公开(公告)号：US11688704B2

公开(公告)日：2023-06-27

申请号：US17580961

申请日：2022-01-21

Applicant: Futurewei Technologies, Inc.

Inventor： Shiqun Gu ,  Jinghua Zhu ,  Hongying Zhang ,  Jun Xia ,  Wangsheng Xie ,  Shuangfu Wang ,  Hong Liu ,  Liming Zhao ,  Hongquan Sun

IPC: H01L29/739 ,  H01L23/00 ,  H01L21/78 ,  H01L23/29 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10 ,  H01L21/683 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L24/06 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/293 ,  H01L24/03 ,  H01L24/11 ,  H01L24/14 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2221/68304 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058

Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.

公开(公告)号：US11233025B2

公开(公告)日：2022-01-25

申请号：US15880451

申请日：2018-01-25

Applicant: Futurewei Technologies, Inc.

Inventor： Shiqun Gu ,  Jinghua Zhu ,  Hongying Zhang ,  Jun Xia ,  Wangsheng Xie ,  Shuangfu Wang ,  Hong Liu ,  Liming Zhao ,  Hongquan Sun

IPC: H01L29/00 ,  H01L23/00 ,  H01L21/78 ,  H01L23/29 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10 ,  H01L21/683 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31

Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.

公开(公告)号：US20220148988A1

公开(公告)日：2022-05-12

申请号：US17580961

申请日：2022-01-21

Applicant: Futurewei Technologies, Inc.

Inventor： Shiqun Gu ,  Jinghua Zhu ,  Hongying Zhang ,  Jun Xia ,  Wangsheng Xie ,  Shuangfu Wang ,  Hong Liu ,  Liming Zhao ,  Hongquan Sun

IPC: H01L23/00 ,  H01L21/78 ,  H01L23/29 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10 ,  H01L21/683

Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.

公开(公告)号：US20180350762A1

公开(公告)日：2018-12-06

申请号：US15880451

申请日：2018-01-25

Applicant: Futurewei Technologies, Inc.

Inventor： Shiqun Gu ,  Jinghua Zhu ,  Hongying Zhang ,  Jun Xia ,  Wangsheng Xie ,  Shuangfu Wang ,  Hong Liu ,  Liming Zhao ,  Hongquan Sun

IPC: H01L23/00 ,  H01L21/78 ,  H01L25/00 ,  H01L23/29 ,  H01L21/48 ,  H01L25/065

Abstract: An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.