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公开(公告)号:US3508330A
公开(公告)日:1970-04-28
申请号:US3508330D
申请日:1967-04-06
Applicant: GEN DYNAMICS CORP
Inventor: KUBIK JAMES R
CPC classification number: H05K3/42 , H05K3/4092 , Y10T29/435 , Y10T29/49165 , Y10T29/4981 , Y10T29/49993
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公开(公告)号:US3429786A
公开(公告)日:1969-02-25
申请号:US3429786D
申请日:1966-10-21
Applicant: GEN DYNAMICS CORP
Inventor: KUBIK JAMES R
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3.Process for fabricating high density multilayer electrical interconnections 失效
Title translation: 制造高密度多层电气互连的方法公开(公告)号:US3462832A
公开(公告)日:1969-08-26
申请号:US3462832D
申请日:1966-10-24
Applicant: GEN DYNAMICS CORP
Inventor: KUBIK JAMES R
CPC classification number: H05K3/4092 , H05K3/42 , Y10T29/49165
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4.
公开(公告)号:US3342927A
公开(公告)日:1967-09-19
申请号:US51971966
申请日:1966-01-10
Applicant: GEN DYNAMICS CORP
Inventor: KUBIK JAMES R , DUGAN WILLIAM P
CPC classification number: H05K3/328 , H05K3/062 , H05K3/108 , H05K3/36 , H05K3/4092 , H05K3/4611 , H05K2201/0382
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