公开(公告)号：US20070247249A1

公开(公告)日：2007-10-25

申请号：US11787403

申请日：2007-04-16

申请人： Takaaki Ishikawa ,  Kuichi Kubo ,  Fumio Asamura ,  Kozo Ono

发明人： Takaaki Ishikawa ,  Kuichi Kubo ,  Fumio Asamura ,  Kozo Ono

IPC分类号： H03L1/00

CPC分类号： H03L1/023 ,  H03L1/04

摘要： A temperature-compensated crystal oscillator for surface mounting wherein an IC chip into which is integrated a temperature-compensated device having an oscillating circuit and a temperature sensor, which supplies a compensation voltage to a variable-voltage capacitor element of the oscillating circuit, and which also has IC terminals disposed along two edges comprising at least diagonally opposite corner portions of one main surface that acts as a circuit function surface is affixed with the use of bumps to an inner base surface of a main container that is concave in section, and one edge portion of a crystal piece is affixed to an inner wall step portion of the main container; wherein an active element of the oscillating circuit that acts as a heat source and a temperature sensor of the temperature-compensated device are disposed at diagonally opposite corner regions of the IC chip at the greatest distance apart. In addition, IC terminals for thermal dissipation are provided in a central region of the IC chip. The present invention provides a temperature-compensated oscillator for surface mounting in which the temperature-compensation operation at startup is satisfactory and frequency stability is maintained.

摘要翻译： 一种用于表面安装的温度补偿晶体振荡器，其中集成了具有振荡电路的温度补偿装置和向振荡电路的可变电压电容器元件提供补偿电压的温度传感器的IC芯片， 还具有沿着两个边缘布置的IC端子，其包括用作电路功能表面的一个主表面的至少对角线相对的角部，其中使用凸块来固定到位于凹入部分的主容器的内基面，并且一个 水晶片的边缘部分固定在主容器的内壁台阶部分上; 其中作为温度补偿装置的热源的振荡电路的有源元件和温度补偿装置的温度传感器以最远的距离设置在IC芯片的对角相对的拐角区域。 此外，用于散热的IC端子设置在IC芯片的中心区域中。 本发明提供一种用于表面安装的温度补偿振荡器，其中启动时的温度补偿操作令人满意并且维持频率稳定性。

公开(公告)号：US20050017811A1

公开(公告)日：2005-01-27

申请号：US10897977

申请日：2004-07-22

申请人： Fumio Asamura ,  Kuichi Kubo ,  Kozo Ono

发明人： Fumio Asamura ,  Kuichi Kubo ,  Kozo Ono

IPC分类号： H03B5/32 ,  H03H9/02 ,  H03B5/12

CPC分类号： H03B5/32

摘要： A surface-mounted oscillator configured by integrally accommodating an oscillation element, an IC chip, and a circuit element in a surface-mounted package is characterized in that the oscillation element, the IC chip, and the circuit element are arranged in positions in a direction vertical to a mounting surface of the surface-mounted oscillator. The oscillation element may be an oscillation element using bulk wave oscillation, or an oscillation element using surface wave oscillation.

摘要翻译： 将表面安装的振荡元件，IC芯片和电路元件整体地容纳在表面安装封装中的表面安装振荡器的特征在于，振荡元件，IC芯片和电路元件被布置在方向 垂直于表面安装振荡器的安装表面。 振荡元件可以是使用体波振荡的振荡元件，也可以是使用表面波振荡的振荡元件。

公开(公告)号：US07471162B2

公开(公告)日：2008-12-30

申请号：US11787403

申请日：2007-04-16

申请人： Takaaki Ishikawa ,  Kuichi Kubo ,  Fumio Asamura ,  Kozo Ono

发明人： Takaaki Ishikawa ,  Kuichi Kubo ,  Fumio Asamura ,  Kozo Ono

IPC分类号： H03B1/00

CPC分类号： H03L1/023 ,  H03L1/04

摘要： A temperature-compensated crystal oscillator for surface mounting wherein an IC chip into which is integrated a temperature-compensated device having an oscillating circuit and a temperature sensor, which supplies a compensation voltage to a variable-voltage capacitor element of the oscillating circuit, and which also has IC terminals disposed along two edges comprising at least diagonally opposite corner portions of one main surface that acts as a circuit function surface is affixed with the use of bumps to an inner base surface of a main container that is concave in section, and one edge portion of a crystal piece is affixed to an inner wall step portion of the main container; wherein an active element of the oscillating circuit that acts as a heat source and a temperature sensor of the temperature-compensated device are disposed at diagonally opposite corner regions of the IC chip at the greatest distance apart. In addition, IC terminals for thermal dissipation are provided in a central region of the IC chip. The present invention provides a temperature-compensated oscillator for surface mounting in which the temperature-compensation operation at startup is satisfactory and frequency stability is maintained.

