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    Optoelectronic component
    1.
    发明授权
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US08314441B2

    公开(公告)日：2012-11-20

    申请号：US13084149

    申请日：2011-04-11

    申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

    摘要翻译： 具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。 为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。 这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于 填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。

    LED array
    3.
    发明授权
    LED array 有权
    LED阵列

    公开(公告)号：US07726835B2

    公开(公告)日：2010-06-01

    申请号：US11816951

    申请日：2006-02-06

    申请人： Georg Bogner ,  Moritz Engl ,  Stefan Grötsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    发明人： Georg Bogner ,  Moritz Engl ,  Stefan Grötsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    IPC分类号： H01L27/15

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/505 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

    摘要翻译： 在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体， 透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面 ，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。 至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

    Optoelectronic component and method for producing it
    4.
    发明授权
    Optoelectronic component and method for producing it 有权
    光电元件及其制造方法

    公开(公告)号：US07514279B2

    公开(公告)日：2009-04-07

    申请号：US11002326

    申请日：2004-12-02

    申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    IPC分类号： H01L21/00

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

    摘要翻译： 一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。 为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。 这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物 由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

    Optoelectronic component and method for producing it
    6.
    发明申请
    Optoelectronic component and method for producing it 有权
    光电元件及其制造方法

    公开(公告)号：US20050093005A1

    公开(公告)日：2005-05-05

    申请号：US11002326

    申请日：2004-12-02

    申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    IPC分类号： H01L23/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/60 ,  H01L21/00 ,  H01L27/15 ,  H01L29/26 ,  H01L31/12

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

    摘要翻译： 一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。 为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。 这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物 由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

    Optoelectronic Component
    7.
    发明申请
    Optoelectronic Component 有权
    光电元件

    公开(公告)号：US20100327307A1

    公开(公告)日：2010-12-30

    申请号：US12879130

    申请日：2010-09-10

    申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    IPC分类号： H01L33/60

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

    摘要翻译： 具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。 为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。 这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于 填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。

    LED ARRAY
    8.
    发明申请
    LED ARRAY 有权
    LED阵列

    公开(公告)号：US20090103297A1

    公开(公告)日：2009-04-23

    申请号：US11816951

    申请日：2006-02-06

    申请人： Georg Bogner ,  Moritz Engl ,  Stefan Grotsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    发明人： Georg Bogner ,  Moritz Engl ,  Stefan Grotsch ,  Patrick Kromotis ,  Jorg Erich Sorg

    IPC分类号： F21V33/00

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/42 ,  H01L33/505 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

    摘要翻译： 在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体， 透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面 ，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。 至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

    Optoelectronic Component
    9.
    发明申请
    Optoelectronic Component 有权
    光电元件

    公开(公告)号：US20090026482A1

    公开(公告)日：2009-01-29

    申请号：US12242170

    申请日：2008-09-30

    申请人： Marcus RUHNAU ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    发明人： Marcus RUHNAU ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

    摘要翻译： 具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。 为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。 这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于 填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。