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14 条记录 (耗时 0.024 秒)

    Continuous printed paper stacking device
    1.
    发明授权
    Continuous printed paper stacking device 失效
    连续打印纸堆叠装置

    公开(公告)号：US4460350A

    公开(公告)日：1984-07-17

    申请号：US440196

    申请日：1982-11-08

    申请人： Faquir C. Mittal ,  Joseph M. Curley

    发明人： Faquir C. Mittal ,  Joseph M. Curley

    IPC分类号： B41J11/58 ,  B65H45/101 ,  B65H45/00

    CPC分类号： B65H45/1015 ,  B41J11/58

    摘要： Apparatus is disclosed for positioning a continuous paper form having uniformly positioned seams and emanating from a high speed printing device, such as from a high-speed computer printer, in a bin or stacker. Air jets positioned on the stacker are utilized in a mode whereby air bursts from the jets impinge at discrete locations on a top surface of the form as it emanates from the printer. The air bursts cause the continuous paper form to fold naturally in a stacker bin at the paper seams.

    摘要翻译： 公开了用于定位具有均匀定位的接缝的连续纸张形式的装置，并且从高速打印装置（例如来自高速计算机打印机）在箱或堆垛机中发出。 位于堆垛机上的空气喷射器以这样的模式被利用，其中当喷射器从打印机发出时，从喷嘴喷射的空气喷射在形式的顶表面上的离散位置。 空气爆裂导致连续纸张形式在纸张接缝处的堆垛仓中自然折叠。

    Apparatus for cooling integrated circuit chips
    3.
    发明授权
    Apparatus for cooling integrated circuit chips 失效
    集成电路芯片冷却装置

    公开(公告)号：US4450505A

    公开(公告)日：1984-05-22

    申请号：US386557

    申请日：1982-06-09

    申请人： Faquir C. Mittal ,  Joseph S. Mathias

    发明人： Faquir C. Mittal ,  Joseph S. Mathias

    IPC分类号： H01L23/367 ,  H01L23/433 ,  H05K7/20

    CPC分类号： H05K7/20454 ,  H01L23/3677 ,  H01L23/4332 ,  H01L2924/0002

    摘要： A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bellows extend into the first cooling portion so that each bellows is urged into deflecting contact with a respective chip. A plurality of heat conducting strands are mounted in each bellows and extend into the second cooling portion. A fluid coolant is directed to flow across the heat conducting strands.

    摘要翻译： 多芯片热传导模块具有在具有安装在板上的芯片的板的壳体中的改进的冷却。 壳体被分割以形成第一和第二冷却部分。 芯片处于第一冷却部分。 几个波纹管延伸到第一冷却部分中，使得每个波纹管被推动成与相应的芯片偏转接触。 多个导热丝束安装在每个波纹管中并延伸到第二冷却部分。 流体冷却剂被引导流过导热股线。

    Fluid pump
    5.
    发明授权
    Fluid pump 失效
    流体泵

    公开(公告)号：US4321020A

    公开(公告)日：1982-03-23

    申请号：US103880

    申请日：1979-12-17

    申请人： Faquir C. Mittal

    发明人： Faquir C. Mittal

    IPC分类号： F04B17/04 ,  F04B19/14 ,  F04B17/00

    CPC分类号： F04B17/044 ,  F04B19/14

    摘要： There is disclosed a low-cost, axial fluid pump which does not involve the conversion of rotary to linear motion. The fluid pump herein is based on the principle of successively using a ball, that may be obtained from a reservoir of similar balls, as a piston within an enclosed cylinder. The ball is made to traverse the cylinder's length by simple non-motor means, thereby compressing the fluid. Upon pressurizing the fluid, the ball eventually returns to the reservoir and a new ball from the reservoir repeats the compression cycle. The pump of this invention is adapted for low pressure, low rate of flow, and low cost applications.

    摘要翻译： 公开了一种低成本的轴向流体泵，其不涉及旋转到线性运动的转换。 这里的流体泵是基于连续地使用球的原理，其可以从类似球的储存器获得，作为封闭圆筒内的活塞。 球通过简单的非电动机构使圆柱体的长度穿过，从而压缩流体。 在对流体加压时，球最终返回到储存器，并且来自储存器的新球重复压缩循环。 本发明的泵适用于低压，低流量和低成本应用。

    Method and apparatus for constructing an A/B switch
    6.
    发明授权
    Method and apparatus for constructing an A/B switch 失效
    用于构建A / B开关的方法和装置

    公开(公告)号：US6051798A

    公开(公告)日：2000-04-18

    申请号：US144196

    申请日：1998-08-31

    申请人： Faquir C. Mittal

    发明人： Faquir C. Mittal

    IPC分类号： H01R13/66 ,  H01R13/703 ,  H01R9/09

    CPC分类号： H01R13/703 ,  H01R13/6658

    摘要： A method for construction of an A/B switch is accomplished by press fitting two components of the switch together. The first component includes a circuit board with the switch circuitry. The circuit board is surrounded by an inner housing. An outer housing provides the output terminals for connecting the switch to other equipment. The outer housing has protrusions formed thereon for engaging and securing the inner housing when the inner and outer housings are press fit together.