摘要翻译： 一种用于表面安装的温度补偿晶体振荡器，其中集成了具有振荡电路的温度补偿装置和向振荡电路的可变电压电容器元件提供补偿电压的温度传感器的IC芯片， 还具有沿着两个边缘布置的IC端子，其包括用作电路功能表面的一个主表面的至少对角线相对的角部分，其中使用凸块固定在主容器的内部基部表面上，该主容器的内部是凹形的， 水晶片的边缘部分固定在主容器的内壁台阶部分上; 其中作为温度补偿装置的热源的振荡电路的有源元件和温度补偿装置的温度传感器以最远的距离设置在IC芯片的对角相对的拐角区域。 此外，用于散热的IC端子设置在IC芯片的中心区域中。 本发明提供一种用于表面安装的温度补偿振荡器，其中启动时的温度补偿操作令人满意并且维持频率稳定性。

公开(公告)号：US07157981B2

公开(公告)日：2007-01-02

申请号：US10897977

申请日：2004-07-22

申请人： Fumio Asamura ,  Kuichi Kubo ,  Kozo Ono

发明人： Fumio Asamura ,  Kuichi Kubo ,  Kozo Ono

IPC分类号： H03B5/12

CPC分类号： H03B5/32

摘要： A surface-mounted oscillator configured by integrally accommodating an oscillation element, an IC chip, and a circuit element in a surface-mounted package is characterized in that the oscillation element, the IC chip, and the circuit element are arranged in positions in a direction vertical to a mounting surface of the surface-mounted oscillator. The oscillation element may be an oscillation element using bulk wave oscillation, or an oscillation element using surface wave oscillation.

摘要翻译： 将表面安装的振荡元件，IC芯片和电路元件整体地容纳在表面安装封装中的表面安装振荡器的特征在于，振荡元件，IC芯片和电路元件被布置在方向 垂直于表面安装振荡器的安装表面。 振荡元件可以是使用体波振荡的振荡元件，也可以是使用表面波振荡的振荡元件。

公开(公告)号：US20050184819A1

公开(公告)日：2005-08-25

申请号：US11057453

申请日：2005-02-14

申请人： Takeo Oita ,  Minoru Fukuda ,  Takaaki Ishikawa ,  Akihiro Nakamura ,  Kozo Ono ,  Fumio Asamura

发明人： Takeo Oita ,  Minoru Fukuda ,  Takaaki Ishikawa ,  Akihiro Nakamura ,  Kozo Ono ,  Fumio Asamura

IPC分类号： H05B3/12 ,  H03B5/04 ,  H03B5/32 ,  H03B5/36 ,  H03B5/30

CPC分类号： H03B5/04 ,  H03B5/366

摘要： The crystal oscillator device for simultaneously generating oscillator signals with a plurality of oscillation modes of a crystal unit, comprising: a primary resonator unit filtering the oscillator signal with a primary oscillation mode, which is one of the oscillation modes, from the output of the crystal unit, a secondary resonator unit filtering the oscillation signal, bearing a different resonance frequency from that of the primary resonator unit, with the primary oscillation mode from the output of the crystal unit, a primary phase synthesis unit, synthesizing the phases of the output signal of the primary resonator unit and the output signal of the secondary resonator unit, a tertiary resonator unit, a quaternary resonator unit, and a secondary phase synthesis unit.

