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    Off-axis contact tip and dense packing design for a fine pitch probe
    3.
    发明授权
    Off-axis contact tip and dense packing design for a fine pitch probe 失效
    离轴接触尖端和密集包装设计，用于细间距探头

    公开(公告)号：US06411112B1

    公开(公告)日：2002-06-25

    申请号：US09026382

    申请日：1998-02-19

    申请人： Gobinda Das ,  Steven J. Duda ,  Paul M. Gaschke

    发明人： Gobinda Das ,  Steven J. Duda ,  Paul M. Gaschke

    IPC分类号： G01R3102

    CPC分类号： G01R1/07357 ,  G01R1/07371

    摘要： A probe system for electrical contact testing of a row of densely spaced wire bonding pads is provided comprising a plurality of probes, with each probe having a tip offset from the probe center axis. The probes may be mounted in a housing having an upper die and a lower die, and the lower die may be offset from the upper die. The probes are pivotally mounted in the holes of the upper die, and the probe bodies are convexly curved and extend down into the holes of the lower die. The bevel tipped probes may be arranged in two staggered and parallel rows of probes, with the tip of each probe oriented along the centerline formed between the two row of probes. The probes may be closely spaced in each row. The tips of the probes in one row are oriented 180 degrees with respect to the probes in the opposite row. The tips of each probe may also comprise a tip located along the center axis or a double bevel surface forming a tip at the apex of the two bevel surfaces.

    摘要翻译： 提供了一排密集间隔的引线接合焊盘的用于电接触测试的探针系统，其包括多个探针，每个探针具有从探针中心轴线偏移的尖端。 探针可以安装在具有上模和下模的壳体中，并且下模可以从上模偏移。 探针可枢转地安装在上模的孔中，并且探针体凸出地弯曲并向下延伸到下模的孔中。 倾斜尖端探针可以布置在两个交错和平行的探针中，每个探针的尖端沿着形成在两排探针之间的中心线取向。 探针可以在每排中紧密间隔开。 探针在一排中的尖端相对于相反行中的探针定向180度。 每个探针的尖端还可以包括沿着中心轴线定位的尖端或在两个斜面的顶点处形成尖端的双斜面。

    Wafer probe interface arrangement with nonresilient probe elements and support structure
    4.
    发明授权
    Wafer probe interface arrangement with nonresilient probe elements and support structure 失效
    晶圆探头接口布置与非敏感探头元件和支撑结构

    公开(公告)号：US06426636B1

    公开(公告)日：2002-07-30

    申请号：US09022240

    申请日：1998-02-11

    申请人： Gobinda Das ,  Steven J. Duda ,  Paul M. Gaschke ,  Angelo M. Giaimo ,  Frederick L. Taber, Jr. ,  John F. Vetrero

    发明人： Gobinda Das ,  Steven J. Duda ,  Paul M. Gaschke ,  Angelo M. Giaimo ,  Frederick L. Taber, Jr. ,  John F. Vetrero

    IPC分类号： G01R3102

    CPC分类号： G01R1/0735

    摘要： A nonresilient rigid test probe arrangement which is designed for testing the integrity of silicon semiconductor device wafers or chips, and which eliminates pliant conditions encountered by current text fixtures, which are adverse to the attainment of satisfactory test results with rigid probes. The test system interface assembly includes a rigid ceramic substrate which forms a pedestal over which the rigid probe makes electrical contact. A PC board is located on the opposite side of the ceramic substrate. A clamp ring retains the PC board to a test head system with mating precision reference surfaces formed therebetween. Pogo pin connectors extend between the PC board and the test head system. A stiffening element having a control aperture is bolted through the PC board to the clamp ring, all of which form a rigid test probe arrangement.

    摘要翻译： 设计用于测试硅半导体器件晶片或芯片的完整性的非敏感性刚性测试探针装置，并且消除了当前文本夹具遇到的柔性条件，这对于用刚性探头达到令人满意的测试结果是不利的。 测试系统接口组件包括形成基座的刚性陶瓷基板，刚性探头在该基座上进行电接触。 PC板位于陶瓷基板的相对侧。 夹环将PC板保持在测试头系统上，其间形成有配合的精密参考表面。 Pogo针连接器在PC板和测试头系统之间延伸。 具有控制孔的加强元件通过PC板螺栓连接到夹紧环，所有这些形成刚性测试探针装置。