摘要:
A method is disclosed for forming vertical bipolar junction transistors including a regular array of base contact pillars and emitter contact pillars with a width below the minimum lithographical resolution F of the lithographic technique employed. In an embodiment, the pillar array features have a dimension of approximately F/2, though this dimension could be reduced down to other values compatible with embodiments of the invention. A storage element, such as a phase change storage element, can be formed above the regular array of base contact pillars and emitter contact pillars.
摘要:
A method is disclosed for forming vertical bipolar junction transistors including a regular array of base contact pillars and emitter contact pillars with a width below the minimum lithographical resolution F of the lithographic technique employed. In an embodiment, the pillar array features have a dimension of approximately F/2, though this dimension could be reduced down to other values compatible with embodiments of the invention. A storage element, such as a phase change storage element, can be formed above the regular array of base contact pillars and emitter contact pillars.
摘要:
A self-aligned vertical heater element is deposited directly on the silicide of a selection device, and a phase change chalcogenide material is deposited directly on the vertical heater element. The fabrication process allows for self-alignment between the chalcogenide line and vertical heater element. In an embodiment, the vertical heater element is L-shaped, having a vertical wall along the wordline direction and a horizontal base. The vertical wall and the horizontal base may have the same thickness.
摘要:
A bipolar junction transistor may act as a select device for a semiconductor memory. The bipolar junction transistor may be formed of a stack of base and collector layers. Sets of parallel trenches are formed in a first direction down to the base and in a second direction down to the collector. The trenches may be used to form local enhancement implants into the exposed portion of the base and collector in each trench. As a result of the local enhancement implants, in some embodiments, leakage current may be reduced, active current capability may be higher, gain may be higher, base resistance may be reduced, breakdown voltage may be increased, and parasitic effects with adjacent junctions may be reduced.
摘要:
A bipolar junction transistor may act as a select device for a semiconductor memory. The bipolar junction transistor may be formed of a stack of base and collector layers. Sets of parallel trenches are formed in a first direction down to the base and in a second direction down to the collector. The trenches may be used to form local enhancement implants into the exposed portion of the base and collector in each trench. As a result of the local enhancement implants, in some embodiments, leakage current may be reduced, active current capability may be higher, gain may be higher, base resistance may be reduced, breakdown voltage may be increased, and parasitic effects with adjacent junctions may be reduced.
摘要:
A bipolar junction transistor may act as a select device for a semiconductor memory. The bipolar junction transistor may be formed of a stack of base and collector layers. Sets of parallel trenches are formed in a first direction down to the base and in a second direction down to the collector. The trenches may be used to form local enhancement implants into the exposed portion of the base and collector in each trench. As a result of the local enhancement implants, in some embodiments, leakage current may be reduced, active current capability may be higher, gain may be higher, base resistance may be reduced, breakdown voltage may be increased, and parasitic effects with adjacent junctions may be reduced.
摘要:
A resistive random access memory array may be formed on the same substrate with a fuse array. The random access memory and the fuse array may use the same active material. For example, both the fuse array and the memory array may use a chalcogenide material as the active switching material. The main array may use a pattern of perpendicular sets of trench isolations and the fuse array may only use one set of parallel trench isolations. As a result, the fuse array may have a conductive line extending continuously between adjacent trench isolations. In some embodiments, this continuous line may reduce the resistance of the conductive path through the fuses.
摘要:
A forms spacers in a electronic device integrated on a semiconductor substrate that includes: first and second transistors each comprising a gate electrode projecting from the substrate and respective source/drain regions. The process comprises: forming in cascade a first protective layer and a first conformal insulating layer of a first thickness on the whole electronic device; forming a first mask to cover the first transistor; removing the first conformal insulating layer not covered by the first mask; removing the first mask; forming a second conformal insulating layer of a second thickness on the whole device; and removing the insulating layers until the protective layer is exposed to form first spacers of a first width on the side walls of the gate electrodes of the first transistor and second spacers of a second width on the side walls of the gate electrodes of the second transistor.
摘要:
A forms spacers in a electronic device integrated on a semiconductor substrate that includes: first and second transistors each comprising a gate electrode projecting from the substrate and respective source/drain regions. The process comprises: forming in cascade a first protective layer and a first conformal insulating layer of a first thickness on the whole electronic device; forming a first mask to cover the first transistor; removing the first conformal insulating layer not covered by the first mask; removing the first mask; forming a second conformal insulating layer of a second thickness on the whole device; and removing the insulating layers until the protective layer is exposed to form first spacers of a first width on the side walls of the gate electrodes of the first transistor and second spacers of a second width on the side walls of the gate electrodes of the second transistor.
摘要:
A non-volatile memory device integrated on semiconductor substrate and having a matrix of non-volatile memory cells organized in rows, called word lines, and columns, called bit lines, the device including a plurality of active areas formed on the semiconductor substrate equidistant from each other, and having at least a first and a second group of active areas; the non-volatile memory cells integrated in the first group of active areas, each non-volatile memory cell having a source region, a drain region, and a floating gate electrode coupled to a control gate electrode, at least one group of the memory cells sharing a common source region integrated on the semiconductor substrate; and a contact region integrated in the second group of active areas and provided with at least one common source contact of the common source region.