摘要翻译： 一种用于同时产生具有晶体单元的多个振荡模式的振荡器信号的晶体振荡器装置，包括：从所述晶体的输出以主振荡模式（其为振荡模式之一）对所述振荡器信号进行滤波的主谐振器单元 单元，次级谐振器单元滤波振荡信号，与主谐振器单元的谐振频率不同，具有来自晶体单元的输出的主振荡模式，主相合成单元，合成输出信号的相位 的主谐振器单元和次谐波单元的输出信号，三次谐振器单元，四元谐振器单元和次级相位合成单元。

公开(公告)号：US07378916B2

公开(公告)日：2008-05-27

申请号：US11057453

申请日：2005-02-14

申请人： Takeo Oita ,  Minoru Fukuda ,  Takaaki Ishikawa ,  Akihiro Nakamura ,  Kozo Ono ,  Fumio Asamura

发明人： Takeo Oita ,  Minoru Fukuda ,  Takaaki Ishikawa ,  Akihiro Nakamura ,  Kozo Ono ,  Fumio Asamura

IPC分类号： H03B5/32

CPC分类号： H03B5/04 ,  H03B5/366

摘要： The crystal oscillator device for simultaneously generating oscillator signals with a plurality of oscillation modes of a crystal unit, comprising: a primary resonator unit filtering the oscillator signal with a primary oscillation mode, which is one of the oscillation modes, from the output of the crystal unit, a secondary resonator unit filtering the oscillation signal, bearing a different resonance frequency from that of the primary resonator unit, with the primary oscillation mode from the output of the crystal unit, a primary phase synthesis unit, synthesizing the phases of the output signal of the primary resonator unit and the output signal of the secondary resonator unit, a tertiary resonator unit, a quaternary resonator unit, and a secondary phase synthesis unit.

摘要翻译： 一种用于同时产生具有晶体单元的多个振荡模式的振荡器信号的晶体振荡器装置，包括：从所述晶体的输出以主振荡模式（其为振荡模式之一）对所述振荡器信号进行滤波的主谐振器单元 单元，次级谐振器单元滤波振荡信号，与主谐振器单元的谐振频率不同，具有来自晶体单元的输出的主振荡模式，主相合成单元，合成输出信号的相位 的主谐振器单元和次谐波单元的输出信号，三次谐振器单元，四元谐振器单元和次级相位合成单元。

公开(公告)号：US07728491B2

公开(公告)日：2010-06-01

申请号：US12251312

申请日：2008-10-14

申请人： Kozo Ono ,  Takahiro Inoue

发明人： Kozo Ono ,  Takahiro Inoue

IPC分类号： H01L41/053

CPC分类号： H01L41/277 ,  H01L41/042 ,  H01L41/0474 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/083 ,  H01L41/23 ,  H01L41/25 ,  H01L41/293 ,  H01L41/297 ,  H03H3/02 ,  H03H9/0595 ,  H03H9/1035 ,  H03H9/178 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49798

摘要： Piezoelectric devices and associated fabrication methods are disclosed. An exemplary piezoelectric device includes a piezoelectric vibrating piece having first and second electrodes and first and second surfaces, a glass base having first and second surfaces, and a lid. These three parts also form the device package. The first surface of the piezoelectric vibrating piece is mounted to the base, and the lid is mounted to the second surface of the piezoelectric vibrating piece to seal the package. The glass base includes first and second metal wires having ends that protrude from the surfaces of the base. The side surfaces of the protruding wire ends are connected to the first and the second electrodes, respectively. Manufacture is performed using whole wafers that are processed, sandwiched, bonded, and then cut to produce individual devices.

摘要翻译： 公开了压电器件和相关的制造方法。 示例性压电装置包括具有第一和第二电极以及第一和第二表面的压电振动片，具有第一和第二表面的玻璃基底和盖。 这三个部分也构成了器件封装。 将压电振动片的第一表面安装到基座上，并且将盖安装到压电振动片的第二表面以密封封装。 玻璃基座包括从底座的表面突出的端部的第一和第二金属线。 突出的线端部的侧表面分别连接到第一和第二电极。 使用加工，夹层，粘合，然后切割以生产各种装置的整个晶片进行制造。

公开(公告)号：US07628129B2

公开(公告)日：2009-12-08

申请号：US10582708

申请日：2004-12-10

申请人： Fumio Takeshima ,  Koji Satake ,  Hideo Kurasawa ,  Kozo Ono

发明人： Fumio Takeshima ,  Koji Satake ,  Hideo Kurasawa ,  Kozo Ono

IPC分类号： F01L1/04

CPC分类号： B21K1/20 ,  B21C9/005 ,  B21C9/02 ,  B21C43/02 ,  B21J3/00 ,  B21J5/00 ,  B21J5/02 ,  B21J5/06 ,  B21J5/08 ,  B21K1/10 ,  B23P2700/02 ,  F01L1/026 ,  F01L1/047 ,  F01L1/08 ,  F01L1/146 ,  F01L1/181 ,  F01L2103/00 ,  Y10T29/49293 ,  Y10T29/49995

