公开(公告)号：US20170243783A1

公开(公告)日：2017-08-24

申请号：US15048493

申请日：2016-02-19

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Ashwini CHANDRASHEKAR ,  Anbu Selvam KM MAHALINGAM ,  Craig Michael CHILD, JR.

IPC: H01L21/768 ,  H01L21/02 ,  H01L23/532 ,  H01L21/311 ,  H01L23/522

CPC classification number: H01L21/76802 ,  H01L21/02126 ,  H01L21/0214 ,  H01L21/31111 ,  H01L21/31144 ,  H01L21/76811 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53228 ,  H01L23/53295

Abstract: Intermediate semiconductor devices and methods of reducing damage during back end of the line (BEOL) metallization and metal one (M1) layer integration scheme are provided. One method includes, for instance: obtaining a wafer having at least one contact region; depositing on the wafer a thin film stack having at least one layer of amorphous silicon (a-Si); performing lithography to pattern at least one opening; performing lithography to pattern at least one via opening and at least one trench opening; and removing the at least one a-Si layer. One intermediate semiconductor device includes, for instance: a wafer having at least one contact region; at least one first dielectric layer on the device; at least one second dielectric layer on the at least one first dielectric layer; and at least one a-Si layer on the at least one second dielectric layer.

公开(公告)号：US20180226294A1

公开(公告)日：2018-08-09

申请号：US15425478

申请日：2017-02-06

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Jason Eugene STEPHENS ,  David Michael PERMANA ,  Guillaume BOUCHE ,  Andy WEI ,  Mark ZALESKI ,  Anbu Selvam KM MAHALINGAM ,  Craig Michael CHILD, JR. ,  Roderick Alan AUGUR ,  Shyam PAL ,  Linus JANG ,  Xiang HU ,  Akshey SEHGAL

IPC: H01L21/768 ,  H01L21/311 ,  H01L21/027 ,  H01L23/522 ,  H01L23/528

CPC classification number: H01L21/76897 ,  H01L21/0273 ,  H01L21/31144 ,  H01L21/76802 ,  H01L21/76808 ,  H01L21/76811 ,  H01L21/76816 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/528

Abstract: Semiconductor devices and methods of fabricating the semiconductor devices with chamfer-less via multi-patterning are disclosed. One method includes, for instance: obtaining an intermediate semiconductor device; performing a trench etch into a portion of the intermediate semiconductor device to form a trench pattern; depositing an etching stack; performing at least one via patterning process; and forming at least one via opening into a portion of the intermediate semiconductor device. An intermediate semiconductor device is also disclosed.