the non-volatile memory cells integrated in the first group of active areas, each non-volatile memory cell having a source region, a drain region, and a floating gate electrode coupled to a control gate electrode, at least one group of the memory cells sharing a common source region integrated on the semiconductor substrate; and a contact region integrated in the second group of active areas and provided with at least one common source contact of the common source region.

    摘要翻译: 一种非易失性存储器件,集成在半导体衬底上并且具有被称为位线的被称为字线的行(称为字线)和列的非易失性存储器单元矩阵,该器件包括形成在半导体衬底上等距离的多个有源区 并且具有至少第一组和第二组活动区域; 集成在第一组有源区域中的非易失性存储单元,每个非易失性存储单元具有耦合到控制栅电极的源极区,漏极区和浮栅,至少一组存储单元 共享在半导体衬底上集成的公共源极区域; 以及集成在所述第二组有源区域中并且设置有所述公共源极区域的至少一个公共源极触点的接触区域。