摘要： A method of manufacturing a cam for a camshaft, comprising the steps of continuously applying, to a billet having a volume larger by a specified volume than a final product, a plurality of cold forging steps formed of a preliminary outline upsetting, an outline drawing, a simultaneous piercing of inner and outer diameter surfaces, a press-molding forming excess amount as burrs on the inner diameter surface, a piercing of the inner diameter surface for removing the burrs from the inner diameter surface, and a simultaneous ironing of the inner and outer diameter surfaces. The final finishing (machining) of a cam (profile) surface can be eliminated, and the final product of the cam for the camshaft having a high dimensional accuracy can be provided.

摘要翻译： 一种制造用于凸轮轴的凸轮的方法，包括以下步骤：对具有比最终产品规定体积更大的体积的坯料连续地施加多个由初步轮廓镦锻，轮廓图形成的冷锻步骤， 内外径表面同时穿刺，内径面上形成过量的冲压成型，内径面的刺穿，从内径面除去毛刺，同时熨烫内， 外径表面。 可以消除凸轮（轮廓）表面的最终精加工（加工），并且可以提供具有高尺寸精度的用于凸轮轴的凸轮的最终产品。

公开(公告)号：US07174620B2

公开(公告)日：2007-02-13

申请号：US10746400

申请日：2003-12-26

申请人： Akio Chiba ,  Kozo Ono ,  Tamotsu Kurosawa

发明人： Akio Chiba ,  Kozo Ono ,  Tamotsu Kurosawa

IPC分类号： H04R31/00

CPC分类号： H03H3/02 ,  C30B29/18 ,  C30B33/00 ,  H03H9/19 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49798

摘要： A method of manufacturing a thin quartz crystal wafer from a quartz crystal block which is cut from a crystal body of synthetic quartz crystal and has a flat principal surface, comprises the steps of (a) converging a laser beam at a region in said quartz crystal block at a predetermined depth from the principal surface thereof to cause multiphoton phenomenon state, thereby breaking Si—O—Si bonds of quartz crystal in said region to form voids in said region, and (b) peeling said thin quartz crystal wafer from a body of said quartz crystal block along said voids. The above process is repeatedly performed on one quartz crystal block to peel off a plurality of thin quartz crystal wafers successively from the principal surface of the quartz crystal block. Each of the thin quartz crystal wafers is divided into individual quartz crystal blanks for making quartz crystal units.

摘要翻译： 从由合成石英晶体切割并具有平坦主表面的石英晶体块制造薄晶体晶片的方法包括以下步骤：（a）将激光束会聚在所述石英晶体的区域 在其主表面的预定深度处阻挡以产生多光子现象状态，从而破坏所述区域中的石英晶体的Si-O-Si键，以在所述区域中形成空隙，并且（b）将所述薄的石英晶片从主体 的所述石英晶体块。 上述过程在一个石英晶体块上重复进行，从石英晶体块的主表面连续地剥离多个薄的石英晶片。 每个薄的石英晶片被分成用于制造石英晶体单元的单独的石英晶体空白。

公开(公告)号：US20060063489A1

公开(公告)日：2006-03-23

申请号：US11230756

申请日：2005-09-19

申请人： Kazuo Akaike ,  Makoto Okamoto ,  Tsutomu Yamakawa ,  Minoru Fukuda ,  Kozo Ono ,  Nobuo Tsukamoto

发明人： Kazuo Akaike ,  Makoto Okamoto ,  Tsutomu Yamakawa ,  Minoru Fukuda ,  Kozo Ono ,  Nobuo Tsukamoto

IPC分类号： H04B7/00 ,  H04M1/00

CPC分类号： H04B1/30

摘要： A high-frequency wireless communication device is provided that is capable of enlarging the range of communication by enhancing reception sensitivity while avoiding mutual interference. The device comprises an antenna filter and a direct detection type reception mechanism connected to the antenna filter. A crystal filter is used as the antenna filter. A crystal chip constituting the crystal filter and an IC chip into which the reception mechanism is integrated are housed in a single modular container to configure a high-frequency wireless module.