    摘要翻译： 通过将开关的两个部件压入一起来实现A / B开关的构造方法。 第一组件包括具有开关电路的电路板。 电路板被内壳包围。 外壳提供用于将开关连接到其他设备的输出端子。 外壳体具有形成在其上的突起，用于在内外壳体压配合在一起时接合和固定内壳体。

    Printed-circuit board for use with card-edge connector and method
    7.
    发明授权
    Printed-circuit board for use with card-edge connector and method 失效
    印刷电路板，用于卡边连接器和方法

    公开(公告)号：US5692910A

    公开(公告)日：1997-12-02

    申请号：US447451

    申请日：1995-05-23

    申请人： Faquir C. Mittal

    发明人： Faquir C. Mittal

    IPC分类号： H01R12/72 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H01R9/09

    CPC分类号： H05K1/117 ,  H01R12/721 ,  H05K2201/09145 ,  H05K2201/094 ,  H05K2201/10863 ,  Y10S439/951

    摘要： A PC board for mating with a card-edge connector having a selectively configured projecting tab which defines a desired insertion force profile to facilitate engagement. A portion of the projecting tab is notched to delay the initial contact from the internal spring contacts of the mating card-edge connector until a proportional amount of contacts have opened and wiped some of the PC board terminals first, and then to allow the remaining contacts to engage the notched portion. Initial insertion force is relieved in proportion to the PC board edge profile.

    摘要翻译： 用于与具有选择性地构造的突出突片的卡缘连接器配合的PC板，其限定期望的插入力轮廓以便于接合。 突出突片的一部分被切口以延迟来自匹配卡缘连接器的内部弹簧触点的初始接触，直到成比例的触点打开并首先擦去一些PC板端子，然后允许剩余触点 以接合切口部分。 初始插入力与PC板边缘轮廓成正比。

    Apparatus for cooling integrated circuit chips with forced coolant jet
    8.
    发明授权
    Apparatus for cooling integrated circuit chips with forced coolant jet 失效
    用强制冷却剂喷射冷却集成电路芯片的装置

    公开(公告)号：US4750086A

    公开(公告)日：1988-06-07

    申请号：US807713

    申请日：1985-12-11

    申请人： Faquir C. Mittal

    发明人： Faquir C. Mittal

    IPC分类号： H01L23/433 ,  H05K7/20

    CPC分类号： H01L23/4336 ,  H01L23/4332 ,  H01L2924/0002 ,  Y10S165/908

    摘要： The capability of the microbellows cooling technique to remove heat from multi-chip modules is enhanced with a highly conductive, rigid, heat spreader. The heat spreader has a planar surface urged against a planar surface of the chip by the flexible microbellows. The surface area of the heat spreader is greater than the mating surface area of the chip. The heat spreader is attached to the bottom surface of the microbellows. The surface area of the heat spreader which mates with the surface of the chip is highly polished and coated with a highly conductive soft metal. A jet of coolant is forced into the inner surface of the microbellows.

    摘要翻译： 使用高导电性，刚性的散热器，可以提高微波冷却技术从多芯片模块中去除热量的能力。 散热器具有通过柔性微型薄片推压到芯片的平坦表面的平坦表面。 散热器的表面积大于芯片的配合面积。 散热器附着在微波管的底面。 与芯片表面配合的散热器的表面积被高度抛光并涂覆有高导电软金属。 冷却剂射流被迫进入微波导管的内表面。

    Apparatus for use in cooling integrated circuit chips
    9.
    发明授权
    Apparatus for use in cooling integrated circuit chips 失效
    用于冷却集成电路芯片的装置

    公开(公告)号：US4551787A

    公开(公告)日：1985-11-05

    申请号：US649877

    申请日：1984-09-13

    申请人： Faquir C. Mittal ,  Charles R. Solis

    发明人： Faquir C. Mittal ,  Charles R. Solis

    IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/3735 ,  H01L23/3672 ,  H01L23/473 ,  H01L2924/0002

    摘要： An integrated circuit chip is cooled by being mounted on a substrate which is urged into contact with a compliant mat which includes a layer having a predetermined array of interconnected metallic pads for spreading heat flux more uniformly. The mat is connected to a plate which may be water cooled. The mat also includes additional layers which are heat conductive and electrically insulative. One of the additional layers is a film of paste.

    摘要翻译： 集成电路芯片通过安装在基板上被冷却，该基板被推动与柔性垫接触，该柔性垫包括具有预定的互连金属焊盘阵列的层，以更均匀地扩散热通量。 垫子连接到可以水冷却的板上。 垫还包括导热和电绝缘的附加层。 附加层之一是胶片。