公开(公告)号：US07726835B2

公开(公告)日：2010-06-01

申请号：US11816951

申请日：2006-02-06

申请人： Georg Bogner ,  Moritz Engl ,  Stefan Grötsch ,  Patrick Kromotis ,  Jorg Erich Sorg

发明人： Georg Bogner ,  Moritz Engl ,  Stefan Grötsch ,  Patrick Kromotis ,  Jorg Erich Sorg

IPC分类号： H01L27/15

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/505 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2924/00

摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

摘要翻译： 在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体， 透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面 ，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。 至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

公开(公告)号：US20090103297A1

公开(公告)日：2009-04-23

申请号：US11816951

申请日：2006-02-06

申请人： Georg Bogner ,  Moritz Engl ,  Stefan Grotsch ,  Patrick Kromotis ,  Jorg Erich Sorg

发明人： Georg Bogner ,  Moritz Engl ,  Stefan Grotsch ,  Patrick Kromotis ,  Jorg Erich Sorg

IPC分类号： F21V33/00

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/505 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2924/00

摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

摘要翻译： 在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体， 透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面 ，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。 至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

公开(公告)号：US20090127573A1

公开(公告)日：2009-05-21

申请号：US11664304

申请日：2005-09-13

申请人： Ewald Karl Michael Guenther ,  Jorg Erich Sorg ,  Norbert Stath

发明人： Ewald Karl Michael Guenther ,  Jorg Erich Sorg ,  Norbert Stath

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L33/508 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/82007 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/00

摘要： An optoelectronic component contains a semiconductor chip (1) and a carrier body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), the encapsulation layer (3) having two cutouts (11, 12) for uncovering a contact area (6) and a connection region (8) of the carrier body, and an electrically conductive layer (14) being led from the contact area (6) over a partial region of the encapsulation layer (3) to the electrical connection region (8) of the carrier body (10) in order to electrically connect the contact area (6) and the electrical connection region (8) to one another. The radiation emitted in a main radiation direction (13) by the semiconductor chip (1) is coupled out through the encapsulation layer (3), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.

摘要翻译： 光电子部件包含半导体芯片（1）和载体主体（10），其具有透明的电绝缘封装层（3），所述封装层（3）具有两个切口（11,12），用于露出 接触区域（6）和所述载体主体的连接区域（8），以及导电层（14），其从所述接触区域（6）在所述封装层（3）的部分区域上引导到所述电连接区域 （10）的所述电连接区域（8）之间，以将所述接触区域（6）和所述电连接区域（8）彼此电连接。 通过半导体芯片（1）在主辐射方向（13）上发射的辐射通过封装层（3）耦合出来，该封装层有利地包含发射辐射的波长转换的发光转换物质。