Reduced Residual Formation in Etched Multi-Layer Stacks
    1.
    发明申请
    Reduced Residual Formation in Etched Multi-Layer Stacks 审中-公开
    蚀刻多层堆叠中残留形成的减少

    公开(公告)号:US20090053535A1

    公开(公告)日:2009-02-26

    申请号:US12196959

    申请日:2008-08-22

    摘要: A multi-layer stack for imprint lithography is formed by applying a first polymerizable composition to a substrate, polymerizing the first polymerizable composition to form a first polymerized layer, applying a second polymerizable composition to the first polymerized layer, and polymerizing the second polymerizable composition to form a second polymerized layer on the first polymerized layer. The first polymerizable composition includes a polymerizable component with a glass transition temperature less than about 25° C., and the first polymerized layer is substantially impermeable to the second polymerizable composition.

    摘要翻译: 通过将第一可聚合组合物施加到基底上,聚合第一可聚合组合物以形成第一聚合层,向第一聚合层施加第二可聚合组合物,并将第二可聚合组合物聚合成 在第一聚合层上形成第二聚合层。 第一可聚合组合物包括玻璃化转变温度低于约25℃的可聚合组分,并且第一聚合层对于第二可聚合组合物基本上是不可渗透的。

    REDUCED RESIDUAL FORMATION IN ETCHED MULTI-LAYER STACKS
    2.
    发明申请
    REDUCED RESIDUAL FORMATION IN ETCHED MULTI-LAYER STACKS 审中-公开
    在多层堆叠中减少残留形成

    公开(公告)号:US20120288686A1

    公开(公告)日:2012-11-15

    申请号:US13546622

    申请日:2012-07-11

    摘要: A multi-layer stack for imprint lithography is formed by applying a first polymerizable composition to a substrate, polymerizing the first polymerizable composition to form a first polymerized layer, applying a second polymerizable composition to the first polymerized layer, and polymerizing the second polymerizable composition to form a second polymerized layer on the first polymerized layer. The first polymerizable composition includes a polymerizable component with a glass transition temperature less than about 25° C., and the first polymerized layer is substantially impermeable to the second polymerizable composition.

    摘要翻译: 通过将第一可聚合组合物施加到基底上,聚合第一可聚合组合物以形成第一聚合层,向第一聚合层施加第二可聚合组合物,并将第二可聚合组合物聚合成 在第一聚合层上形成第二聚合层。 第一可聚合组合物包括玻璃化转变温度低于约25℃的可聚合组分,并且第一聚合层对于第二可聚合组合物基本上是不可渗透的。