公开(公告)号：US20120258919A1

公开(公告)日：2012-10-11

申请号：US13523438

申请日：2012-06-14

申请人： Fumihito SUGIHARA ,  Naoki INOUE ,  Seiko KOIZUMI ,  Chinfang LIU ,  Hajime TAKASAKI ,  Hisayuki KOBAYASHI ,  Hiroshi MANO ,  Sachie NAKATANI ,  Masahiro WADA

发明人： Fumihito SUGIHARA ,  Naoki INOUE ,  Seiko KOIZUMI ,  Chinfang LIU ,  Hajime TAKASAKI ,  Hisayuki KOBAYASHI ,  Hiroshi MANO ,  Sachie NAKATANI ,  Masahiro WADA

IPC分类号： A61K38/05 ,  A61P17/02 ,  A61P19/10 ,  A61P19/02

CPC分类号： C07K5/06139 ,  A61K38/05 ,  C07K5/06165

摘要： A problem that the present invention is to solve is to provide: a main body of a peptide molecule which is effective for inhibition of various maladies such as osteoporosis, osteoarthritis and pressure ulcer, particularly, a dipeptide which is easy to absorb into a body in an intestine; a collagen peptide which comprises the dipeptide as an essential dipeptide; and a malady inhibitor which comprises the dipeptide as an essential effective component. As a means of solving such a problem, a collagen peptide according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential dipeptide. A dipeptide according to the present invention is characterized by having a structure of Hyp-Gly. A malady inhibitor according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential effective component.

摘要翻译： 本发明要解决的问题是提供：对于抑制诸如骨质疏松症，骨关节炎和压力性溃疡等各种疾病的肽分子的主体，特别是容易吸收到体内的二肽 肠 包含二肽作为必需二肽的胶原肽; 以及包含二肽作为基本有效成分的疾病抑制剂。 作为解决上述问题的方法，本发明的胶原肽的特征在于，含有具有Hyp-Gly结构的二肽作为必需二肽的二肽。 根据本发明的二肽的特征在于具有Hyp-Gly的结构。 根据本发明的疾病抑制剂的特征在于包含具有Hyp-Gly结构作为必需有效成分的二肽。

公开(公告)号：US20120032353A1

公开(公告)日：2012-02-09

申请号：US13274971

申请日：2011-10-17

申请人： Yutaka KAGAYA ,  Fumitomo WATANABE ,  Hajime TAKASAKI

发明人： Yutaka KAGAYA ,  Fumitomo WATANABE ,  Hajime TAKASAKI

IPC分类号： H01L23/488

CPC分类号： H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.

摘要翻译： 半导体器件包括其上具有连接焊盘的布线板和安装在布线板上的半导体芯片。 接线板和半导体芯片被密封部分覆盖。 导电构件从连接垫向上延伸并从密封部分露出。 再生线连接到暴露的导电构件。 接地部设置在密封部上，并通过再布线与导电部件电连接。

公开(公告)号：US20090045497A1

公开(公告)日：2009-02-19

申请号：US12190010

申请日：2008-08-12

申请人： Yutaka KAGAYA ,  Fumitomo WATANABE ,  Hajime TAKASAKI

发明人： Yutaka KAGAYA ,  Fumitomo WATANABE ,  Hajime TAKASAKI

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.

摘要翻译： 半导体器件包括其上具有连接焊盘的布线板和安装在布线板上的半导体芯片。 接线板和半导体芯片被密封部分覆盖。 导电构件从连接垫向上延伸并从密封部分露出。 再生线连接到暴露的导电构件。 接地部设置在密封部上，并通过再布线与导电部件电连接。